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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Stabilizers for a vehicle cooling module

A stabilizing arrangement of a cooling system module of a vehicle includes stabilizer pins attached to the vehicle cooling system module. Stabilizer slots are incorporated into a component of the chassis of the vehicle, such as a frame extender. The stabilizer slots may be formed as an upwards opening U-shape. Bushings are attached to the stabilizer pins. The stabilizer pins and bushings extend laterally into and engage with the stabilizer slots. Upon installation, the stabilizer pins and bushings are aligned with the stabilizer slots as the cooling system module is lowered onto the ISO mounts. The stabilizer pins and bushings slide vertically downwards into the stabilizer slots as the cooling system module is lowered into place. The simpler stabilizer pins, bushings, and stabilizer slots thereby take the place of expensive, time consuming, complex, labor intensive, and space consuming stay rod arrangements.

Wu, Shouhao↗

Passive thermosyphon solar heating and cooling module with supplementary heating

A collection of three quarterly reports from Sigma Research, Inc., covering progress and status from January through September 1977 are presented. Three heat exchangers are developed for use in a solar heating and cooling system for installation into single-family dwellings. Each exchanger consists of one heating and cooling module and one submerged electric water heating element.

Source record↗

Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink

The next generation of integrated power electronics packages will implement wide-bandgap devices with ultrahigh device heat fluxes. Although jet impingement has received attention for power electronics thermal management, it is not used in commercial electric vehicles (EVs) because of the associated pressure drop and reliability concerns. Here, in this paper, we present a modular thermal management system designed for automotive power electronics. The system achieves superior thermal performance to benchmarked EVs, while adhering to reliability standards and with low pumping power. The system utilizes a low-cost and lightweight plastic manifold to generate jets over an optimized heat sink, which is embedded in the direct-bonded-copper (DBC) substrate. The embedded heat sink concept leverages additive manufacturing to add elliptical pin fins to the DBC substrate. The heat sink geometry is optimized for submerged jet impingement using a unit-cell model and an exhaustive search algorithm. The model predictions are validated using unit-cell experiments. A full-scale power module model is then used to compare the DBC-embedded heat sink against direct DBC cooling and baseplate-integrated heat sinks for single-sided (SS) and double-sided (DS) cooling concepts. Using the SS and DS DBC-embedded cooling concepts, the models predict a thermal resistance that represents a reduction of 75% and 85% compared to the 2015 BMW i3, respectively, for the same water-ethylene glycol inverter flow rate. We have shown that an inverter with a 100-kilo-Watt-per-liter power density is achievable with the proposed design.

33 ADVANCED PROPULSION SYSTEMS↗

Development of a Turn Key Cryogenic Cooling Module for Space Flight Based on a Commercial Cryocooler

Commercial cryocoolers have significant price and lead time advantages over coolers built exclusively for the space market, but there are many challenges that must be overcome before using a COTS cooler for flight. The initial cost advantage is significantly narrowed by the cost of adapting the COTS cooler for flight. JPL is developing a “turnkey” cryogenic cooling solution based on a commercial cryocooler with the intention that it can become a standard product. The goal is to develop a complete, fully redundant cryogenic cooling solution based on the Thales 9310. The system includes the cooler, brackets to provide mounting and cooling, supporting structures, vibration isolation, thermal straps, thermal switches, and drive electronics. This paper discusses qualification of the various components for flight, including launch vibration and thermal performance testing, as well as a full up testing of the completed assembly.

Ramsey, Perry G.↗

Development of a Turn Key Cryogenic Cooling Module for Space Flight Based on a Commercial Cryocooler

Commercial cryocoolers have significant price and lead time advantages over coolers built exclusively for the space market, but there are many challenges that must be overcome before using a COTS cooler for flight. The initial cost advantage is significantly narrowed by the cost of adapting the COTS cooler for flight. JPL is developing a “turn key” cryogenic cooling solution based on a commercial cryocooler with the intention that it can become a standard product. The goal is to develop a complete, fully redundant cryogenic cooling solution based on the Thales 9310. The system includes the cooler, brackets to provide mounting and cooling, supporting structures, vibration isolation, thermal straps, thermal switches, and drive electronics. This paper discusses qualification of the various components for flight, including launch vibration and thermal performance testing, as well as a full up testing of the completed assembly.

Ramsey, Perry G.↗

Effects of Encapsulant Properties on the Thermo-Mechanical Reliability of Double-Side Cooled Power Modules for Traction Inverters

Double-side cooled power modules are being developed for next-generation traction inverters due to their better heat extraction, lower profile, and lower parasitic inductances. However, due to their rigid structure, they cause reliability concerns arising from high thermo-mechanical stresses at the interconnection joints in the module. In this work, a materials-based approach using rigid encapsulants is presented for reducing thermo-mechanical fatigue. Finite-element thermo- mechanical simulations were performed to examine the effects of the elastic modulus and coefficient of thermal expansion of epoxy- based encapsulants on the bond deformation inside a double-side cooled power module. It was found that a rigid encapsulant with a high modulus of 6.0 GPa or above and a coefficient of thermal expansion around 20 ppm/oC would improve the thermo- mechanical reliability of double-side cooled power modules by decreasing the permanent bond deformation inside the modules by 50-60%.

ADVANCED PROPULSION SYSTEMS↗

Real-Time Closed Loop Modulated Turbine Cooling

It has been noted by industry that in addition to dramatic variations of temperature over a given blade surface, blade-to-blade variations also exist despite identical design. These variations result from manufacturing variations, uneven wear and deposition over the life of the part as well as limitations in the uniformity of coolant distribution in the baseline cooling design. It is proposed to combine recent advances in optical sensing, actuation, and film cooling concepts to develop a workable active, closed-loop modulated turbine cooling system to improve by 10 to 20 the turbine thermal state over the flight mission, to improve engine life and to dramatically reduce turbine cooling air usage and aircraft fuel burn. A reduction in oxides of nitrogen (NOx) can also be achieved by using the excess coolant to improve mixing in the combustor especially for rotorcraft engines. Recent patents filed by industry and universities relate to modulating endwall cooling using valves. These schemes are complex, add weight and are limited to the endwalls. The novelty of the proposed approach is twofold 1) Fluidic diverters that have no moving parts are used to modulate cooling and can operate under a wide range of conditions and environments. 2) Real-time optical sensing to map the thermal state of the turbine has never been attempted in realistic engine conditions.

turbines↗

Transmissive concentrated photovoltaic module with cooling system

A spectrum splitting, transmissive concentrating photovoltaic (tCPV) module is proposed and designed for a hybrid photovoltaic-solar thermal (PV/T) system. The system may be able to fully utilize the full spectrum of incoming sunlight. By utilizing III-V triple junction solar cells with bandgaps of approximately 2.1 eV, 1.7 eV, and 1.4 eV in the module, ultraviolet (UV) and visible light (in-band light) are absorbed and converted to electricity, while infrared (IR) light (out-of-band light) passes through and is captured by a solar thermal receiver and stored as heat. The stored heat energy may be dispatched as electricity or process heat as needed. The tCPV module may have an overall power conversion efficiency exceeding 43.5% for above bandgap (in-band) light under a standard AM1.5D solar spectrum with an average concentration ratio of 400 suns. Passive and/or active cooling methods may be used to keep cells below 110° C. while transmitting >75% of out-of-band light to the thermal receiver, which may attain thermal energy capture at temperatures as high as 500° C. or more. A transparent active cooling system may improve the CPV module efficiency by about 1% (absolute) relative to a passive cooling system by reducing the maximum cell working temperature by about 16° C.

Escarra, Matthew David↗

MFVI Energy Efficiency Audit Training Module 3.1: Cooling Systems [Slides]

This slide deck is designed to help trained energy efficiency professionals conduct an energy efficiency audit for commercial and industrial buildings, particularly for micro-, small-, and medium-sized businesses in Mexico. This training module is focused on cooling systems. As such, it will assist its user in determining the optimal cooling system for a given space and then identifying the most efficient means of delivering that system.

21CPP↗

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

Abstract Silicon-Carbide (SiC) power devices have become a promising option for traditional Silicon (Si) due to the superior material properties. To fully take advantage of the SiC devices, a high-performance power device packaging solution is necessary. This study proposes a cost-effective double-sided cooled (DSC) 1.2 kV SiC half-bridge power module using organic epoxy-resin composite dielectric (ERCD) substrates. The high mechanical and thermal performance of the power module is achieved by the low-modulus, moderate thermal conductivity, and relatively thin (120 μm) layer of ERCD material compared with traditional metal-clad ceramic approaches. This novel organic dielectric can withstand high voltage (5 kV @ 120 μm) and operate up to 250°C continuously, which is indispensable for high power applications. The thermal modeling results show that the equivalent thermal resistance junction-to-case (Rjc_eq) of the DSC power module using dual direct bonded copper (DBC) is 17% higher than the dual ERCD configuration. Furthermore, a non-insulated DSC power module concept is proposed for maximizing thermal performance by considering thermal vias in the ERCD substrate and direct-soldered heat sink. A thought process for optimization of thermal via design is demonstrated and it shows up to 24% of improvement on thermal performance compared with the insulated DSC power module.

Double-sided cooling, epoxy-resin composite dielec↗

Thermal and Reliability Characterization of an Epoxy Resin-Based Double-Side Cooled Power Module

Wide-Band Gap (WBG) power devices have become a promising option for high-power applications due to the superior material properties over traditional Silicon. To not limit WBG devices’ mother nature, a rugged and high-performance power device packaging solution is necessary. This study proposes a Double-Side Cooled (DSC) 1.2 kV half-bridge power module having dual epoxy resin insulated metal substrate (eIMS) for solving convectional power module challenges and providing a cost-effective solution. The thermal performance outperforms traditional Alumina (Al2O3) Direct Bonded Copper (DBC) DSC power module due to moderate thermal conductivity (10 W/mK) and thin (120 mm) epoxy resin composite dielectric working as the IMS insulation layer. This novel organic dielectric can withstand high voltage (5 kVAC @ 120 μm) and has a Glass Transition Temperature (Tg) of 300°C, which is suitable for high-power applications. In the thermal-mechanical modeling, the organic DSC power module can pass the thermal cycling test over 1,000 cycles by optimizing the mechanical properties of the encapsulant material. In conclusion, this article not only proposes a competitive organic-based power module but also a methodology of evaluation for thermal and mechanical performance.

42 ENGINEERING↗

Thermal-Fluid Analysis of a Liquid-Cooled Battery Module for Electrified Aircraft

The development of safe, energy-dense batteries is critical to advancing hybrid electric and fully electrified aircraft propulsion. Achieving this capability requires a thermal management system that can maintain battery performance and safety under demanding operational conditions. The objective of this project is to support the maturation of next-generation lithium-ion batteries for electrified aircraft by conducting performance testing on integrated battery modules, specifically a 2-cell series configuration module housed within an aluminum enclosure. Designed to operate at a nominal 7.2 V with discharge rates up to 2.5C, the module will eventually be used to power an electric motor and DC-DC converter, generating substantial thermal loads that must be effectively managed to increase the usable energy and power density of electrified aircraft. To address these thermal challenges, this study presents the development and thermal-fluid analysis of a liquid-cooled thermal management system. While the full aircraft architecture utilizes an eight-string configuration, the present work evaluates a representative single-string water coolant loop to characterize baseline performance. The active cooling loop circulates water through a reservoir, pump, the battery module, and a variable area flow meter. Key performance metrics including component-level temperatures, mass flow rates, and pressure drops are quantified across the loop. Across discharge rates ranging from 0.5C to 2.5C, the active thermal loop consistently and effectively removed heat from the module, validating the design approach and confirming readiness for further development. The validated thermal performance indicates a path toward scalable battery modules that could enable energy and power dense systems for hybrid electric aircraft.

Electrified Aircraft↗

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Preliminary design package for maxi-therm heat exchanger module

Heat exchangers were developed for use in a solar heating and cooling system installed in a single family dwelling. Each of the three exchangers consisted of a heating and cooling module and a submersed electric water heating element. Information necessary to evaluate the preliminary design of the heat exchanger is presented in terms of the development and verification plans, performance specifications, installation and maintenance, and hazard analysis.

Source record↗

Catastrophic Cooling in Superwinds. III. Nonequilibrium Photoionization

Observations of some starburst-driven galactic superwinds suggest that strong radiative cooling could play a key role in the nature of feedback and the formation of stars and molecular gas in star-forming galaxies. These catastrophically cooling superwinds are not adequately described by adiabatic fluid models, but they can be reproduced by incorporating nonequilibrium radiative cooling functions into the fluid model. In this work, we have employed the atomic and cooling module maihem implemented in the framework of the flash hydrodynamics code to simulate the formation of radiatively cooling superwinds as well as their corresponding nonequilibrium ionization (NEI) states for various outflow parameters, gas metallicities, and ambient densities. We employ the photoionization program cloudy to predict radiation- and density-bounded photoionization for these radiatively cooling superwinds, and we predict UV and optical line emission. Our nonequilibrium photoionization models built with the NEI states demonstrate the enhancement of C iv, especially in metal-rich, catastrophically cooling outflows, and O vi in metal-poor ones.

Cooling flows↗