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Results for “polyimides”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1979

Effect of thermal aging on the tribological properties of polyimide films and polyimide-bonded graphite fluoride films

Weight loss, adherence, friction and wear of polyimide films and polyimide-bonded graphite fluoride films applied to stainless steel disks and to 304 stainless steel thin foils were studied. The films were exposed at temperatures of 315 D, 345 D, 370 D, or 400 C for 100 hours or more and then evaluated at temperatures of 25 D, 315 D, or 345 C in atmospheres of dry or moist air. Polyimide films were found to be brittle after thermal exposure; but polyimide-bonded graphite fluoride possessed good adherence and gave low friction and wear results. Polyimide-bonded graphite fluoride films appear to be good candidates for solid lubrication applications where long thermal soaks are prevalent.

Fusaro, R. L.↗
NASA NTRS1979

Effect of thermal aging on the tribological properties of polyimide films and polyimide-bonded graphite fluoride films

The effect of thermal aging on the weight loss, adherence, friction and wear of polyimide films and polyimide-bonded graphite fluoride films applied to 440C-HT stainless steel disks and to 304 stainless steel thin foils was studied. The films were exposed at temperatures of 315, 345, 370 or 400 C for 100 hours or more and then evaluated at temperatures of 25, 315 or 345 C in atmospheres of dry or moist air. Polyimide films were found to be brittle after thermal exposure; but polyimide-bonded graphite fluoride films possessed good adherence and gave low friction and wear results. Thus, polyimide-bonded graphite fluoride films appear to be good candidates for solid lubrication applications where long thermal soaks are prevalent.

Fusaro, R. L.↗
NASA NTRS1993

Tin-polyimide and indium-polyimide thin-film composites as soft X-ray bandpass filters

A tin-polyimide and an indium-polyimide soft X-ray bandpass filter were fabricated with thicknesses of 1400 and 1750 A for the metal and polyimide components, respectively. The transmission of each filter was measured at the Stanford Synchrotron Radiation Laboratory. The transmission of the tin-polyimide filter was found to be about 40 percent for radiation with wavelengths between 60 and 80 A. The transmission of the indium-polyimide filter was greater than 40 percent between 70 and 90 A. The indium was about 5 percent more transmissive than the tin and attained a maximum transmission of about 48 percent at 76 A. Such filters have potential applications to soft X-ray telescopes that operate in this region. They might also be of interest to investigators who work with X-ray microscopes that image live biological specimens in the 23-44-A water window.

Powell, Stephen F.↗
NASA NTRS1978

Effect of thermal exposure on lubricating properties of polyimide films and polyimide-bonded graphite fluoride films

The effect of thermal exposure on the weight loss, adherence, friction, and wear properties of polyimide films and polyimide bonded graphite fluoride films was investigated. Films bonded to 304 stainless steel or 440C-HT steel were thermally exposed at temperatures of 315 ,345, 370, or 400 C for 100 hours or more and then evaluated, using a pin-on-disk machine, at temperatures of 25, 315, or 345 C in atmospheres of dry or moist air. Polyimide films were brittle after thermal exposure. Polyimide bonded graphite fluoride films had adherence and gave low friction and wear results; thus, they appear to be good candidates for solid lubrication applications where long thermal soaks are prevalent.

Fusaro, R. L.↗
NASA NTRS2001

Polyimides and Process for Preparing Polyimides Having Thermal-Oxidative Stability

Polyimides and the process for preparing polyimides having improved thermal-oxidative stability derived from the polymerization of effective amounts of one or more of the polyamines such as the aromatic diamines, one or more of the tetracarboxylic dianhydrides and a novel dicarboxylic endcap having formula with an R1 group of either hydrogen or an alkyl radical of one to four carbons, an R2 group of either OH, NH2, F, or Cl radical, an R3 group of either H, OH, NH2, F, Cl or an alkylene radical, an R4 group of either an alkyl, aryl, aryloxy, nitro, F, or Cl radical, and/or an R5 group of either H, alkyl, aryl, alkoxy, aryloxy, nitro, F, or Cl radical. The polyimides are useful particularly in the preparation of prepegs and PMR composites.

Meador, Mary Ann B.↗
NASA NTRS2001

Polyimides And Process For Preparing Polyimides Having Improved Thermal-Oxidative Stability

Polyimides and the process for preparing polyimides having improved thermal-oxidative stability derived from the polymerization of effective amounts of one or more of the polyamines such as the aromatic diamines, one or more of the tetracarboxylic dianhydrides and a novel dicarboxylic endcap having formula with an R 1 group of either hydrogen or an alkyl radical of one to four carbons, an R 2 group of either OH, NH 2 , F, or Cl radical, an R 3 group of either H, OH, NH 2 , F, Cl or an alkylene radical, an R 4 group of either an alkyl, aryl, aryloxy, nitro, F, or Cl radical, and/or an R 5 group of either H, alkyl, aryl, alkoxy, aryloxy, nitro, F, or Cl radical. The polyimides are useful particularly in the preparation of prepegs and PMR composites.

Mary Ann B Meador↗
NASA NTRS1972

Lubricating characteristics of polyimide bonded graphite fluoride and polyimide thin films

A friction and wear life study was conducted on the use of a polyimide (PI) varnish as a binder for the solid lubricant, graphite fluoride (CF(1.1))N. Also studied were the lubricating properties of PI thin films with no solid lubricant additives. For comparison, similar experiments on PI-bonded MoS2 and burnished films of MoS2 or (CF(li))N were conducted. The best results were obtained with the PI-bonded (CF(1.1))N films. The polyimide thin films (with no solid lubricant additives) did not lubricate well at 25 C; however, when heated to 100 C, low friction and long wear lives were obtained.

Fusaro, R. L.↗
NASA NTRS1972

Lubricating characteristics of polyimide bonded graphite fluoride and polyimide thin films.

A friction and wear life study was conducted on the use of a polyimide (PI) varnish as a binder for the solid lubricant, graphite fluoride (CF sub 1.1) sub n. Also studied were the lubricating properties of PI thin films with no solid lubricant additives. For comparison, similar experiments on PI-bonded MoS2 and burnished films of MoS2 or (CF sub 1.1) sub n were conducted. The best results were obtained with the PI-bonded (CF sub 1.1) sub n films. The polyimide thin films (with no solid lubricant additives) did not lubricate well at 25 C; however, when heated to 100 C, low friction and long wear lives were obtained.

Fusaro, R. L.↗
NASA NTRS1984

Siloxane containing addition polyimides. II - Acetylene terminated polyimides

Acetylene terminated polyimide oligomers having a range of molecular weights have been synthesized by reacting bis (gamma-aminopropyl) tetramethyldisiloxane, aminophenylacetylene and 3, 3', 4, 4' benzophenonetetracarboxylic dianhydride in different molar ratios. The prepolymers were isolated and characterized for melt flow and cure properties. They show promise as adhesives for bonding titanium to titanium and as matrix resins for graphite cloth reinforced composites. The most promising system has been blended in varying proportions with Thermid 600, a commercially available acetylene terminated polyimide oligomer, and the mixtures have been tested for application as composite matrix resins.

Maudgal, S.↗
NASA NTRS1988

Polyimide/metal composite films via in situ decomposition of inorganic additives - Soluble polyimide versus polyimide precursor

Polyimide-metal oxide (Co3O4 or CuO) composite films have been prepared via in situ thermal decomposition of cobalt (II) chloride or bis(trifluoroacetylacetonato)copper(II). A soluble polyimide (XU-218) and its corresponding prepolymer (polyamide acid) were individually employed as the reaction matrix. The resulting composites exhibited a greater metal oxide concentration at the air interface with polyamide acid as the reaction matrix. The water of imidization that is released during the concurrent polyamide acid cure and additive decomposition is believed to promote metal migration and oxide formation. In contrast, XU-218 doped with either HAuCl4.3H2O or AgNO3 yields surface gold or silver when thermolyzed (300 C).

Rancourt, J. D.↗
NASA NTRS1995

A polyimide molecular composite

A polyimide is a hard and sturdy thermoplastic made from the combination of tetracarboxylic dianhydrides and diamines in a polar aprotic solvent. A series of polyimide blends comprising of a tough moldable, wholly aromatic polyimide and a highly crystalline rigid polyimide were prepared. The flexible polyimide was based on LaRC-SI with a 2% offset, and the rigid polyimide as based on para-phenylenediamine and biphenyltetracarboxylic dinnhydride encapped with pthalic anhydride. The polyimide blends were cast as films and cured at 100, 200, and 300 C in air. These films were characterized by finding their glass-transition temperature, melting temperature, coefficient of thermal expansion, tensile modulus, tensile strength, and percent elongation. These characterizations found out which polyimide blend had exceptional mechanical and thermal properties. Experimental results showed the following: (1) A blend with increasing amounts of flexible polyimide produced a better film; (2) A blend with increasing amounts of rigid polyimide produced a brittle film; (3) LaRC-SI (2% offset) tended to phase separate during film casting; (4) Most of the films produced were brittle; and (5) There was an inability to obtain mechanical and thermal properties due to having brittle film. These conclusions demonstrate the difficulty in producing a polyimide blend comprising two physically distinct polyimides. Combining a polysmide with a poly(amic acid) thermosett could be the next phase of research in polyimide synthesis.

Hart, Aprill J.↗
NASA NTRS1989

Condensation polyimides

Polyimides belong to a class of polymers known as polyheterocyclics. Unlike most other high temperature polymers, polyimides can be prepared from a variety of inexpensive monomers by several synthetic routes. The glass transition and crystalline melt temperature, thermooxidative stability, toughness, dielectric constant, coefficient of thermal expansion, chemical stability, mechanical performance, etc. of polyimides can be controlled within certain boundaries. This versatility has permitted the development of various forms of polyimides. These include adhesives, composite matrices, coatings, films, moldings, fibers, foams and membranes. Polyimides are synthesized through both condensation (step-polymerization) and addition (chain growth polymerization) routes. The precursor materials used in addition polyimides or imide oligomers are prepared by condensation method. High molecular weight polyimide made via polycondensation or step-growth polymerization is studied. The various synthetic routes to condensation polyimides, structure/property relationships of condensation polyimides and composite properties of condensation polyimides are all studied. The focus is on the synthesis and chemical structure/property relationships of polyimides with particular emphasis on materials for composite application.

Hergenrother, P. M.↗
NASA NTRS1994

Low dielectric polyimide fibers

A high temperature resistant polyimide fiber that has a dielectric constant of less than 3 is presented. The fiber was prepared by first reacting 2,2-bis (4-(4aminophenoxy)phenyl) hexafluoropropane with 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride in an aprotic solvent to form a polyamic acid resin solution. The polyamic acid resin solution is then extruded into a coagulation medium to form polyamic acid fibers. The fibers are thermally cured to their polyimide form. Alternatively, 2,2-bis(4-(4-aminophenoxy)phenyl) hexafluoropropane is reacted with 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride to form a polyamic acid, and the polyamic acid is chemically converted to its polyimide form. The polyimide is then dissolved in a solvent to form a polyimide resin solution, and the polyimide resin is extruded into a coagulation medium to form a polyimide wet gel filament. In order to obtain polyimide fibers of increased tensile properties, the polyimide wet gel filaments are stretched at elevated temperatures. The tensile properties of the fibers were measured and found to be in the range of standard textile fibers. Polyimide fibers obtained by either method will have a dielectric constant similar to that of the corresponding polymer, viz., less than 3 at 10 GHz.

Dorogy, William E., Jr.↗
NASA NTRS1997

Synthesis and Characterization of High Performance Polyimides Containing the Bicyclo(2.2.2)oct-7-ene Ring System

Due to the difficulty in processing polyimides with high temperature stability and good solvent resistance, we have synthesized high performance polyimides with bicyclo(2.2.2)-oct-7-ene ring system which can easily be fabricated into films and fibers and subsequently converted to the more stable aromatic polyimides. In order to improve processability, we prepared two polyimides by reacting 1,4-phenylenediamine and 1,3phenylediamine with bicyclo(2.2.2)-7-octene-2,3,5,6-tetracarboxylic dianhydride. The polyimides were characterized by FTIR, FTNMR, solubility and thermal analysis. Thermogravimetric analysis (TGA) showed that the 1,4-phenylenediamine and 1,3-phenylenediamine containing polyimides were stable up to 460 and 379 C, respectively under nitrogen atmosphere. No melting transitions were observed for both polyimides. The 1,4-phenylenediamine containing polyimide is partially soluble in dimethyl sulfoxide, methane sulfonic acid and soluble in sulfuric acid at room temperature. The 1,3-phenylenediamine containing polyimide is partially soluble in dimethyl sulfoxide, tetramethyl urea, N,N-dimethyl acetamide and soluble in methane sulfonic acid and sulfuric acid.

Alvarado, M.↗
NASA NTRS1989

Structure/permeability relationships of silicon-containing polyimides

The permeability to H2, O2, N2, CO2 and CH4 of three silicone-polyimide random copolymers and two polyimides containing silicon atoms in their backbone chains, was determined at 35.0 C and at pressures up to about 120 psig (approximately 8.2 atm). The copolymers contained different amounts of BPADA-m-PDA and amine-terminated poly (dimethyl siloxane) and also had different numbers of siloxane linkages in their silicone component. The polyimides containing silicon atoms (silicon-modified polyimides) were SiDA-4,4'-ODA and SiDA-p-PDA. The gas permeability and selectivity of the copolymers are more similar to those of their silicone component than of the polyimide component. By contrast, the permeability and selectivity of the silicon-modified polyimides are more similar to those of their parent polyimides, PMDA-4,4'-ODA and SiDA-p-PDA. The substitution of SiDA for the PMDA moiety in a polyimide appears to result in a significant increase in gas permeability, without a correspondingly large decrease in selectivity. The potential usefulness of the above polymers and copolymers as gas separation membranes is discussed.

Stern, S. A.↗
NASA NTRS1991

Structure-property study of keto-ether polyimides

As part of an on-going effort to develop an understanding of how changes in the chemical structure affect polymer properties, an empirical study was performed on polyimides containing only ether and/or carbonyl connecting groups in the polymer backbone. During the past two decades the structure-property relationships in linear aromatic polyimides have been extensively investigated. More recently, work has been performed to study the effect of isomeric attachment of keto-ether polyimides on properties such as glass transition temperature and solubility. However, little work has been reported on the relation of polyimide structure to mechanical properties. The purpose of this study was to determine the effect of structural changes in the backbone of keto-ether polyimides on their mechanical properties, specifically, unoriented thin film tensile properties. This study was conducted in two stages. The purpose of the initial stage was to examine the physical and mechanical properties of a representative group (four) of polyimide systems to determine the optimum solvent and cure cycle requirements. These optimum conditions were then utilized in the second stage to prepare films of keto-ether polyimides which were evaluated for mechanical and physical properties. All of the polyimides were prepared using isomers of oxydianiline (ODA) and diaminobenzophenone (DABP) in combination with 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and 4,4'-oxydiphthalic anhydride (ODPA).

Dezern, James F.↗