Integrated magnetic components for distributed power electronics
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power electronics passive components↗
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A Tradeoff Analysis of Series / Parallel Three-Phase Converter Topologies for Wireless Extreme Chargers
In this paper, extreme fast charging (XFC) technology is studied considering the charge rates of 300 kW for wireless power transfer (WPT) applications. Tradeoff analysis of series and parallel connection of three-phase WPT system are presented by comparisons of voltage and current stresses on power electronics active / passive components. In addition, star (Y) / delta (Δ) connection configurations for three-phase wireless power transfer coupling coils are analyzed with series and LCC resonant compensation circuits. The system series and parallel connection controllability is also reviewed considering voltage and current balance techniques with output control. In a conclusion of evaluation analysis, it is revealed that each component of 300 kW wireless charging network must be designed for high fast charging system and the overall system operation need to be strategically planned for high power charging and infrastructure deployment.
Asa, Erdem↗
Development of Electronics for Low Temperature Space Missions
The operation of electronic systems at cryogenic temperatures is anticipated for many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about -183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program on low temperature electronics at the NASA Glenn Research Center focuses on the development of efficient power systems capable of surviving and exploiting the advantages of low temperature environments. Inhouse efforts include the design, fabrication, and characterization of low temperature power systems and the development of supporting technologies for low temperature operations, such as dielectric and insulating materials, semiconductor devices, passive power components, opto-electronic devices, as well as packaging and integration of the developed components into prototype flight hardware.
Patterson, Richard L.↗
Fabrication and characterization of net-shaped iron nitride-amine-epoxy soft magnetic composites
Soft magnetic composites (SMCs) offer a promising alternative to electrical steels and soft ferrites in high performance motors and power electronics. They are ideal for incorporation into passive electronic components such as inductors and transformers, which require a non-permanent magnetic core to rapidly switch magnetization. As a result, there is a need for materials with the right combination of low coercivity, low magnetic remanence, high relative permeability, and high saturation magnetization to achieve these goals. Iron nitride is an attractive soft magnetic material for incorporation into an amine/epoxy resin matrix. This permits the synthesis of net-shaped SMCs using a “bottom-up” approach for overcoming the limitations of current state-of-the-art SMCs made via conventional powder metal processing techniques. In this work we present the fabrication of various net-shaped, iron nitride-based SMCs using two different amine/epoxy resin systems and their magnetic characterization. The maximum volume loading of iron nitride reached was ~77% via hot pressing, which produced SMCs with a saturation magnetic polarization (J s ) of ~0.9 T, roughly 2–3 times the J s of soft ferrites.
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗
Integration of Passive Components for Spacecraft Avionics
The NASA roadmap outlining future deep space missions to Europa and other outer planetary destinations calls for continued reductions in the mass and volume of the spacecraft avionics. Spacecraft power electronics, including the power switches and converters, remain difficult to miniaturize due to the need for large numbers of discrete passive components such as resistors, capacitors, inductors and transformers. As part of the System-on-a-chip program at the Center for Integrated Space Microsystems and at the University of Arkansas, we are working to develop integrated or embedded passive components geared specifically for use in power management and distribution (PMAD) in future avionics over the next five to ten years. This will not only enable a scaling down of the power subsystems, but will make possible new architectures such as "distributed" PMAD. Additional information is contained in the original extended abstract.
Brandon, E. J.↗
Superconductor Electronics: Status and Outlook
Superconductor electronics combines passive and active superconducting components and sometimes normal resistors into functional circuits and systems that also include room-temperature electronics for amplification, power sources, necessary controls, etc., usually computer operated. Furthermore, complete systems include magnetic and electromagnetic shielding, cryogenic enclosures, and increasingly a cryocooler in self-contained units. Components or devices of low or high critical temperature superconductors include inductances (coils), passive transmission lines, resonators, antennae, filters, as well as active elements: Josephson junctions, Josephson oscillators, and superconducting quantum interference devices. Of multiple demonstrated applications, mostly but not only in science and metrology, currently most successful are voltage standards, astronomy detectors and large telescope cameras, instruments for material characterization, and magnetometers for geomagnetic prospecting. Major current efforts concentrate on energy-efficient high-end computing and quantum computing. The outcomes of these efforts are likely to be known in the course of the following decade.
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
Passive Digital Sensing Method and Its Implementation on Passive RFID Temperature Sensors
Benefitting from the advancement of digital electronics in the 20 th century, sensors have also gradually evolved from analog to digital. As semiconductor components are required in digital sensors, a power supply is still needed for the sensor. To eliminate the need for a power supply a concept of passive digital sensing is proposed. Different from the semiconductor-based electrical digital sensing method, the parameter to be measured is first converted to a mechanical signal, then the mechanical signal is encoded to multiple digital bits by a passive digitizer, where each bit is identified as open or short state that is detectable by general IO ports. To demonstrate the proposed sensing concept, a passive RFID temperature sensor is implemented using a bimetallic coil as the temperature sensing unit. The 6-bit binary codes are acquired and transmitted by a passive RFID that is powered by an energy harvester. Furthermore, the test results show that the temperature sensor has a measurement sensitivity of 1.32 °C/bit and a working distance over 10 meters.
47 OTHER INSTRUMENTATION↗
High-Temperature Passive Power Electronics
In many future NASA missions - such as deep-space exploration, the National AeroSpace Plane, minisatellites, integrated engine electronics, and ion or arcjet thrusters - high-power electrical components and systems must operate reliably and efficiently in high-temperature environments. The high-temperature power electronics program at the NASA Lewis Research Center focuses on dielectric and insulating material research, the development and characterization of high-temperature components, and the integration of the developed components into a demonstrable 200 C power system - such as an inverter. NASA Lewis has developed high-temperature power components through collaborative efforts with the Air Force Wright Laboratory, Northrop Grumman, and the University of Wisconsin. Ceramic and film capacitors, molypermalloy powder inductors, and a coaxially wound transformer were designed, developed, and evaluated for high-temperature operation.
Source record↗
Cable/Antenna Bounds Connecting Field Levels To Personnel Safety And Electronic Upset Thresholds
We use bounding models to estimate the power delivered to interior ordnance as well as the pin level voltages along a cable at interior electronic components. The procedures underlying these estimates are described in some detail. Conservation of steady-state power in a linear passive system underpins the power estimate, whereas, losses and quality factor limits underpin the limits on voltage transformations. The final levels are compared to no-fire threshold power and to minimum upset voltage levels in an example using a canonical slot aperture and cavity to estimate interior fields.
42 ENGINEERING↗
Photonic Integrated Circuits
Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.
Laser↗
Photonic Integrated Circuits
Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.
laser↗
Factors and Considerations for Modeling Loss of a GaN-based Inverter
The article investigates the impacts of four often-neglected factors on the loss model of a GaN-based full-bridge inverter: parasitic capacitance of the devices, dynamics of junction temperature (Tj) under time-varying power dissipation (Ploss), case temperature estimation, and detailed considerations of the passive components. Procedures to calculate the converter loss considering the above factors are proposed and implemented. A 4.5-kW hard-switching inverter prototype using gallium nitrite (GaN) high-electron-mobility transistors is used to experimentally demonstrate the impact of each factor on the converter loss model. Furthermore, it is found that the accuracy of a converter loss model is mainly affected by the passive components at the light load condition, whereas the thermal and loss models of the active components become the major factors as the output power increases. The results show that after considering the above factors, the converter loss discrepancy between calculation and measurement can be reduced from 30.6 W (28%) to 2.5 W (less than 3%) at heavy load (Po = 4.5 kW), while at the light load condition (Po = 500 W), it is reduced from 3.9 W (28%) to 2.6 W (16%). Furthermore, the difference between simulated and measured case temperature of the GaN devices is within 6 °C.
42 ENGINEERING↗
Elastomeric Sensing of Pressure with Liquid Metal and Wireless Inductive Coupling
This project describes resistance-based soft sensors filled with liquid metal, which permit measurements of large strains (0 percent to 110 percent), associated with small forces of less than 30 Newtons. This work also demonstrates a methodology for wireless transfer of these strain measurements without connected electrodes. These sensors allow intermittent detection of pressure on soft membranes with low force. Adapting these sensors for passive wireless pressure sensing will eliminate the need for embedded batteries, and will allow the sensors to transmit pressure data through non-conductive materials including glass and acrylic. The absence of batteries allows us to embed these sensors into materials for long-term use because the sensors only use passive analog circuit elements. We found the oxidation of the liquid metal (eutectic gallium indium) plays a role in the repeatability of the soft sensors. We investigated how the oxidation layer affected the behavior of the sensor by encapsulating materials (silicone, fluorosilicone, and PVC) with varied permeabilities to oxygen. We measured the effects of mechanical loading on the oxidation layer and the effects of wireless inductive coupling on the oxidation layer. We concluded our research by investigating the effects of embedding self-resonant circuits into polydimethylsiloxane (PDMS). Efforts to design engineered systems with soft materials are a growing field with progress in soft robotics, epidermal electronics, and wearable electronics. In the field of soft robotics, PDMS-based grippers are capable of picking up delicate objects because their form-fitting properties allow them to conform to the shape of objects more easily than conventional robotic grippers. Epidermal devices also use PDMS as a substrate to hold electronic components such as radios, sensors, and power supply circuits. Additionally, PDMS-based soft sensors can monitor human motion with liquid metal embedded within micro-channels. Passive wireless sensors have applications in structural health monitoring and medical health monitoring. Doctors can take wireless blood pressure measurements inside arteries to monitor the progression of heart disease. Glaucoma patients can use this technology to monitor the pressure in their eyes to track the progression of the disease.
Dick, Jacob↗
Three and Two Phase Rotating Field Inductive Couplers for Wireless Power Transfer with One Phase per Layer Windings
Multiphase inductive wireless charging coils have been proposed recently to improve coupler surface power density, reduce component stress and size, and provide near-constant power delivery to charge mobile electric systems. Several aspects for the fundamental characterization of multiphase coils are explored up to six phases including approximate mutual inductance with size and turn variation, induced voltage, and output power estimation. The relative component stress and size of passive components for resonant operation are compared between the multiphase variants. A combination of an experimentally validated 3D electromagnetic finite element analysis (FEA) and power electronic co-simulations are used to validate the estimated quantities approximated with a mixture of analytical equations and an artificial neural network model for mutual inductance. A novel three-phase transmitter, two-phase receiver coil pair is also proposed for electric vehicle charging to reduce the number of connections and compensation complexity on the vehicle-side with improved power output compared to a two-phase configuration.
Lewis, Donovin D. [University of Kentucky]↗
Planetary benchmarks
Design criteria and technology requirements for a system of radar reference devices to be fixed to the surfaces of the inner planets are discussed. Offshoot applications include the use of radar corner reflectors as landing beacons on the planetary surfaces and some deep space applications that may yield a greatly enhanced knowledge of the gravitational and electromagnetic structure of the solar system. Passive retroreflectors with dimensions of about 4 meters and weighing about 10 kg are feasible for use with orbiting radar at Venus and Mars. Earth-based observation of passive reflectors, however, would require very large and complex structures to be delivered to the surfaces. For Earth-based measurements, surface transponders offer a distinct advantage in accuracy over passive reflectors. A conceptual design for a high temperature transponder is presented. The design appears feasible for the Venus surface using existing electronics and power components.
Uphoff, C.↗
Thermal Design and Analysis of the Supersonic Flight Dynamics Test Vehicle for the Low Density Supersonic Decelerator Project
The thermal design and analysis of the experimental Supersonic Flight Dynamics Test (SFDT) vehicle is presented. The SFDT vehicle is currently being designed as a platform to help demonstrate key technologies for NASA's Low Density Supersonic Decelerator (LDSD) project. The LDSD project is charged by NASA's Office of the Chief Technologist (OCT) with the task of advancing the state of the art in Mars Entry, Descent, and Landing (EDL) systems by developing and testing three new technologies required for landing heavier payloads on Mars. The enabling technologies under development consist of a large 33.5 meter diameter Supersonic Ringsail (SSRS) parachute and two different types of Supersonic Inflatable Aerodynamic Decelerator (SIAD) devices - a robotic class, SIAD-R, that inflates to a 6 meter diameter torus, and an exploration class, SIAD-E, that inflates to an 8 meter diameter isotensoid. As part of the technology development effort, the various elements of the new supersonic decelerator system must be tested in a Mars-like environment. This is currently planned to be accomplished by sending a series of SFDT vehicles into Earth's stratosphere. Each SFDT vehicle will be lifted to a stable float altitude by a large helium carrier balloon. Once at altitude, the SFDT vehicles will be released from their carrier balloon and spun up via spin motors to provide trajectory stability. An onboard third stage solid rocket motor will propel each test vehicle to supersonic flight in the upper atmosphere. After main engine burnout, each vehicle will be despun and testing of the deceleration system will begin: first an inflatable decelerator will be deployed around the aeroshell to increase the drag surface area, and then the large parachute will be deployed to continue the deceleration and return the vehicle back to the Earth's surface. The SFDT vehicle thermal system must passively protect the vehicle structure and its components from cold temperatures experienced during the ascent phase of the mission as well as from the extreme heat fluxes produced during the supersonic test phase by the main motor plume and aeroheating. The passive thermal design approach for the SFDT vehicle relies upon careful and complex bounding analysis of all three modes of heat transfer - conduction, convection, and radiation - coupled with a tightly managed transient power dissipation timeline for onboard electronics components throughout all mission phases.
thermal desktop↗
Development of Electronics for Low-Temperature Space Missions
Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.
Patterson, Richard L.↗
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions
Effective thermal management of traction-drive power electronics is critical to the advancement of electric-drive vehicles and is necessary for increasing power density and improving reliability. Replacing traditional silicon devices with more efficient, higher temperature, higher voltage, and higher frequency wide-bandgap (WBG) devices will enable increased power density but will result in higher device heat fluxes. Compact packaging of high-temperature WBG devices near low-temperature-rated components creates thermal management challenges that need to be addressed for future power-dense systems. This paper summarizes the thermal performance of on-road automotive power electronics thermal management systems and provides thermal performance and pumping-power metrics for select vehicles. Thermal analyses reveal that the package/conduction resistance dominates the total thermal resistance (for existing automotive systems). We model advanced packaging concepts and compare the results with existing packaging designs to quantify their thermal performance enhancements. Double-side-cooled configurations that do not use thermal interface materials are package concepts predicted to provide a low junction-to-fluid thermal resistance (compared to current packages). Dielectric-fluid-cooled concepts enable a redesign of the package to reduce the package resistance, can be implemented in single- and two-phase cooling approaches, and allow for cooling of passive components (e.g., capacitors) and bus bars.
33 ADVANCED PROPULSION SYSTEMS↗