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Results for “microtechnology computers multiprocessing packaging fault tolerance”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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The Application of Microtechnology to Spacecraft On-Board Computing(abstract)

In this report, we will survey recent advances in chip packaging and stacking techniques that allow miniature computers to be developed for space applications. Several orders of magnitude reduction in mass, volume, and power consumption are possible using these techniques. Moreover, performance improvements can be achieved by increasing the scale of multiprocessing. Most importantly, long-term survivability can potentially be improved by increasing the level of redundancy and fault tolerance.

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