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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Intelligent Pixel Detectors: Towards a Radiation Hard ASIC with On-Chip Machine Learning in 28 nm CMOS

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout channels. With event rates as high as 40 MHz, these detectors will generate petabytes of data per second. To enable discovery within strict bandwidth and latency constraints, future trackers must be capable of fast, power efficient, and radiation hard data-reduction at the source. We are developing a radiation hard readout integrated circuit (ROIC) in 28nm CMOS with on-chip machine learning (ML) for future intelligent pixel detectors. We will show track parameter predictions using a neural network within a single layer of silicon and hardware tests on the first tape-outs produced with TSMC. Preliminary results indicate that reading out featurized clusters from particles above a modest momentum threshold could enable using pixel information at 40 MHz.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2025

Rad-hard readout system for Timepix3 Hybrid Pixel Detectors

The Beam Gas Ionisation (BGI) profile monitor, located in the Proton Synchrotron (PS) and Super Proton Synchrotron (SPS) at CERN, requires a radiation-tolerant readout system to transfer data from the challenging accelerator surroundings to the back-end for processing. The system needs to control and acquire data from four Timepix3 Hybrid Pixel Detectors (HPDs) located directly inside the beam pipe, a highly radioactive environment. It must ensure reliability given limited hardware access and preserve signal integrity for the high-speed data (32 channels at 320 MHz). However, due to the unavailability of a suitable rad-hard Timepix3 readout, the Beam Instrumentation PiXeL (BIPXL) readout system was designed to meet these requirements. This system employs radiation-hardened components such as the GBTx and the FEASTMP, both developed at CERN. It will be compatible with forthcoming hybrid pixel detector initiatives in similarly harsh radiation conditions.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

Detector pixel calibration of time-of-flight neutron diffractometers accelerated by machine learning

Modern time-of-flight neutron diffractometers at spallation neutron source are equipped with two dimensional detectors with fine pixelations. The flight path of neutrons from the moderator to the sample and to the detector needs to be precisely calibrated at detector pixel level using standard powders so the diffraction data from all the detector pixels can be correctly time-focused to produce high resolution diffraction peaks. The number of pixels can reach to millions which makes a single-pixel calibration process time-consuming, or even impossible, with conventional fitting routine. Here we presented a machine learning aided calibration process via a “training and predict” process by training machine learning models with the relations between the individual pixel time-of-flight diffraction pattern and fitted diffraction constant. The training models take a portion of the available pixels to predict the diffraction constants precisely and rapidly for massive pixel diffraction patterns.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2024

Radiation-Hard Smart-Pixel Detector ASIC ReadOut with Digital AI in 28nm

Detectors at future high energy colliders will face enormous technical challenges. Disentangling the unprecedented numbers of particles expected in each event will require highly granular silicon pixel detectors with billions of readout channels. With event rates as high as 40 MHz, these detectors will generate petabytes of data per second. To enable discovery within strict bandwidth and latency constraints, future trackers must be capable of fast, power efficient, and radiation hard data-reduction at the source. This effort is pursuing the co-design development of high-performance readout smart pixel ASICs for a future Phase III High Luminosity upgrade of the Large Hadron Collider. A 1.6mm2 ASIC prototype was designed by Fermilab in CMOS 28 nm bulk process and submitted for manufacturing in February 2024. It leverages the analog front-end pixel design of a previous prototype fabricated and tested in 2023, which achieved a simulated detection level of ~400e- with 30fF input capacitance. The ROIC consists of two matrices of 16×16 smart pixels, each 25×25 μm2 in size. Each smart pixel contains a charge-sensitive preamplifier with leakage current compensation and three auto-zero comparators for a 2-bit flash-type ADC. There is digital space for the integration of our fully combinatorial AI that performs momentum classification at the bunch crossing rate. The total power consumption is ∼6μW per pixel, which corresponds to ~1mW/cm2. The ASIC incorporates programmable front-end charge injection circuitry to generate pixel cluster charges during characterization. The cluster profile will be generated to duplicate hit characteristics of various momentum (pT). We will present early results from chip testing.

Parpillon, Benjamin↗
DOE OSTI2026

Electron/hadron separation with the TRD based on GaAs pixel detectors

Transition Radiation Detectors (TRDs) are widely used for particle identification in both high-energy physics and astroparticle physics. They are typically equipped with gaseous detectors. The main limitation of these types of detectors is that TR photons and ionization losses cannot be decoupled, which significantly reduces the particle separation power. Recent advancements in the development of pixel detectors based on GaAs sensors offer a unique opportunity to effectively detect TR photons and separate them from ionization losses. Such detectors represent novel devices that combine precise tracking capabilities with particle identification (PID) properties. The present work is dedicated to an experimental study of particle identification properties of the TRD prototype based on 500 μ m-thick GaAs sensor bonded to a Timepix3 chip. Studies were performed at the CERN SPS and it was shown that at a particle momentum of 20 GeV/c, the probability of misidentifying a hadron as an electron is below 10 −2 for an electron detection efficiency of 98%–99%, and it is 1 . 6⋅10 −4 for electron detection efficiency of 90%. This performance surpasses the electron/hadron rejection power of all known TRDs by an order of magnitude for the same detector length.

GaAs detectors↗
DOE OSTI2025

Testing the limits of ITkPixV2: the ATLAS inner tracker pixel detector readout chip

The ITkPixV2 chip is the final production readout chip for the ATLAS Phase 2 Inner Tracker (ITk) upgrade at the upcoming High-Luminosity LHC (HL-LHC). Due to the extraordinarily high peak luminosity at the HL-LHC of 5 × 1034 cm-1 s-1, ITkPixV2 must meet significant increases in nearly all design requirements compared to the current ATLAS Inner Detector (ID), including a 10× increase in trigger rate, a 7.5× increase in hit rate, a 3× increase in radiation tolerance, and a 12.5× decrease in pixel current draw per unit area, all while maintaining a similar power per unit area as present pixel detectors. Here we present the first measurements of the ITkPixV2 chip operated at the limits of the full chip design requirements, including in particular a measurement of the activity-induced current of the chip as a function of increasing hit rate.

Le Pottier, L↗
DOE OSTI2025

Development of a test system for data links of the ATLAS Inner Tracker (ITk) upgrade silicon pixel detector

This contribution introduces a novel test system developed to evaluate the signal transmission quality in high-speed data links for the 2026 Inner Tracker (ITk) upgrade of the ATLAS experiment. Using an FPGA-based data acquisition (DAQ) framework, the setup can run simultaneous Bit Error Rate (BER) tests for up to 64 channels and generate virtual eye diagrams, for qualifying the ∼26k electrical links at the ATLAS ITk data rate of 1.28 Gb/s. The paper includes results from system calibration, yielding its contribution to the measured losses, and preliminary results from tests of prototype and pre-production assemblies of on-detector links of the three ATLAS ITk Pixel subsystems.

47 OTHER INSTRUMENTATION↗
DOE OSTI2025

High-energy X-ray imaging with a Germanium MM-PAD hybrid pixel detector

Germanium is a high-Z sensor material with excellent energy resolution and attractive properties for high-energy photon detection. Despite its advantages, the need for cryogenic operation and challenges in the fabrication of pixelated high-purity germanium have hindered the development of segmented detectors. We report on the fabrication and performance of a germanium imaging detector with 150 μm pixel pitch hybridized to the MM-PAD ASIC. The detector was capable of high-resolution radiographic imaging and has a fast temporal response. Additionally, we describe the detector's upper operating temperature limits using both the MM-PAD and MARS ASICs, achieving stable operation up to 130 K and 190 K, respectively.

36 MATERIALS SCIENCE↗
DOE OSTI2025

A 28 nm multiply-accumulate ASIC architecture for on-chip data compression in MHz frame rate X-ray and electron pixel detectors

Modern X-ray detector systems urgently require compact, efficient, and fast data compression schemes to handle the transmission of big data from pixel arrays, enabling frame rates in the MHz regime. Here, in this work, a data compression ASIC that implements a streaming fixed-length lossy compression scheme is introduced and analyzed, proving the feasibility and benefits of on-chip compression. The compression scheme utilizes a vector matrix product logic, which performs a number of floating-point multiplications, additions, and accumulations. The logic is verified, synthesized, and shown to fit in the area resource available for the X-ray detector under study, which comprises 192 × 168 pixels each of 12-bit width, and having a total area of 20 mm× 20 mm, about 2 mm× 20 mm of which are available for the digital logic. Several system architectures, precisions, and compression ratios ranging from 100 to 250 were analyzed to pave the way for on-chip fixed-length compression (e.g., principal component analysis, singular value decomposition) and data reduction (e.g., azimuthal integration) for X-ray and electron detectors.

Data compression↗
DOE OSTI2024

Skipper-in-CMOS: Nondestructive Readout With Subelectron Noise Performance for Pixel Detectors

The Skipper-in-CMOS image sensor integrates the nondestructive readout capability of skipper charge coupled devices (Skipper-CCDs) with the high conversion gain of a pinned photodiode (PPD) in a CMOS imaging process while taking advantage of in-pixel signal processing. This allows both single photon counting as well as high frame rate readout through highly parallel processing. The first results obtained from a ${15} \times {15}~\mu $ m2 pixel cell of a Skipper-in-CMOS sensor fabricated in Tower Semiconductor’s commercial 180-nm CMOS image sensor process are presented. Measurements confirm the expected reduction of the readout noise with the number of samples down to deep subelectron noise of $0.15\text {e}^ - $ , demonstrating the charge transfer operation from the PPD and the single photon counting operation when the sensor is exposed to light. This article also discusses new testing strategies employed for its operation and characterization.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2024

Sensor response and radiation damage effects for 3D pixels in the ATLAS IBL Detector

Pixel sensors in 3D technology equip the outer ends of the staves of the Insertable B Layer (IBL), the innermost layer of the ATLAS Pixel Detector, which was installed before the start of LHC Run 2 in 2015. 3D pixel sensors are expected to exhibit more tolerance to radiation damage and are the technology of choice for the innermost layer in the ATLAS tracker upgrade for the HL-LHC programme. While the LHC has delivered an integrated luminosity of ≃ 235 fb -1 since the start of Run 2, the 3D sensors have received a non-ionising energy deposition corresponding to a fluence of ≃ 8.5 × 10 14 1 MeV neutron-equivalent cm -2 averaged over the sensor area. This paper presents results of measurements of the 3D pixel sensors' response during Run 2 and the first two years of Run 3, with predictions of its evolution until the end of Run 3 in 2025. Data are compared with radiation damage simulations, based on detailed maps of the electric field in the Si substrate, at various fluence levels and bias voltage values. These results illustrate the potential of 3D technology for pixel applications in high-radiation

47 OTHER INSTRUMENTATION↗
DOE OSTI2026

GPU-Accelerated Analytic Simulation of Sparse Ionization Signal Formation in Pixelated Projection Detector

This paper presents a GPU-accelerated simulation package, TRED, for next-generation neutrino detectors with pixelated charge readout, leveraging community-driven software ecosystems to ensure adaptability and extensibility. We introduce two generic contributions: (i) an effective-charge representation based on Gaussian quadrature rules, in which the linear- interpolation factors for the field response inside each voxel are absorbed into the effective charge, and (ii) a sparse, block- binned tensor representation that enables efficient FFT-based computation of induced signals on readout electrodes for sparsely activated detector volumes. The former captures structure inside a voxel without dense sampling, while the latter achieves low memory usage and scalable runtime, as demonstrated in bench- mark studies. The underlying data representation is applicable to large-scale detectors and to other computational problems involving sparse activity.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2025

Bare Module Testing for the CMS Vertex Detector Upgrade

The High-Luminosity LHC will continue exploring physics beyond the standard model with proton-proton collisions at ten times the luminosity of previous LHC runs. The physics program depends on precise measurements of charged particles near the beams. The CMS experiment will use layers of high-granularity hybrid silicon pixel detectors. Pixelation is achieved by bonding silicon to tiny electrodes, which are directly connected to the specially designed integrated circuit, CROCv2. Pixel detector components are in the pre-production phase, and evaluating prototypes of sensor-chip assemblies from different vendors provides quick feedback and improves reliability during production. This article presents the efforts to test the viability of bare detector assemblies using a manual probe station and electronic charge-injection methods.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2026

Robustness of the smartpixels classifier for different simulated sensor geometries and non-ideal detector conditions

Pixel tracking detectors at upcoming collider experiments will see unprecedented charged-particle densities. Real-time data reduction on the detector will enable higher granularity and faster readout, possibly enabling the use of the pixel detector in high-rate online event selection, such as the ATLAS or CMS first-level trigger systems. This data reduction can be accomplished with a neural network (NN) in the readout chip bonded with the sensor that recognizes and rejects tracks with low transverse momentum (p T ) based on the geometrical shape of the charge deposition (“cluster”). To design viable detectors for deployment, the dependence of the NN as a function of the sensor geometry, external magnetic field, irradiation, and noise must be understood. In this paper, we present first studies of the efficiency and data reduction for planar pixel sensors exploring these parameters. For the CMS HL-LHC sensor geometry, we obtain a signal efficiency of (91.9 ± 0.7)% and a data reduction of (29.7 ± 1.0)%. A smaller sensor pitch in the bending direction improves the p T discrimination, but a larger pitch can be partially compensated with detector thickness. Any accumulated radiation damage also changes the cluster shape, reducing the signal efficiency compared to the baseline by approximately 30–60% in absolute terms, but nearly all of the performance can be recovered through retraining of the network and updating the weights. Finally, the impact of noise was investigated, and retraining the network on noise-injected datasets was found to maintain performance within 6% of the baseline network trained and evaluated on noiseless data. •ASIC-compatible track-momentum classifier is robust in realistic detector conditions.•About 90% signal efficiency and 30% data reduction per layer for CMS HL-LHC geometry.•Single-layer signal efficiency increases for smaller pixel pitch or thicker sensors.•Performance with noise or after radiation damage mostly recovered by retraining.

Shekar, Danush [Illinois U., Chicago] (ORCID:00000↗
DOE OSTI2025

X-ray Computed Tomography Data of Dense Metallic Components

The data shared in here are X-ray computed tomography (XCT) scans of a hexagonal fuel nozzle in 3 sections with the Metrotom 800 system at the Manufacturing Demonstration Facility (MDF) at Oak Ridge National Laboratory. The data are used in the paper "Tomographic Sparse View Selection using the View Covariance Loss, by Lin et al. (doi:10.1109/TPAMI.2025.36000720), accepted to the international conference on computational imaging (ICCP 2025). Figures 4-7 in the paper describe the part/XCT scan. File name Descriptions: Bottom section: TCR- Single Channeled SRC L 2019-3-18 12-26-41.hdf5 Medium section: TCR- Single Channeled SRC M 2019-3-18 13-8-9.hdf5 Top section: TCR- Single Channeled SRC T 2019-3-18 13-45-39.hdf5 Each hdf5 file contains projection data, and all the relevant X-ray CT scan setting. The full list of included attributes: distance_unit: Units of all distances specified angle_unit : Units of the angles angles: Array of all angles used voxel_size_xy: Baseline recon (if any) has this voxel size in the in-plane direction voxel_size_z: Baseline recon (if any) has this voxel size in the cross-plane direction det_pixel_size_col: Size of the detector pixels in the column dimension det_pixel_size_row: Size of the detector pixels in the row dimension src_iso_dist: Source to iso-center distance iso_det_dist: Iso-center to detector distance det_angle: If the detector is rotated/tilted, this angle corresponds to that value det_row_offset: Center of rotation offset in the vertical direction det_col_offset: Center of rotation offset in the horizontal direction reconstruction: A baseline reconstruction stored as 3D array BHC params: Beam-hardening parameters - Van De Casteel Model - if it has been used to pre-process the projections We also provided a python script (hdf_io.py) that allows the user to read the relevant data from each hdf5 file.

Ziabari, Amir [Oak Ridge National Laboratory]↗
DOE OSTI2024

Smart pixel sensors: towards on-sensor filtering of pixel clusters with deep learning

Highly granular pixel detectors allow for increasingly precise measurements of charged particle tracks. Next-generation detectors require that pixel sizes will be further reduced, leading to unprecedented data rates exceeding those foreseen at the High- Luminosity Large Hadron Collider. Signal processing that handles data incoming at a rate of $\mathcal{O}$(40 MHz) and intelligently reduces the data within the pixelated region of the detector at rate will enhance physics performance at high luminosity and enable physics analyses that are not currently possible. Using the shape of charge clusters deposited in an array of small pixels, the physical properties of the traversing particle can be extracted with locally customized neural networks. In this first demonstration, we present a neural network that can be embedded into the on-sensor readout and filter out hits from low momentum tracks, reducing the detector's data volume by 57.1%–75.7%. The network is designed and simulated as a custom readout integrated circuit with 28 nm CMOS technology and is expected to operate at less than 300 μW with an area of less than 0.2 mm 2 . The temporal development of charge clusters is investigated to demonstrate possible future performance gains, and there is also a discussion of future algorithmic and technological improvements that could enhance efficiency, data reduction, and power per area.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗