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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2026

Review of Ultrafast Switching Power Modules: Trends, Challenges, and Technical Solutions

Benefiting from the superior properties of wide-bandgap semiconductor materials, wide-bandgap power devices demonstrate exceptional switching performance, enabling more efficient and compact power electronics systems. However, ultrafast switching poses challenges to the reliability of the system in terms of severe oscillations and voltage overshoot, electromagnetic interference, and increased risk of partial discharge. By developing advanced power module packaging for fast-switching power devices, the above-mentioned challenges can be mitigated at the packaging level, enabling the full utilization of the fast-switching capability of wide-bandgap devices. Meanwhile, such technology also lays the groundwork for packaging next-generation power devices with even higher blocking voltage and faster switching speed. In this paper, a comprehensive review of ultrafast switching power modules has been made, including the benefits and status of ultrafast switching power modules, challenges brought by ultrafast switching, and promising technologies to address these challenges. In addition, future development trends and research gaps are also discussed in this paper. Furthermore, this review can serve as a reference for future wide-bandgap power module packaging design.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2025

Packaging a 650V/400A GaN Half-bridge Power Module with Ultra-low Parasitics for Electric Vehicle Drive Applications

This paper proposes a compact and efficient half-bridge power module with three 650 V / 150 A GaN dies in parallel. The power module incorporates a main power printed circuit board (PCB), an interface PCB, and a flex PCB to achieve low parasitics in both power loop and gate-side connection, resolving the issue of high parasitics typically encountered with wire bonding in high-current applications. Additionally, the interface PCB decouples the design constraints between the power loop and the gate loops. The proposed design is optimized with a vertical loop configuration to reduce power loop inductance through magnetic flux cancellation. Finite element analysis indicates that the power loop inductance is 0.58 nH at 100 MHz, while the maximum die junction temperature reaches 131 °C under an ambient temperature of 65 °C and a load current of 385 A. The proposed multi-piece PCB structure reduces the inductance of the drive circuit to minimize EMI and to mitigate false triggering. At the same time, it reduces impedance mismatches across different driver circuits, thereby achieving dynamic current sharing in multi-chip parallel configurations. Under simulation conditions of 400 V / 385 A, the current imbalance among chips was limited to 5 A. A 400 V / 385 A double-pulse test was conducted to experimentally validate the performance of the proposed power module.

30 DIRECT ENERGY CONVERSION↗
DOE OSTI2025

Thermal Optimization and Experimental Demonstration of a Silicon Carbide, Half-Bridge Power Module

This paper describes modeling and experimental work to design and demonstrate a silicon carbide (SiC), single-side-cooled power module. Two SiC metal-oxide-semiconductor field-effect transistors (MOSFET) were used for each switch position and packaged on a metalized ceramic substrate. Thermal modeling was first conducted to optimize the module packaging to minimize junction-to-fluid thermal resistance and device temperature variations. This procedure identified the optimal device placement and baseplate thickness to maximize thermal performance. A heat exchanger - incorporating impinging jets of water-ethylene glycol - was designed to cool the module's baseplate to minimize thermal resistance and pumping power. The heat exchanger used relatively low fluid velocities (<1.5 m/s) to minimize erosion-corrosion effects and relatively large fluid channel sizes (>=1 mm) to prevent clogging. The power module concept was fabricated, and experiments were conducted to measure its thermal performance. Direct current was used to power the module devices, and junction temperatures were measured via device temperature-sensitive parameters. The experimental results were found to be in good agreement with model predictions (within 2%) and yielded junction-to-fluid thermal resistance values as low as about 15 mm2 K/W at relatively low pumping power values. The results demonstrate the improved performance associated with jet impingement cooling and represent an improvement over existing channel-flow-type cold plates, which can enable improvements to power density and reliability.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Organic Direct-Bonded-Copper-Based Rapid Prototyping for Silicon Carbide Power Module Packaging

Silicon carbide (SiC) power devices are playing ever- growing roles in high-power-density power electronics converters by offering benefits such as high voltage rating, fast transients, and high thermal performance. Organic direct-bonded copper (ODBC)-based packaging, due to its ductility and ease of han- dling, allows the possibility of a more flexible layout design that may better tap the potential of SiC benefits. In this work, an ODBC-based prototyping routine is developed that accelerates the iterations of packaging layout design with low cost. The properties of ODBC and its handling are briefly introduced, and tools and fabrication steps are explained. Following this routine, a 1.2-kV SiC half-bridge power module is designed and fabricated with the focus on sub-nanohenry ultra-low loop inductance. Simulation and experimental validation are also conducted.

25 ENERGY STORAGE↗
NASA NTRS1991

Augmentation of the Space Station Module Power Management and Distribution Breadboard

The space station module power management and distribution (SSM/PMAD) breadboard models power distribution and management, including scheduling, load prioritization, and a fault detection, identification, and recovery (FDIR) system within a Space Station Freedom habitation or laboratory module. This 120 VDC system is capable of distributing up to 30 kW of power among more than 25 loads. In addition to the power distribution hardware, the system includes computer control through a hierarchy of processes. The lowest level consists of fast, simple (from a computing standpoint) switchgear that is capable of quickly safing the system. At the next level are local load center processors, (LLP's) which execute load scheduling, perform redundant switching, and shed loads which use more than scheduled power. Above the LLP's are three cooperating artificial intelligence (AI) systems which manage load prioritizations, load scheduling, load shedding, and fault recovery and management. Recent upgrades to hardware and modifications to software at both the LLP and AI system levels promise a drastic increase in speed, a significant increase in functionality and reliability, and potential for further examination of advanced automation techniques. The background, SSM/PMAD, interface to the Lewis Research Center test bed, the large autonomous spacecraft electrical power system, and future plans are discussed.

Bryan Walls↗
DOE OSTI2025

Rapid Prototyping Techniques for Organic Direct-Bonded-Copper Power Modules

Organic Direct-Bonded-Copper (ODBC) is a novel packaging technology for power modules which allows higher flexibility in layout design. In this work, a set of rapid prototyping techniques are developed for ODBC modules based on a polyimide dielectric material. These techniques enable fast and low-cost fabrication of modules with 3-Dimensional (3D) layout features. An example half-bridge (HB) silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) module is designed and prototyped using the proposed techniques aiming at ultra-low power loop inductance. Finite element analysis (FEA)-circuit co-simulations results and experimental results validate an approximately 0.71nH power loop inductance for the example module design.

36 MATERIALS SCIENCE↗
DOE OSTI2026

A Unified Wireless Charger, On-Board Charger, and Auxiliary Power Module for Electric Vehicle Charging Systems

This paper proposes a unified electric vehicle (EV) charging architecture that integrates wireless power transfer (WPT), an on-board charger (OBC), and an auxiliary power module (APM) within a single architecture. By sharing a multi-functional magnetic structure and active switch bridges, the proposed topology eliminates additional transformers and converter stages, reducing hardware complexity and improving power density. A multipurpose magnetic design achieves magnetic decoupling among the WPT, OBC, and APM functions while maintaining the required coupling for each mode. Through electrical reconfiguration, the WPT operates as an LCC-S converter, whereas the OBC and APM operate as dual-active-bridge (DAB) converters. The system supports multiple operating modes, including simultaneous high-voltage and lowvoltage battery charging. Finite-element and circuit simulations verify the magnetic characteristics and system operation, demonstrating the feasibility of the proposed unified architecture for EV charging applications.

Jo, Cheolhui [ORNL] (ORCID:0000000322692434)↗
DOE OSTI2024

Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging—Power Die, Power Module, and Converter Level: Part 2

Power electronics are increasingly being used to condition electricity for a wide array of applications, such as transportation (on land, air, and water), data centers, radio frequency, directed energy, wind, solar, and grid-tied applications. Here, to increase power density, performance, efficiency, and reliability-as well as to reduce cost-innovations and developments are needed in the multiphysics packaging of power electronics at a die, module, and converter level. This includes fundamental R&D related to emerging high-voltage, high-temperature, and high-switching-frequency power electronics, packaging materials, thermal materials and interfaces, fluid-based thermal management technologies, reliability, condition monitoring, and prognostics. Latest developments in this area are published as a Special Section on Multiphysics Aspects of Power Electronics Packaging. The first part was published in the May 2024 issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology (Volume 14, Issue 5). The second part of that Special Section is being published in this issue. A brief summary of the papers included in the second part are given below.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2025

The influence of laser power modulation on melt pool dynamics in laser powder bed fusion

While the majority of laser powder bed fusion (LPBF) metal additive manufacturing uses a continuous wave (CW) laser heat source, some commercial applications of LPBF additive manufacturing instead involve the modulation of the laser power on tens-of-microsecond timescales as an adjustable process variable. This article reports the use of in situ, high speed x-ray and optical imaging to probe melt pool fluid flow, defect formation, and nearby powder motion during LPBF with both modulated and CW laser heat sources. We observe melt pool dynamics unique to modulated laser melting even at very high duty cycles that are related to fluctuations in vapor depression depth, complex pore formation mechanisms, and changes to denudation physics when compared to CW melting. These behaviors are present in Ti–6Al–4V, 316L stainless steel, and AL1100 alloys but vary slightly as a function of material, indicating a substantial dependence on the viscosity and surface tension of the liquid metal. While high duty cycles produce weld tracks of comparable quality to CW melting, lower duty cycles introduce substantial defect concentrations. At intermediate duty cycles, careful control of modulation parameters can repeatably and precisely yield one pore per laser pulse, suggesting a method for intentionally inserting engineered porosity at specific sites during an LPBF build.

3D printing↗
DOE OSTI2026

Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation

Detecting internal defects in power electronics packages is critical for their performance and reliability, especially under extreme operating conditions, as these defects can lead to catastrophic failure if not properly addressed. Confocal scanning acoustic microscopy (C-SAM) plays a key role in the nondestructive evaluation of bond layer degradation within a power electronics package by detecting defects such as delamination, voids, and cracks. However, accurately quantifying and predicting these defects from C-SAM images remains a significant challenge due to the low noise-to-signal ratio, which typically arises from both imaging process and bond patterns itself. In this paper, we explore machine learning strategies for processing C-SAM images and providing predictive models of defect growth. We use C-SAM images of sintered copper and sintered silver samples, which are obtained under accelerated thermal experiments, as the representative dataset for our study. We investigate the effect of Fourier transforms and wavelet transforms on these datasets to remove high-frequency noise and address noise across multiple scales with histogram equalization to enhance the contrast and improve the visibility of defects. As a result, defect boundaries can be clearly distinguished, enabling more accurate tracking of their growth over time. We then employ different time-series forecasting algorithms on the denoised images to formulate an image-based lifetime prediction model. Statistical models and deep-learning techniques are trained on images obtained in the early stages of thermal shock, and defect growth in the later stages is predicted. Our work serves as a preliminary attempt to improve the accuracy of lifetime prediction models of power electronics packages, which is critical under extreme operating environments.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2026

Pulsed radio frequency power modulation for profile control in cryogenic reactive ion etching of silicon gratings

Cryogenic silicon etching with SF 6 /O 2 plasmas enables vertical sidewalls and smooth surfaces for high–aspect-ratio structures, yet precise control of etched profiles (sidewall angle, lateral etching, and linewidth retention) remains challenging under continuous-wave excitation due to coupling among radical fluxes, ion energy distributions, and in situ passivation dynamics. In this work, we investigated pulsed radio frequency bias delivery as a process knob for profile control during cryogenic silicon etching. Systematic experiments on 500 nm-wide, 1 μm-pitch gratings etched to 0.8–1.1 μm depth at 0.5–2 kHz pulsing frequency and 25%–75% duty cycle revealed strong dependencies of etch rate, linewidth, and sidewall angle on modulation conditions. We proposed a conceptual kinetic picture combined with feature-scale electrostatic analysis to understand the alternation of ion-driven etching and passivation recovery between on/off segments and local electric field shaping and modulation of ion trajectories within the trench. Moderate duty cycles (50%–75%) near 1 kHz achieved a balance between anisotropy and etch rate. These results demonstrate pulsed-bias modulation can be utilized to tune directionality and sidewall preservation in cryogenic SF 6 /O 2 etching, which are relevant to photonic, metrology, and quantum device fabrication.

36 MATERIALS SCIENCE↗
DOE OSTI2026

An International Round-Robin Study on Thermoelectric Module Testing and Development of Standard Power Generation Modules

An international round-robin study on thermoelectric power generation modules was conducted with nine participating laboratories. Two types of commercially available bismuth telluride modules, 30 mm × 30 mm and 40 mm × 40 mm, were used. A test protocol was followed with five temperature set points from 50°C to 150°C. Graphite sheets were used as thermal interface materials with test pressure at 100 psi (0.69 MPa). The results showed large lab-to-lab variations and the key source of uncertainty for module efficiency was identified as the heat flux measurement. In the meantime, significant uncertainty was also found in maximum electrical power (P max ) measurements. As a result of the round-robin, a “standard module” with 4 × 4 legs on a 20 mm × 20 mm platform was suggested. A skutterudite module and a half-Heusler module were produced with identical geometry and 4 mm × 4 mm × 8 mm legs. All transport properties to calculate the figure-of-merit, zT, were measured from ambient temperature to 500°C. Module performance was measured by two laboratories. Two finite-element-analysis (FEA)-based models were developed independently to simulate and predict the module performance. In conclusion, the standard modules eliminated significant test uncertainties and are aimed at assisting device design and achieving more accurate performance predictions.

Round-robin↗
DOE OSTI2025

Characterization of Impedance and Stability for Doubly-Fed Induction Generator Based on Voltage-Modulated Direct Power Control

Voltage-modulated direct power control (VM-DPC) applied to the doubly-fed induction generator (DFIG) offers superior steady-state and transient performance but remains underexplored for suppressing wideband oscillations. Here, this article proposes a comprehensive impedance for the VM-DPC-based DFIG, analyzing its impedance characteristics and stability mechanisms compared with the DFIG based on vector-oriented control (VOC). The unified power transfer function is defined for DFIGs employing VM-DPC or VOC to ensure consistent comparison benchmarks. The comprehensive impedance of VM-DPC-based DFIG, incorporating mechanical and grid-side converter (GSC) dynamics, is derived using complex vector modeling in the αβ -frame. Furthermore, the influence of VM-DPC parameters and grid strength on the stability of grid-connected DFIG systems is assessed through eigenvalue trajectory analysis. Impedance analysis reveals the significant contributions of mechanical and GSC dynamics to DFIG impedance, as well as the narrower frequency range of negative resistance in the VM-DPC-based DFIG compared to the VOC-based DFIG. Stability analysis identifies the VM-DPC parameters of the rotor-side converter as dominant factors affecting system stability and confirms that the VM-DPC-based DFIG achieves better stability under weak grid conditions than its VOC-based counterpart. These findings are validated through simulations and experiments.

42 ENGINEERING↗
NASA NTRSDate not supplied

Thermal Analysis of the Advanced Modular Power Systems (AMPS) Power Electronic Modules

In an effort to transform future space power system architectures and operations, the Advanced Modular Power Systems (AMPS) project is currently developing an interface standard for power electronic modules to enable modular architectures for space power systems. Each architecture would consist of one or more modular electronic units (MEU) that would comprise of a tailored combination of modules. The standard currently comprises modules enabling switchgear, power conversion, and data interfacing. The objective of the AMPS project is to enable the modularity and interchangeability of different architectures using these standardized modules in hopes of reducing complexity and cost, increasing inherent redundancy and reliability, and minimizing power system redesign for future programs. A key enabler to these future modular architectures will be the thermal management system, which has to contend with acquiring heat from the electronics modules at the card level and then transporting that heat to the radiator of the larger system. The focus of this paper, therefore, will be the thermal design and analysis of multiple AMPS power electronics modules and the development of their thermal-vacuum test.

Modular Power Electronics↗
DOE OSTI2026

Power Electronics Module with Integrated Ceramic Heat Exchanger

NREL, in partnership with Synteris and Packet Digital, has developed a 3D-printable ceramic package for power electronic modules to improve their thermal management, power density, performance, and lifetime. Existing power modules contain flat ceramic substrates that serve as both the electrically insulating component and thermal conductor that transfer the large heat outputs of these devices. The team has developed an additive manufacturing process that replaces the traditional insulating metalized substrate, substrate attach, and baseplate/heat exchanger with an additively-manufactured ceramic packaging that acts as both an electrical insulator and heat exchanger for better thermal management. The design, manufacturability, and function of this power module will be discussed.

25 ENERGY STORAGE↗
DOE OSTI2026

Power Electronic Development Challenges for High Power Density Integrated Electric Drive Applications

The ever-increasing demand for compact, efficient, and high-performance traction drive systems for transportation applications has accelerated the development of integrated electric drives. In these systems, the electric machine and inverter are integrated within a single housing, offering significant advantages in electrical performance, volume, weight, cost, and overall system efficiency. Despite these benefits, such high levels of integration introduce a new set of challenges, particularly in power electronic design and component selection. This article presents an in-depth investigation of a highly integrated electric drive architecture with an internal stator-mounted inverter, highlighting key design considerations and trade-offs aimed exclusively at maximizing system power density.Based on a comprehensive review of the literature, the power density of a voltage-source-inverter-driven electric drive is primarily governed by the volumetric contributions of the power modules, heat sinks, and DC-link capacitors. Accordingly, this work focuses on the optimization of these three critical components to enhance the inverter's overall power density. The proposed design achieves a power density of 100 kW/L, demonstrating the effectiveness of the presented approach for next-generation integrated electric drive systems.

33 ADVANCED PROPULSION SYSTEMS↗
DOE OSTI2025

A Modified DBC Substrate Improving Thermal Performance for Confined Space Applications

High-power modules use substrates to house the semiconductor device and for electrical insulation. These substrates are constructed with thermally conductive dielectric material sandwiched between two metals to extract heat from semiconductor chips. Thus, the required cooling performance of a power module is linked to the substrate’s thermal performance and can vary based on the substrate technologies. Here, in this study, five substrate technologies were evaluated for space-restricted applications: direct-bonded copper (DBC), an insulated metal substrate (IMS), a thermally annealed pyrolytic graphite (TPG)-based IMS, DBC-based double-sided cooling, and direct-bonded aluminum (DBA) where the heat sink is directly attached without thermal interface materials (TIMs). The finite element (FE) analysis results suggest that the popular DBC substrate has thermal performance better than that of the other substrates for space-constrained applications. To further improve the thermal performance, a modified DBC substrate was proposed where a copper block was added between the semiconductor and the DBC substrate to achieve heat spreading underneath the chip. The modified DBC performance was then compared with the aforementioned substrates and the results showed significant thermal performance improvement. The results were verified with experimental results where the proposed substrate showed 20% more loss handling capability compared to an identical DBC substrate.

42 ENGINEERING↗