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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Slow-Light Mid-IR Silicon Photonic Chips for NO 2 and CH 4 Gas Detection

A compact, chip-scale mid-infrared gas sensor is demonstrated, leveraging a two-dimensional photonic crystal waveguide (PCW) fabricated on a silicon-on-insulator (SOI) platform. The PCW comprises a hexagonal lattice with lattice constant a = 860 nm and hole radius r = 0.22a, incorporating a central line defect of reduced-radius holes (r s = 0.7r) to induce slow-light propagation near the photonic band edge with a group index of approximately 73, thereby enhancing light-matter interaction. The sensor operates at fundamental absorption wavelengths of 3.42 μm for nitrogen dioxide (NO 2 ) and 3.40 μm for methane (CH 4 ), utilizing the strongest molecular vibrational transitions for maximum sensitivity. Experimental validation was conducted using dynamically diluted gas mixtures generated by mass flow controllers, with signal acquisition performed by a liquid nitrogen-cooled InSb detector. For NO 2 , the sensor exhibited excellent linear response over 5–25 ppm (part per million) with coefficient of determination R 2 = 0.9934, achieving a detection limit of 210 ppb (part per billion)─representing the first reported silicon photonic-based NO 2 detection. For CH 4 , exposure to 25 ppm resulted in a 6.4% decrease in transmitted intensity, demonstrating multigas sensing capability. The CMOS-compatible fabrication process and compact 3 mm device footprint establish this SOI-PCW platform as a scalable, low-power solution for integrated mid-infrared gas sensing, with significant potential for environmental monitoring and industrial safety applications.

Crystals↗
DOE OSTI2025

Scalable low-loss cryogenic packaging of quantum memories in CMOS-foundry processed photonic chips

Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.

Bernson, Robert [Tyndall National Institute, Cork ↗
DOE OSTI2024

On-PIC Light Source Integration & Micro-dispensing of Solder Paste for Flip Chip Application

To reach the next level benefits of photonic integrated circuits (PICs), the Integrated Photonic Systems Roadmap-International describes the necessity of either heterogeneous or hybrid integration of light sources [1]. A new approach for hybrid integration is Photonic Wire Bonding where 3D nanolithography is used to pattern a polymer waveguide that connects light sources to PIC waveguides. The waveguides resemble electrical wire bonds and essentially do the same as their electrical counterpart for packaging photonic chips together. In order to reap the full benefits of a photonic wire bonds, the light source must be carefully packaged. In this work I seek to expand RIT’s photonic packaging capability by establishing a packaging process to integrate light sources, specifically an Indium Phosphide distributed feedback lasers and a reflective semiconductor optical amplifiers, directly onto a photonic integrated circuits. Another necessary requirement for PIC packaging is densely integrated electrical connectivity. In this thesis I developed a fine pitch flip chip interconnect technique demonstrated using gold stud bumps in conjunction with micro-dispensed solder paste. This work opens the door to high density photonic flip chip applications. The micro-dispensed solder paste dots having diameters 50-125 µm are currently being tested at a pitch of 150 µm . The gold stud bumps are formed with 1mil gold wire creating bumps with a diameter of 40-60 µm depending on specific parameter values. These capabilities will allow RIT to assemble and test novel photonic integrated devices, cutting down on the time and cost associated with third party assembly and tests facilities. Thereby keeping RIT at the forefront of photonic research.

Wongk, Nicole↗
NASA NTRSDate not supplied

Photonic Source for Binary Source Simulations

More than half of the sun-like stars are in binary systems or have companions that hinder the search for planets around them using traditional technologies. There are only 69 FGK dwarfs within ten pc that can harbor true earth analogs. Direct imaging can detect and study the habitability of those targets measuring the chemical composition of the atmosphere, and astrometry can measure the planet's mass. We use Multi-Star Wavefront Control (MSWC), a technique that removes stellar leakage from both stellar components to enable direct imaging of binary systems. Currently, there is a technology demonstration experiment of MSWC for the Roman coronagraph instrument at the High Contrast Imaging Testbeds operated at JPL. One of the challenges for this experiment is to produce a binary source where both stars are incoherent with each other at close physical separation. On the other hand, to measure masses, it is possible to obtain relative astrometry measurements between the binary. The TOLIMAN concept proposes to use a diffractive pupil to calibrate the distortion and detector effects to reach 1uas astrometric accuracy. JPL currently has a laboratory to demonstrate this technology, which faces the same challenge as the MSWC project of producing two incoherent nearby sources. We developed Photonic Chips with multiple waveguides in Silicon Nitride for both projects to create incoherent single sources as close as 15um. In this paper, we present the concept application, the chips design, and the first results.

photonic chips↗
NASA NTRS2016

Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.

Body of Knowledge (BOK)↗
DOE OSTI2024

An integrated atom array-nanophotonic chip platform with background-free imaging

Arrays of neutral atoms trapped in optical tweezers have emerged as a leading platform for quantum information processing and quantum simulation due to their scalability, reconfigurable connectivity, and high-fidelity operations. Individual atoms are promising candidates for quantum networking due to their capability to emit indistinguishable photons that are entangled with their internal atomic states. Integrating atom arrays with photonic interfaces would enable distributed architectures in which nodes hosting many processing qubits could be efficiently linked together via the distribution of remote entanglement. However, many atom array techniques cease to work in close proximity to photonic interfaces, with atom detection via standard fluorescence imaging presenting a major challenge due to scattering from nearby photonic devices. Here, we demonstrate an architecture that combines atom arrays with up to 64 optical tweezers and a millimeter-scale photonic chip hosting more than 100 nanophotonic cavities. We achieve high-fidelity ( ~ 99.2%), background-free imaging in close proximity to nanofabricated cavities using a multichromatic excitation and detection scheme. The atoms can be imaged while trapped a few hundred nanometers above the dielectric surface, which we verify using Stark shift measurements of the modified trapping potential. Finally, we rearrange atoms into defect-free arrays and load them simultaneously onto the same or multiple devices.

74 ATOMIC AND MOLECULAR PHYSICS↗
DOE OSTI2024

Mixed domain coherent link with electrically reconfigurable IMDD and coherent modes for O-band data center applications

We report the first O-band link with electrically reconfigurable intensity-modulation direct-detection (IMDD) and coherent operation using custom silicon photonic chips packaged with commercial electronic chips. Transmission below the KP4-FEC threshold is shown using commercial 53 Gbaud PAM4 digital signal processing (DSP) for 16QAM (200 Gbps/ λ ) and PAM4 (100 Gbps/ λ ). Efficient operation of the packaged full link at 12 and 11.2 pJ/bit is achieved for the PAM4 and 16QAM modes, respectively.

Misak, Stephen (ORCID:0000000154973084)↗
DOE OSTI2025

On-chip pulse shaping of entangled photons

The miniaturization of optical systems via integrated photonics is critical to the ultimate scalability and performance of photonic quantum processors, yet many longstanding optical signal processing capabilities—such as Fourier-transform pulse shaping—remain unrealized on chip. In this work, we demonstrate on-chip spectral shaping of entangled photons using a multichannel microring-resonator-based silicon photonic pulse shaper. Achieving line-by-line phase control on a 3 GHz grid for two frequency-bin-entangled qudits, the pulse shaper's fine spectral resolution enables control of nanosecond-scale temporal features, which are observed by direct coincidence detection of biphoton correlation functions that show excellent agreement with theory. This work marks a demonstration of biphoton pulse shaping using an integrated spectral shaper and holds significant promise for applications in photonic quantum information processing.

Entanglement manipulation↗
DOE OSTI2025

On-chip frequency-bin quantum photonics

Abstract Frequency-bin encoding furnishes a compelling pathway for quantum information processing systems compatible with established lightwave infrastructures based on fiber-optic transmission and wavelength-division multiplexing. Yet although significant progress has been realized in proof-of-principle tabletop demonstrations, ranging from arbitrary single-qubit gates to controllable multiphoton interference, challenges in scaling frequency-bin processors to larger systems remain. In this Perspective, we highlight recent advances at the intersection of frequency-bin encoding and integrated photonics that are fundamentally transforming the outlook for scalable frequency-based quantum information. Focusing specifically on results on sources, state manipulation, and hyperentanglement, we envision a possible future in which on-chip frequency-bin circuits fulfill critical roles in quantum information processing, particularly in communications and networking.

electro-optic modulators↗
NASA NTRSDate not supplied

Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE)

The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid- state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.

Anthony W Yu↗
NASA NTRSDate not supplied

Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE)

The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid-state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.

Anthony W Yu↗
NASA NTRSDate not supplied

Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE)

The mid-infrared (MIR) spectral range (3-5 μm) is of particular interest for remotely sensing gaseous molecules such as H2O, CO2, CH4, N2O, CO, NH3, and other compounds. The infrared spectra of planets, moons, comets, and asteroids are rich in information, including gas composition and surface mineralogy. Significant advances in technology have emerged for ground-based telescopes, including the higher spectral resolution permitted by cross-dispersed instruments and heterodyne techniques. New technologies offer the opportunity to break this barrier, by using solid-state photonics. In the past three years, under the NASA ROSES PICASSO program, we have been developing key components for a revolutionary MIR spectrometer: Photonic Integrated Circuit TUned for Reconnaissance and Exploration (PICTURE), which is based on integrated photonics technology that offers ultra-small size, weight, and power (SWaP) with non-moving parts and low cost for future planetary missions. In this paper, we will describe our science and technology development progress leading to demonstrating the concept and functionalities of the PICTURE instrument. The photonic integrated circuit spectrometer (PICS) of the PICTURE instrument uses an integrated heterodyne detection scheme to significantly reduce SWaP and improve sensitivity. Our program goals are to advance the building blocks needed for the PICS, which include arrayed waveguide gratings (AWGs), quantum cascade lasers (QCLs) as local oscillators, and quantum cascade detectors (QCDs) as heterodyne detectors. In addition, we are leveraging a NASA SBIR program to develop the toolsets needed to fabricate MIR photonics lanterns (PL). The PL is a critical component that enables PICTURE to bring a signal from the collecting telescope to the PICS, which requires single optical mode inputs. PICTURE focuses on the CO spectral band at 4.6-4.8 μm that is of key importance to cometary science. We also continue to explore future instrument concepts that exploit the broad wavelength potential of the PICS design to perform spectroscopy spanning the full MIR and longwave IR (LWIR) bands. This will have wide applicability in planetary science, for example, to probe the strongest CO2, H2O, and CH4 transitions that are difficult (CH4) or impossible (CO2, H2O) to detect using Earth-based telescopes due to atmospheric opacity. Each integrated-photonics-spectrometer chip will feature a single heterodyne room-temperature laser with a wide wavelength tuning range, or multiple local-oscillator lasers for much broader spectral coverage. The fully developed PICTURE instrument will provide a cost-effective, high-resolution spectrometer for future space applications.

Anthony W. Yu↗
DOE OSTI2024

CMOS photonic integrated source of broadband polarization-entangled photons

We showcase a fully on-chip CMOS-fabricated silicon photonic integrated circuit employing a bidirectionally pumped microring and polarization splitter-rotators tailored for the generation of broadband (>9 THz), high-fidelity (90–98%) polarization-entangled photons. Spanning the optical C+L-band and producing over 116 frequency-bin pairs on a 38.4-GHz-spaced grid, this source is ideal for flex-grid wavelength-multiplexed entanglement distribution in multiuser networks.

42 ENGINEERING↗
DOE OSTI2026

Optical nanofiber testbeds for benchmarking membrane-waveguide photonic integrated circuit platforms toward on-chip quantum inertial sensing

Recent advances in cold atom interferometry with optical and magnetic atom guides have set the stage for quantum inertial sensors capable of operating in dynamic environments. In this work, we present three key innovations—evanescent-field (EF) atom guides, optical nanofiber testbeds, and membrane-waveguide photonic integrated circuit (PIC) platforms—to advance EF-guided atom interferometry. First, we demonstrate EF atom guides on optical nanofiber testbeds, which serve as performance benchmarks for our membrane-waveguide PIC platforms. Second, we achieve low-power (⁠ ~ 5 mW) guiding of freely moving, laser-cooled 133 Cs atoms in two-color, traveling-wave EF optical dipole traps at the novel, heat-efficient magic wavelengths of 793 and 937 nm (i.e., “793/937-nm EF atom guides”). Concurrently, we design and fabricate membrane-waveguide PIC platforms for these EF atom guides; in our prior work, we showed that these structures safely accommodate 4–6 times the required optical trap power under vacuum and enable dense cold atom generation via magneto-optical trapping in the vicinity of the optical wavguide for efficient loading. Third, we verify preserved atomic coherence via microwave fields and EF-coupled Doppler-free Raman beams; to our knowledge, this is the first report of coherence fringes driven by co-propagating EF-coupled Raman beams with only 150 nW of total optical power. By providing a direct comparison between optical nanofiber testbeds and membrane-waveguide PIC platforms, our results lay critical groundwork for the on-chip realization of EF-guided atom interferometry and the development of fully integrated, compact, lightweight, and low-power quantum accelerometers and gyroscopes.

Orozco, Adrian [Sandia National Laboratories (SNL-↗
DOE OSTI2025

Single-Photon Generation: Materials, Techniques, and the Rydberg Exciton Frontier

Due to their quantum nature, single-photon emitters (SPE) generate individual photons in bursts or streams. They are paramount in emerging quantum technologies such as quantum key distribution, quantum repeaters, and measurement-based quantum computing. Many such systems have been reported in the last three decades, from rubidium atoms coupled to cavities to semiconductor quantum dots and color centers implanted in waveguides. This review article highlights different solid-state and atomic systems with on-demand and controlled single-photon generation. We discuss and compare the performance metrics, such as purity and indistinguishability, for these sources and evaluate their potential for different applications. Finally, a new potential single-photon source, based on the Rydberg exciton in solid-state metal oxide thin films, is introduced, where we discuss its promising features and unique advantages in fabricating quantum chips for quantum photonic applications.

71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSIC↗
DOE OSTI2025

Integrated photonic Galton board and its application for photon counting

The Galton board is a desktop probability machine traditionally used to visualize the principles of statistical physics from classical particles. Here, we demonstrate a photonic Galton board that enables on-chip observation of statistics from single-photon interference. The photonic Galton board consists of a directional coupler matrix terminated by an array of superconducting nanowire detectors to provide spatiotemporal resolution. This design also allows for photon-number-resolving capability, making it suitable for high-speed photon counting. Our results demonstrate the compatibility between single-photon detector array and photonic integrated circuits, paving the way for implementing on-chip large-scale quantum optics experiments and photonic quantum computing.

Qin, Hezheng (ORCID:0009000139348800)↗
DOE OSTI2026

Nanophotonic waveguide chip-to-world beam scanning

A seamless chip-to-world photonic interface enables broad advancements in optical ranging, display, communication, computation and quantum information science. The ideal solution enables two-dimensional scanning of a diffraction-limited beam from anywhere on a photonic integrated circuit to a large number of resolvable spots. Current beam-scanning technologies are limited by a fundamental trade-off: photonic-integrated-circuits with diffractive optics offer scalability but have poor mode quality, whereas inertially limited micromechanical scanners provide high-quality beams but lack scalable integration. Here we report a photonic ski-jump—a nanoscale waveguide monolithically integrated on a piezoelectric cantilever—to overcome these limitations. It passively curls ~90° out-of-plane within a less-than-0.1 mm 2 footprint, emits a submicrometre, broadband diffraction-limited beam, and exhibits kilohertz-rate mechanical resonances with quality factors of over 10,000. Fabricated in a volume complementary metal–oxide–semiconductor (CMOS) foundry, our device enables scalable two-dimensional beam scanning. Driven on-resonance at CMOS-level voltages, it achieves a footprint-adjusted spot rate of 68.6 mega spots s –1 mm–², exceeding state-of-the-art micro-electro-mechanical systems mirrors by more than 50-fold, which is sufficient for one million pixels at 100 Hz from an approximately 1.5 mm diameter footprint. We demonstrate full-colour image and video projection, and single-photon initialization and readout from silicon vacancy centres in diamond. Finally, by demonstrating uniformity across a 64 ski-jump array, we establish a pathway to achieving greater than one gigaspot resolution at kilohertz rates within a sub-5-cm-diameter footprint, creating a seamless optical pipeline between integrated photonic processors and the free-space world.

Displays↗
DOE OSTI2025

Incubating advances in integrated photonics with emerging sensing and computational capabilities

As photonic technologies grow in multidimensional aspects, integrated photonics holds a unique position and continuously presents enormous possibilities for research communities. Applications include data centers, environmental monitoring, medical diagnosis, and highly compact communication components, with further possibilities continuously growing. Herein, we review state-of-the-art integrated photonic on-chip sensors that operate in the visible to mid-infrared wavelength region on various material platforms. Among the different materials, architectures, and technologies leading the way for on-chip sensors, we discuss the optical sensing principles that are commonly applied to biochemical and gas sensing. Our focus is on passive optical waveguides, including dispersion-engineered metamaterial-based structures, which are essential for enhancing the interaction between light and analytes in chip-scale sensors. We harness a diverse array of cutting-edge sensing technologies, heralding a revolutionary on-chip sensing paradigm. Our arsenal includes refractive-index-based sensing, plasmonics, and spectroscopy, which forge an unparalleled foundation for innovation and precision. Furthermore, we include a brief discussion of recent trends and computational concepts, incorporating Artificial Intelligence & Machine Learning (AI/ML) and deep learning approaches over the past few years to improve the qualitative and quantitative analysis of sensor measurements.

Jain, Sourabh (ORCID:0000000279923275)↗