Integrated magnetic components for distributed power electronics
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power electronics passive components↗
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Development of Electronics for Low Temperature Space Missions
The operation of electronic systems at cryogenic temperatures is anticipated for many future NASA space missions such as deep space probes and planetary surface exploration. For example, an unheated interplanetary probe launched to explore the rings of Saturn would reach an average temperature near Saturn of about -183 C. In addition to surviving the deep space harsh environment, electronics capable of low temperature operation would contribute to improving circuit performance, increasing system efficiency, and reducing payload development and launch costs. Terrestrial applications where components and systems must operate in low temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation system, and arctic exploration. An on-going research and development program on low temperature electronics at the NASA Glenn Research Center focuses on the development of efficient power systems capable of surviving and exploiting the advantages of low temperature environments. Inhouse efforts include the design, fabrication, and characterization of low temperature power systems and the development of supporting technologies for low temperature operations, such as dielectric and insulating materials, semiconductor devices, passive power components, opto-electronic devices, as well as packaging and integration of the developed components into prototype flight hardware.
Patterson, Richard L.↗
Integration of Passive Components for Spacecraft Avionics
The NASA roadmap outlining future deep space missions to Europa and other outer planetary destinations calls for continued reductions in the mass and volume of the spacecraft avionics. Spacecraft power electronics, including the power switches and converters, remain difficult to miniaturize due to the need for large numbers of discrete passive components such as resistors, capacitors, inductors and transformers. As part of the System-on-a-chip program at the Center for Integrated Space Microsystems and at the University of Arkansas, we are working to develop integrated or embedded passive components geared specifically for use in power management and distribution (PMAD) in future avionics over the next five to ten years. This will not only enable a scaling down of the power subsystems, but will make possible new architectures such as "distributed" PMAD. Additional information is contained in the original extended abstract.
Brandon, E. J.↗
High-Temperature Passive Power Electronics
In many future NASA missions - such as deep-space exploration, the National AeroSpace Plane, minisatellites, integrated engine electronics, and ion or arcjet thrusters - high-power electrical components and systems must operate reliably and efficiently in high-temperature environments. The high-temperature power electronics program at the NASA Lewis Research Center focuses on dielectric and insulating material research, the development and characterization of high-temperature components, and the integration of the developed components into a demonstrable 200 C power system - such as an inverter. NASA Lewis has developed high-temperature power components through collaborative efforts with the Air Force Wright Laboratory, Northrop Grumman, and the University of Wisconsin. Ceramic and film capacitors, molypermalloy powder inductors, and a coaxially wound transformer were designed, developed, and evaluated for high-temperature operation.
Source record↗
Cable/Antenna Bounds Connecting Field Levels To Personnel Safety And Electronic Upset Thresholds
We use bounding models to estimate the power delivered to interior ordnance as well as the pin level voltages along a cable at interior electronic components. The procedures underlying these estimates are described in some detail. Conservation of steady-state power in a linear passive system underpins the power estimate, whereas, losses and quality factor limits underpin the limits on voltage transformations. The final levels are compared to no-fire threshold power and to minimum upset voltage levels in an example using a canonical slot aperture and cavity to estimate interior fields.
42 ENGINEERING↗
Photonic Integrated Circuits
Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.
Laser↗
Photonic Integrated Circuits
Integrated photonics generally is the integration of multiple lithographically defined photonic and electronic components and devices (e.g. lasers, detectors, waveguides passive structures, modulators, electronic control and optical interconnects) on a single platform with nanometer-scale feature sizes. The development of photonic integrated circuits permits size, weight, power and cost reductions for spacecraft microprocessors, optical communication, processor buses, advanced data processing, and integrated optic science instrument optical systems, subsystems and components. This is particularly critical for small spacecraft platforms. We will give an overview of some NASA applications for integrated photonics.
laser↗
Elastomeric Sensing of Pressure with Liquid Metal and Wireless Inductive Coupling
This project describes resistance-based soft sensors filled with liquid metal, which permit measurements of large strains (0 percent to 110 percent), associated with small forces of less than 30 Newtons. This work also demonstrates a methodology for wireless transfer of these strain measurements without connected electrodes. These sensors allow intermittent detection of pressure on soft membranes with low force. Adapting these sensors for passive wireless pressure sensing will eliminate the need for embedded batteries, and will allow the sensors to transmit pressure data through non-conductive materials including glass and acrylic. The absence of batteries allows us to embed these sensors into materials for long-term use because the sensors only use passive analog circuit elements. We found the oxidation of the liquid metal (eutectic gallium indium) plays a role in the repeatability of the soft sensors. We investigated how the oxidation layer affected the behavior of the sensor by encapsulating materials (silicone, fluorosilicone, and PVC) with varied permeabilities to oxygen. We measured the effects of mechanical loading on the oxidation layer and the effects of wireless inductive coupling on the oxidation layer. We concluded our research by investigating the effects of embedding self-resonant circuits into polydimethylsiloxane (PDMS). Efforts to design engineered systems with soft materials are a growing field with progress in soft robotics, epidermal electronics, and wearable electronics. In the field of soft robotics, PDMS-based grippers are capable of picking up delicate objects because their form-fitting properties allow them to conform to the shape of objects more easily than conventional robotic grippers. Epidermal devices also use PDMS as a substrate to hold electronic components such as radios, sensors, and power supply circuits. Additionally, PDMS-based soft sensors can monitor human motion with liquid metal embedded within micro-channels. Passive wireless sensors have applications in structural health monitoring and medical health monitoring. Doctors can take wireless blood pressure measurements inside arteries to monitor the progression of heart disease. Glaucoma patients can use this technology to monitor the pressure in their eyes to track the progression of the disease.
Dick, Jacob↗
Three and Two Phase Rotating Field Inductive Couplers for Wireless Power Transfer with One Phase per Layer Windings
Multiphase inductive wireless charging coils have been proposed recently to improve coupler surface power density, reduce component stress and size, and provide near-constant power delivery to charge mobile electric systems. Several aspects for the fundamental characterization of multiphase coils are explored up to six phases including approximate mutual inductance with size and turn variation, induced voltage, and output power estimation. The relative component stress and size of passive components for resonant operation are compared between the multiphase variants. A combination of an experimentally validated 3D electromagnetic finite element analysis (FEA) and power electronic co-simulations are used to validate the estimated quantities approximated with a mixture of analytical equations and an artificial neural network model for mutual inductance. A novel three-phase transmitter, two-phase receiver coil pair is also proposed for electric vehicle charging to reduce the number of connections and compensation complexity on the vehicle-side with improved power output compared to a two-phase configuration.
Lewis, Donovin D. [University of Kentucky]↗
Planetary benchmarks
Design criteria and technology requirements for a system of radar reference devices to be fixed to the surfaces of the inner planets are discussed. Offshoot applications include the use of radar corner reflectors as landing beacons on the planetary surfaces and some deep space applications that may yield a greatly enhanced knowledge of the gravitational and electromagnetic structure of the solar system. Passive retroreflectors with dimensions of about 4 meters and weighing about 10 kg are feasible for use with orbiting radar at Venus and Mars. Earth-based observation of passive reflectors, however, would require very large and complex structures to be delivered to the surfaces. For Earth-based measurements, surface transponders offer a distinct advantage in accuracy over passive reflectors. A conceptual design for a high temperature transponder is presented. The design appears feasible for the Venus surface using existing electronics and power components.
Uphoff, C.↗
Thermal Design and Analysis of the Supersonic Flight Dynamics Test Vehicle for the Low Density Supersonic Decelerator Project
The thermal design and analysis of the experimental Supersonic Flight Dynamics Test (SFDT) vehicle is presented. The SFDT vehicle is currently being designed as a platform to help demonstrate key technologies for NASA's Low Density Supersonic Decelerator (LDSD) project. The LDSD project is charged by NASA's Office of the Chief Technologist (OCT) with the task of advancing the state of the art in Mars Entry, Descent, and Landing (EDL) systems by developing and testing three new technologies required for landing heavier payloads on Mars. The enabling technologies under development consist of a large 33.5 meter diameter Supersonic Ringsail (SSRS) parachute and two different types of Supersonic Inflatable Aerodynamic Decelerator (SIAD) devices - a robotic class, SIAD-R, that inflates to a 6 meter diameter torus, and an exploration class, SIAD-E, that inflates to an 8 meter diameter isotensoid. As part of the technology development effort, the various elements of the new supersonic decelerator system must be tested in a Mars-like environment. This is currently planned to be accomplished by sending a series of SFDT vehicles into Earth's stratosphere. Each SFDT vehicle will be lifted to a stable float altitude by a large helium carrier balloon. Once at altitude, the SFDT vehicles will be released from their carrier balloon and spun up via spin motors to provide trajectory stability. An onboard third stage solid rocket motor will propel each test vehicle to supersonic flight in the upper atmosphere. After main engine burnout, each vehicle will be despun and testing of the deceleration system will begin: first an inflatable decelerator will be deployed around the aeroshell to increase the drag surface area, and then the large parachute will be deployed to continue the deceleration and return the vehicle back to the Earth's surface. The SFDT vehicle thermal system must passively protect the vehicle structure and its components from cold temperatures experienced during the ascent phase of the mission as well as from the extreme heat fluxes produced during the supersonic test phase by the main motor plume and aeroheating. The passive thermal design approach for the SFDT vehicle relies upon careful and complex bounding analysis of all three modes of heat transfer - conduction, convection, and radiation - coupled with a tightly managed transient power dissipation timeline for onboard electronics components throughout all mission phases.
thermal desktop↗
Development of Electronics for Low-Temperature Space Missions
Electronic systems that are capable of operating at cryogenic temperatures will be needed for many future NASA space missions, including deep space probes and spacecraft for planetary surface exploration. In addition to being able to survive the harsh deep space environment, low-temperature electronics would help improve circuit performance, increase system efficiency, and reduce payload development and launch costs. Terrestrial applications where components and systems must operate in low-temperature environments include cryogenic instrumentation, superconducting magnetic energy storage, magnetic levitation transportation systems, and arctic exploration. An ongoing research and development project for the design, fabrication, and characterization of low-temperature electronics and supporting technologies at NASA Glenn Research Center focuses on efficient power systems capable of surviving in and exploiting the advantages of low-temperature environments. Supporting technologies include dielectric and insulating materials, semiconductor devices, passive power components, optoelectronic devices, and packaging and integration of the developed components into prototype flight hardware. An overview of the project is presented, including a description of the test facilities, a discussion of selected data from component testing, and a presentation of ongoing research activities being performed in collaboration with various organizations.
Patterson, Richard L.↗
Heterogeneous Integration, An Approach to High Density and High Flexibility Electronic Packaging
Key to the design of spacecraft for exploration of the outer planets will be the development of highly integrated and mass/volume efficient electronic systems. Exploration of the outer planets will require optimized propulsion approaches which mandates mass minimization. If one looks at a mission such as the Europa Lander, a high mass/volume efficiency feeds back directly into lower mass for radiation shielding. Concurrently the long mission lengths will drive the need for fault isolation and fault tolerance. The ability to build distributed electronic systems is an inherent requirement and one which is enabled by heterogeneous integration. The electronic packaging approach must be capable of interconnecting various components at a scale comparable with that on the components themselves (chip scale) and it must facilitate efficient integration of the electronics with elements of the spacecraft such as structure or antennae. The concept of 'Heterogeneous Integration' is being explored in the System On A Chip (SOAC) Project at JPL. The goal, of this approach to electronic packaging, is to enable the fabrication and assembly of complete electronic subsystems from components fabricated by a range of processes. Included in such a system could be MEMS sensors, SOI mixed signal ASICs, micro scale passive components and micro power. Secondarily the compact size will enable distributed architectures and integrated assemblies. Additional information is contained in the original extended abstract.
DAgostino, S. A.↗
The Impact of Soft Magnetic Materials in Electrified Aircraft Applications
Electrical systems with high power and high power density are integral to many aerospace and energy applications. These systems, enabled by power electronics with wide bandgap semiconductor devices, require management of both efficiency/thermal aspects and electromagnetic interference that are problems specific to high power and high frequency applications, respectively. In addition to advanced active components, these applications also require passive components (inductors, capacitors, conductors) capable of operation under challenging conditions. This work surveys the state of the art of magnetic components and soft magnetic materials used as inductive cores. The wide variety of motor and converter topologies translates to a variety of requirements in the magnetics including mechanical properties, permeabilities, and frequency response. The scaling impact of material properties will be surveyed with respect to component performance and sizing, using both data from experiment and the published literature. Variations on simulations, both in lumped circuits and finite element models, will also be discussed as these are important aspects of the design phase of modern power electronics.
Alex Leary↗
Piezoelectric Pushers Suppress Vibrations
Vibration-suppressing control systems including piezoelectric actuators undergoing development. Small, lightweight, and rugged. Requires simpler electronic control subsystems and does not require large electromagnet coils. Continues to provide support and some passive damping even when electronic control subsystems or power supplies fail. Intended primarily to enhance safety and prevent damage in rotating machinery by sensing and counteracting vibrations. Useful in suppressing unpredictable vibrations caused by changes in loads, losses of rotating components and consequent imbalances in rotors, and ingestion of foreign objects into turbines.
Kascak, Albert F.↗
Correcting impedance measurements for background parasitics to characterize circuit components in cryogenic environments
Predictable circuit response is a critical prerequisite for accurate electronic measurements. Here, we describe a powerful yet straightforward experimental method and analysis model that utilizes an affordable LCR meter in conjunction with an in situ parasitic-impedance background-correction procedure to measure the temperature-dependent impedance (magnitude and phase) of up to ten individual passive circuit elements in a single cryostat run. We show how the model unambiguously identified a ∼20× drop in capacitance for 22 μF 5XR multilayer ceramic capacitors cooled from 300 K to 360 mK in an environment with a parasitic capacitance of ∼300 pF. The same experimental procedure, based on a simple two-wire measurement, was also used to measure 10 and 22 pF thin-film capacitors and 100 MΩ thick-film resistors. The results showed that the resistor values increased by up to an order of magnitude when the devices were cooled from 300 K to 360 mK. Most importantly, we showed that the simple data-acquisition method, coupled with our analysis model, enabled the measurement of component parasitics, and effectively extended the accuracy of a commercial LCR meter beyond its manufacturer-guaranteed values for a wide range of measurement frequencies. We also showed that, in the current configuration, our simple approach is limited to a capacitance accuracy of ∼10 pF.
Carpenter, R. J. [Santa Clara Univ., Santa Clara, ↗
Deep Charging Evaluation of Satellite Power and Communication System Components
A set of deep charging tests has been carried out by NASA's Marshall Space Flight Center on subscale flight-like samples developed by Space Systems/Loral, LLC. The samples, which included solar array wire coupons, a photovoltaic cell coupon, and a coaxial microwave transmission cable, were placed in passive and active (powered) circuit configurations and exposed to electron radiation. The energy of the electron radiation was chosen to deeply penetrate insulating (dielectric) materials on each sample. Each circuit configuration was monitored to determine if potentially damaging electrostatic discharge events (arcs) were developed on the coupon as a result of deep charging. The motivation for the test, along with charging levels, experimental setup, sample details, and results will be discussed.
Schneider, T. A.↗
Passive Thermal Control Challenges for Future Exploration Missions
This slide presentation reviews the importance of developing passive thermal control for the future exploration missions envisioned in President Bush's call for human exploration of the Moon and Mars. Included in the presentation is a review of the conditions that make the thermal control very challenging on the Moon and Mars. With the future miniaturization of electronics components, power density and the associated challenges of electronics heat dissipation will provide new challenges. There is a challenge for improvement in modeling and analysis of thermal control systems, and for improved facilities to support testing of thermal-vacuum systems.
Rickman, Steven L.↗