Silicon Carbide Microsystems Technology for Extreme Environments: Opportunities for Nuclear Applications
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Reliability Roadmap for Microstructures and Micromechanical Systems
Reliability and quality issues are two of the main bottlenecks choking the effective commercialization of microsystem technology.
microsystem technology↗
Development and Application of Microfabricated Chemical Gas Sensors For Aerospace Applications
Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring and control, and fire detection. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. Sensor development for each application involves its own challenges in the fields of materials science and fabrication technology. This paper discusses the needs of space applications and the point-contact sensor technology being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, nitrogen oxides (Nox, carbon monoxide, oxygen, and carbon dioxide are being developed. A description is given of each sensor type and its present stage of development. Demonstration and application these sensor technologies will be described. The demonstrations range from use of a microsystem based hydrogen sensor on the Shuttle to engine demonstration of a nanocrystalline based sensor for NO, detection. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.
Hunter, G. W.↗
Microfabricated Chemical Gas Sensors and Sensor Arrays for Aerospace Applications
Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring, and fire detection. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors; 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity; 3) The development of high temperature semiconductors, especially silicon carbide. This presentation discusses the needs of space applications as well as the point-contact sensor technology and sensor arrays being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, nitrogen oxides (NO,), carbon monoxide, oxygen, and carbon dioxide are being developed as well as arrays for leak, fire, and emissions detection. Demonstrations of the technology will also be discussed. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.
Hunter, Gary W.↗
Development of Microfabricated Chemical Gas Sensors and Sensor Arrays for Aerospace Applications
Aerospace applications require the development of chemical sensors with capabilities beyond those of commercially available sensors. In particular, factors such as minimal sensor size, weight, and power consumption are particularly important. Development areas which have potential aerospace applications include launch vehicle leak detection, engine health monitoring, fire detection, and environmental monitoring. Sensor development for these applications is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. However, due to issues of selectivity and cross-sensitivity, individual sensors are limited in the amount of information that they can provide in environments that contain multiple chemical species. Thus, sensor arrays are being developed to address detection needs in such multi-species environments. This paper discusses the needs of space applications as well as the point-contact sensor technology and sensor arrays being developed to address these needs. Sensors to measure hydrogen, hydrocarbons, hydrazine, nitrogen oxides (NO,), carbon monoxide, oxygen, and carbon dioxide are being developed as well as arrays for leak, fire, and emissions detection. Demonstrations of the technology will also be discussed. It is concluded that microfabricated sensor technology has significant potential for use in a range of aerospace applications.
Hunter, G. W.↗
Microfabricated Chemical Sensors for Aerospace Fire Detection Applications
The detection of fires on-board commercial aircraft is extremely important for safety reasons. Although dependable fire detection equipment presently exists within the cabin, detection of fire within the cargo hold has been less reliable and susceptible to false alarms. A second, independent method of fire detection to complement the conventional smoke detection techniques, such as the measurement of chemical species indicative of a fire, will help reduce false alarms and improve aircraft safety. Although many chemical species are indicative of a fire, two species of particular interest are CO and CO2. This paper discusses microfabricated chemical sensor development tailored to meet the needs of fire safety applications. This development is based on progress in three types of technology: 1) Micromachining and microfabrication (Microsystem) technology to fabricate miniaturized sensors. 2) The use of nanocrystalline materials to develop sensors with improved stability combined with higher sensitivity. 3) The development of high temperature semiconductors, especially silicon carbide. The individual sensor being developed and their level of maturity will be presented.
Hunter, Gary W.↗
New Effective Material Couple--Oxide Ceramic and Carbon Nanotube-- Developed for Aerospace Microsystem and Micromachine Technologies
The prime driving force for using microsystem and micromachine technologies in transport vehicles, such as spacecraft, aircraft, and automobiles, is to reduce the weight, power consumption, and volume of components and systems to lower costs and increase affordability and reliability. However, a number of specific issues need to be addressed with respect to using microsystems and micromachines in aerospace applications--such as the lack of understanding of material characteristics; methods for producing and testing the materials in small batches; the limited proven durability and lifetime of current microcomponents, packaging, and interconnections; a cultural change with respect to system designs; and the use of embedded software, which will require new product assurance guidelines. In regards to material characteristics, there are significant adhesion, friction, and wear issues in using microdevices. Because these issues are directly related to surface phenomena, they cannot be scaled down linearly and they become increasingly important as the devices become smaller. When microsystems have contacting surfaces in relative motion, the adhesion and friction affect performance, energy consumption, wear damage, maintenance, lifetime and catastrophic failure, and reliability. Ceramics, for the most part, do not have inherently good friction and wear properties. For example, coefficients of friction in excess of 0.7 have been reported for ceramics and ceramic composite materials. Under Alternate Fuels Foundation Technologies funding, two-phase oxide ceramics developed for superior high-temperature wear resistance in NASA's High Operating Temperature Propulsion Components (HOTPC) project and new two-layered carbon nanotube (CNT) coatings (CNT topcoat/iron bondcoat/quartz substrate) developed in NASA's Revolutionary Aeropropulsion Concepts (RAC) project have been chosen as a materials couple for aerospace applications, including micromachines, in the nanotechnology lubrication task because of their potential for superior friction and wearf properties in air and in an ultrahigh vacuum, spacelike environment. At the NASA Glenn Research Center, two-phase oxide ceramic eutectics, Al2O3/ZrO2(Y2O3), were directionally solidified using the laser-float-zone process, and carbon nanotubes were synthesized within a high-temperature tube furnace at 800 C. Physical vapor deposition was used to coat all quartz substrates with 5-nm-thick iron as catalyst and bondcoat, which formed iron islands resembling droplets and serving as catalyst particles on the quartz. A series of scanning electron micrographs showing multiwalled carbon nanotubes directionally grown as aligned "nanograss" on quartz is presented. Unidirectional sliding friction eperiments were conducted at Glenn with the two-layered CNT coatings in contact with the two-phase Al2O3/ZrO2(Y2O3) eutectics in air and in ultrachigh vacuum. The main criteria for judging the performance of the materials couple for solid lubrication and antistick applications in a space environment were the coefficient of friction and the wear resistance (reciprocal of wear rate), which had to be less than 0.2 and greater than 10(exp 5) N(raised dot)/cubic millimetes, respectively, in ultrahigh vacuum. In air, the coefficient of friction for the CNT coatings in contact with Al2O3/ZrO2 (Y2O3) eutectics was 0.04, one-fourth of that for quartz. In an ultrahigh vacuum, the coefficient of friction for CNT coatings in contact with Al2O3/ZrO2 (Y2O3) was one-third of that for quartz. The two-phase Al2O3/ZrO2 (Y2O3) eutectic coupled with the two-layered CNT coating met the coefficient of friction and wear resistance criteria both in air and in an ultrahigh vacuum, spacelike environment. This material's couple can dramatically improve the stiction (or adhesion), friction, and wear resistance of the contacting surfaces, which are major issues for microdevices and micromachines.
Miyoshi, Kazuhisa↗
System Model for MEMS based Laser Ultrasonic Receiver
A need has been identified for more advanced nondestructive Evaluation technologies for assuring the integrity of airframe structures, wiring, etc. Laser ultrasonic inspection instruments have been shown to detect flaws in structures. However, these instruments are generally too bulky to be used in the confined spaces that are typical of aerospace vehicles. Microsystems technology is one key to reducing the size of current instruments and enabling increased inspection coverage in areas that were previously inaccessible due to instrument size and weight. This paper investigates the system modeling of a Micro OptoElectroMechanical System (MOEMS) based laser ultrasonic receiver. The system model is constructed in software using MATLAB s dynamical simulator, Simulink. The optical components are modeled using geometrical matrix methods and include some image processing. The system model includes a test bench which simulates input stimuli and models the behavior of the material under test.
Wilson, William C.↗
The Development of Metal Oxide Chemical Sensing Nanostructures
This paper discusses sensor development based on metal oxide nanostructures and microsystems technology. While nanostructures such as nanowires show significant potential as enabling materials for chemical sensors, a number of significant technical challenges remain. This paper discusses development to address each of these technical barriers: 1) Improved contact and integration of the nanostructured materials with microsystems in a sensor structure; 2) Control of nanostructure crystallinity to allow control of the detection mechanism; and 3) Widening the range of gases that can be detected by fabricating multiple nanostructured materials. A sensor structure composed of three nanostructured oxides aligned on a single microsensor has been fabricated and tested. Results of this testing are discussed and future development approaches are suggested. It is concluded that while this work lays the foundation for further development, these are the beginning steps towards realization of repeatable, controlled sensor systems using oxide based nanostructures.
Hunter, G. W.↗
A Brief Overview of NASA Glenn Research Center Sensor and Electronics Activities
Aerospace applications require a range of sensing technologies. There is a range of sensor and sensor system technologies being developed using microfabrication and micromachining technology to form smart sensor systems and intelligent microsystems. Drive system intelligence to the local (sensor) level -- distributed smart sensor systems. Sensor and sensor system development examples: (1) Thin-film physical sensors (2) High temperature electronics and wireless (3) "lick and stick" technology. NASA GRC is a world leader in aerospace sensor technology with a broad range of development and application experience. Core microsystems technology applicable to a range of application environmentS.
Hunter, Gary W.↗
Packaging Technology Developed for High-Temperature Silicon Carbide Microsystems
High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as sensors and electronics for space missions to the inner solar system, sensors for in situ combustion and emission monitoring, and electronics for combustion control for aeronautical and automotive engines. However, these devices cannot be used until they can be packaged in appropriate forms for specific applications. Suitable packaging technology for operation temperatures up to 500 C and beyond is not commercially available. Thus, the development of a systematic high-temperature packaging technology for SiC-based microsystems is essential for both in situ testing and commercializing high-temperature SiC sensors and electronics. In response to these needs, researchers at Glenn innovatively designed, fabricated, and assembled a new prototype electronic package for high-temperature electronic microsystems using ceramic substrates (aluminum nitride and aluminum oxide) and gold (Au) thick-film metallization. Packaging components include a ceramic packaging frame, thick-film metallization-based interconnection system, and a low electrical resistance SiC die-attachment scheme. Both the materials and fabrication process of the basic packaging components have been tested with an in-house-fabricated SiC semiconductor test chip in an oxidizing environment at temperatures from room temperature to 500 C for more than 1000 hr. These test results set lifetime records for both high-temperature electronic packaging and high-temperature electronic device testing. As required, the thick-film-based interconnection system demonstrated low (2.5 times of the room-temperature resistance of the Au conductor) and stable (decreased 3 percent in 1500 hr of continuous testing) electrical resistance at 500 C in an oxidizing environment. Also as required, the electrical isolation impedance between printed wires that were not electrically joined by a wire bond remained high (greater than 0.4 GW) at 500 C in air. The attached SiC diode demonstrated low (less than 3.8 W/mm2) and relatively consistent dynamic resistance from room temperature to 500 C. These results indicate that the prototype package and the compatible die-attach scheme meet the initial design standards for high-temperature, low-power, and long-term operation. This technology will be further developed and evaluated, especially with more mechanical tests of each packaging element for operation at higher temperatures and longer lifetimes.
Chen, Liang-Yu↗
NASA/University JOint VEnture (JOVE) Program. VIXEN(tm): Object-Oriented, Technology-Adaptive, Virtual Information Exchange Environment
Vixen is a collection of enabling technologies for uninhibited distributed object computing. In the Spring of 1995 when Vixen was proposed, it was an innovative idea very much ahead of its time. But today the technologies proposed in Vixen have become standard technologies for Enterprise Computing. Sun Microsystems J2EE/EJB specifications, among others, are independently proposed technologies of the Vixen type. I have brought Vixen completely under the J2EE standard in order to maximize interoperability and compatibility with other computing industry efforts. Vixen and the Enterprise JavaBean (EJB) Server technologies are now practically identical; OIL, another Vixen technology, and the Java Messaging System (JMS) are practically identical; and so on. There is no longer anything novel or patentable in the Vixen work performed under this grant. The above discussion, notwithstanding, my independent development of Vixen has significantly helped me, my university, my students and the local community. The undergraduate students who worked with me in developing Vixen have enhanced their expertise in what has become the cutting edge technology of their industry and are therefore well positioned for lucrative employment opportunities in the industry. My academic department has gained a new course: "Multi-media System Development", which provides a highly desirable expertise to our students for employment in any enterprise today. The many Outreach Programs that I conducted during this grant period have exposed local Middle School students to the contributions that NASA is making in our society as well as awakened desires in many such students for careers in Science and Technology. I have applied Vixen to the development of two software packages: (a) JAS: Joshua Application Server - which allows a user to configure an EJB Server to serve a J2EE compliant application over the world wide web; (b) PCM: Professor Course Manager: a J2EE compliant application for configuring a course for distance learning. These types of applications are, however, generally available in the industry today.
Anyiwo, Joshua C.↗
Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems
A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.
Chen, Liang-Yu↗
Recent Developments in Microsystems Fabricated by the Liga-Technique
As an example of microsystems fabricated by the LIGA-technique (x-ray lithography, electroplating and molding), three systems are described and characterized: a triaxial acceleration sensor system, a micro-optical switch, and a microsystem for the analysis of pollutants. The fabrication technologies are reviewed with respect to the key components of the three systems: an acceleration sensor, and electrostatic actuator, and a spectrometer made by the LIGA-technique. Aa micro-pump and micro-valve made by using micromachined tools for molding and optical fiber imaging are made possible by combining LIGA and anisotropic etching of silicon in a batch process. These examples show that the combination of technologies and components is the key to complex microsystems. The design of such microsystems will be facilitated is standardized interfaces are available.
Schulz, J.↗
A Distributed Prognostic Health Management Architecture
This paper introduces a generic distributed prognostic health management (PHM) architecture with specific application to the electrical power systems domain. Current state-of-the-art PHM systems are mostly centralized in nature, where all the processing is reliant on a single processor. This can lead to loss of functionality in case of a crash of the central processor or monitor. Furthermore, with increases in the volume of sensor data as well as the complexity of algorithms, traditional centralized systems become unsuitable for successful deployment, and efficient distributed architectures are required. A distributed architecture though, is not effective unless there is an algorithmic framework to take advantage of its unique abilities. The health management paradigm envisaged here incorporates a heterogeneous set of system components monitored by a varied suite of sensors and a particle filtering (PF) framework that has the power and the flexibility to adapt to the different diagnostic and prognostic needs. Both the diagnostic and prognostic tasks are formulated as a particle filtering problem in order to explicitly represent and manage uncertainties; however, typically the complexity of the prognostic routine is higher than the computational power of one computational element ( CE). Individual CEs run diagnostic routines until the system variable being monitored crosses beyond a nominal threshold, upon which it coordinates with other networked CEs to run the prognostic routine in a distributed fashion. Implementation results from a network of distributed embedded devices monitoring a prototypical aircraft electrical power system are presented, where the CEs are Sun Microsystems Small Programmable Object Technology (SPOT) devices.
Bhaskar, Saha↗
A Multi-Mission Testbed for Advanced Technologies
The mission of the Center for Space Integrated Microsystem (CSIM) at the Jet Propulsion Laboratory is to develop advanced avionics systems for future deep space missions. The Advanced Micro Spacecraft (AMS) task is building a multi-mission testbed facility to enable the infusion of CSIM technologies into future missions. The testbed facility will also perform experimentation for advanced avionics technologies and architectures to meet challenging power, performance, mass, volume, reliability, and fault tolerance of future missions. The testbed facility has two levels of testbeds: (1) a Proof-of-Concept (POC) Testbed and (2) an Engineering Model Testbed. The methodology of the testbed development and the process of technology infusion are presented in a separate paper in this conference. This paper focuses only on the design, implementation, and application of the POC testbed. Additional information is contained in the original extended abstract.
Chau, S. N.↗
Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects
Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.
Body of Knowledge (BOK)↗
Microsystems, Space Qualified Electronics and Mobile Sensor Platforms for Harsh Environment Applications and Planetary Exploration
NASA Glenn Research Center is presently developing and applying a range of sensor and electronic technologies that can enable future planetary missions. These include space qualified instruments and electronics, high temperature sensors for Venus missions, mobile sensor platforms, and Microsystems for detection of a range of chemical species and particulates. A discussion of each technology area and its level of maturity is given. It is concluded that there is a strong need for low power devices which can be mobile and provide substantial characterization of the planetary environment where and when needed. While a given mission will require tailoring of the technology for the application, basic tools which can enable new planetary missions are being developed.
Hunter, Gary W.↗