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At least 19 records

CMOS Process Monitor

A CMOS Process Monitor, consisting of eight basic test structures, has been prepared to acquire key CMOS parameters to assist in VLSI wafer acceptance. The test structures can be probed using a 2 by N probe pad array and can be arranged to fit into either the interior or the scribe lane of an integrated circuit chip. In order to facilitate the general use of the monitor, a document is being prepared that describes its design, layout, measurement, and analysis. This paper describes the structures included in the monitor, the methodology used to create the monitor, and test results from the monitor.

Buehler, M. G.

A model of human decision making in multiple process monitoring situations

Human decision making in multiple process monitoring situations is considered. It is proposed that human decision making in many multiple process monitoring situations can be modeled in terms of the human's detection of process related events and his allocation of attention among processes once he feels event have occurred. A mathematical model of human event detection and attention allocation performance in multiple process monitoring situations is developed. An assumption made in developing the model is that, in attempting to detect events, the human generates estimates of the probabilities that events have occurred. An elementary pattern recognition technique, discriminant analysis, is used to model the human's generation of these probability estimates. The performance of the model is compared to that of four subjects in a multiple process monitoring situation requiring allocation of attention among processes.

Greenstein, J. S.

Monitoring processing properties of high performance thermoplastics using frequency dependent electromagnetic sensing

An in situ NDE dielectric impedance measurement method has been developed for ascertaining the cure processing properties of high temperature advanced thermoplastic and thermosetting resins, using continuous frequency-dependent measurements and analyses of complex permittivity over 9 orders of magnitude and 6 decades of frequency at temperatures up to 400 C. Both ionic and Debye-like dipolar relaxation processes are monitored. Attention is given to LARC-TPI, PEEK, and poly(arylene ether) resins' viscosity, glass transition temperature, recrystallization, and residual solvent content and evolution properties.

Kranbuehl, D. E.

Powder Bed Fusion Laser Beam Metals Additive Manufacturing: Process Monitoring Approaches for Qualification and Certification

The use of in-situ process monitoring is of interest to lower the cost of inspection for the qualification of powder bed fusion laser beam metal (PBF-LB/M) additively manufactured (AM) parts. Precise monitoring of the PBF-LB/M AM build process constitutes a multi-scale and multi-discipline task. There are several significant challenges to the in-situ approach: the synchronization of sensor signals to process steps; the physical interpretation and classification of sensor signals; managing very large datasets; and comparing the inputs with the observed monitoring signals. At NASA Langley Research Center, a configurable architecture additive testbed has been developed to monitor the build process with synchronized sensors. The philosophy and method adopted for the synchronization of the cameras with laser power and position throughout a complex PBF-LB/M AM build will be described. The synchronized in-situ monitoring signals are compared with ex-situ nondestructive inspection, x-ray computed tomography (XCT). Such comparisons permit a better understanding of how the sequential process actions of LPBF-AM can affect build quality. The multi-scale and complex process of printing additively manufactured (AM) parts can have unexpected, but predictable, build conditions that result in material microstructure variability. This presentation will describe an additive manufacturing model-based process metric (AM-PM) computational method that is a fully parallel reduced order modeling approach developed to evaluate the evolution of AM processes. This method couples the known sequence of the AM process with a physically informed nearest neighbors’ calculation to map the conditions of a part-scale build. The result is a map of the build that is derived directly from build files or in-situ process monitoring sensors. The methodology of the approach will be described and mapped to the porosity observed from XCT for a complex PBF-LB/M build. Such comparative results develop understanding of how the sequential process actions can affect the PBF-LB/M AM build quality and microstructure variability.

Laser Powder Bed Fusion

Role of NDE and In-Situ Process Monitoring in Managing Risk of AM Space Hardware

The recently published NASA-STD-6030 defines the Additive Manufacturing (AM) Requirements for Spaceflight Systems. Key aspects of the certification approach include the development of a qualified material process (QMP) and material characterization determined by part classification. Nondestructive evaluation (NDE) of the full surface and volume is required for all part classifications except those with negligible risk. NASA is exploring the use of in-process monitoring data to improve risk posture and supplement post-build inspection for complex parts. Currently, the most challenging obstacle to overcome is linking the indications in the monitoring data to the physics of the process and the final material state of the finished part. NASA is undertaking studies to understand and quantify this relationship for various monitoring methods. The desired goal is to develop a protocol to establish this correlation for any monitoring method. Once this correlation is known, the critical defect size can be linked to a representative indication in the monitoring data, and the capability of the monitoring system can be tested using the 90/95 probability of detection requirement for NDE methods. This would enable the use of in-process monitoring as a defect screening activity for AM part certification. Many high-criticality components built with AM have high complexity and therefore limited inspectability, so using in-process monitoring can help address this certification gap. The use of adaptive, closed-loop monitoring systems that alter the locked process will require a new approach to the QMP.

advanced manufacturing

Role of NDE and In-Situ Process Monitoring in Managing Risk of AM Space Hardware

The recently published NASA-STD-6030 defines the Additive Manufacturing (AM) Requirements for Spaceflight Systems. Key aspects of the certification approach include the development of a qualified material process (QMP) and material characterization determined by part classification. Nondestructive evaluation (NDE) of the full surface and volume is required for all part classifications except those with negligible risk. NASA is exploring the use of in-process monitoring data to improve risk posture and supplement post-build inspection for complex parts. Currently, the most challenging obstacle to overcome is linking the indications in the monitoring data to the physics of the process and the final material state of the finished part. NASA is undertaking studies to understand and quantify this relationship for various monitoring methods. The desired goal is to develop a protocol to establish this correlation for any monitoring method. Once this correlation is known, the critical defect size can be linked to a representative indication in the monitoring data, and the capability of the monitoring system can be tested using the 90/95 probability of detection requirement for NDE methods. This would enable the use of in-process monitoring as a defect screening activity for AM part certification. Many high-criticality components built with AM have high complexity and therefore limited inspectability, so using in-process monitoring can help address this certification gap. The use of adaptive, closed-loop monitoring systems that alter the locked process will require a new approach to the QMP.

additive manufacturing

In-Situ Process Monitoring, Synchronization, and Mapping Laser Powder Bed Fusion Builds of Ti6Al4V

The use of in-situ process monitoring is of interest to lower the cost of inspection for the qualification of laser powder bed fusion (LPBF) parts. Precise monitoring of the LPBF-AM build process constitutes a multi-scale and multi-discipline task. There are several significant challenges to the in-situ approach: the synchronization of sensor signals to process steps, the physical interpretation and classification of sensor signals, managing very large datasets, and comparing the inputs with the observed monitoring signals. At NASA Langley Research Center, a configurable architecture additive testbed has been developed to monitor the build process with synchronized sensors. The philosophy and method adopted for the synchronization of the cameras with laser power & position Ti-6Al-4V LPBF are described. The synchronized in-situ monitoring signals are compared with ex-situ nondestructive inspection and optical microscopy observations. Such comparisons permit a better understanding of how the sequential process actions of LPBF-AM can affect build quality.

Laser Powder Bed Fusion

A model of human decisionmaking in multiple process monitoring situations

It is proposed that human decisionmaking performance in multiple process monitoring situations can be modeled in terms of the detection of process related events and the allocation of attention among processes once events are felt to have occurred. An elementary pattern recognition technique, discriminant analysis, is used to generate estimates of event occurrence probability. A queueing theory framework is then utilized to incorporate these probabilities as well as other task characteristics into the solution of the attention allocation problem. The performance of the model is compared with that of subjects in two experiments.

Greenstein, J. S.

Dynamic dielectric analysis - A nondestructive cure process monitoring method

The cure processes of TGDDM-based epoxy thermosets and polysulfone thermoplastic resins were monitored by means of computer-controlled dynamic dielectric measurements made at frequencies 5 Hz to 5 million Hz. The values of capacitance and conductance were recorded, and the data were used to calculate the complex permittivity, an intensive property which is characteristic of the material's state of cure and independent of the amount of material measured. The frequency dependence of the complex permittivity value was used to determine the conductivity and mean relaxation time. The conductivity which is also an intensive variable and is independent of sample size, was correlated with the viscosity in both the epoxy and polysulfone systems.

Kranbuehl, D. E.

A Pulse-Compression Method for Process Monitoring

This paper describes, from a deterministic view point, an on-line process monitoring method for small signal behavior of time invariant stable systems at a given operating point. The monitoring is accomplished by using an consequence modulated low-pass wavelet as the probing signal, and a cyclic reference signal as the correlator. This method allows to achieve high resolution, high signal to noise ratio monitoring, and the acquired data can be used for on-line diagnosis.

Wu, N. Eva

A model of human event detection in multiple process monitoring situations

It is proposed that human decision making in many multi-task situations might be modeled in terms of the manner in which the human detects events related to his tasks and the manner in which he allocates his attention among his tasks once he feels events have occurred. A model of human event detection performance in such a situation is presented. An assumption of the model is that, in attempting to detect events, the human generates the probability that events have occurred. Discriminant analysis is used to model the human's generation of these probabilities. An experimental study of human event detection performance in a multiple process monitoring situation is described and the application of the event detection model to this situation is addressed. The experimental study employed a situation in which subjects simulataneously monitored several dynamic processes for the occurrence of events and made yes/no decisions on the presence of events in each process. Input to the event detection model of the information displayed to the experimental subjects allows comparison of the model's performance with the performance of the subjects.

Greenstein, J. S.

Punch stretching process monitoring using acoustic emission signal analysis. II - Application of frequency domain deconvolution

The coloring effect on the acoustic emission signal due to the frequency response of the data acquisition/processing instrumentation may bias the interpretation of AE signal characteristics. In this paper, a frequency domain deconvolution technique, which involves the identification of the instrumentation transfer functions and multiplication of the AE signal spectrum by the inverse of these system functions, has been carried out. In this way, the change in AE signal characteristics can be better interpreted as the result of the change in only the states of the process. Punch stretching process was used as an example to demonstrate the application of the technique. Results showed that, through the deconvolution, the frequency characteristics of AE signals generated during the stretching became more distinctive and can be more effectively used as tools for process monitoring.

Liang, Steven Y.

Towards Qualification and Certification of Laser Powder Bed Fusion Ti-6Al-4V with In-Situ Process Monitoring and Automated Defect Detection

Qualification and certification of laser powder bed fusion (LPBF) parts are two challenges that must be answered to ensure suitability for critical applications. In-situ monitoring using high frame rate thermal and conventional optical imaging sensors is applied to the LPBF build process. Currently, the large volume of data from such sensors becomes untenable for manual inspection in production environments. This presentation serves to address this in-situ monitoring deficiency in two ways. First, a framework for managing data streams from LPBF process monitoring sensors is described. Second, two candidate image analysis techniques are presented: one is a set of heuristics that are easily interpretable, and the other is an uninterpretable convolutional neural network. These strategies are compared in terms of performance, computational expense, and speed. These methodologies represent platforms for connecting processing conditions to process modeling efforts aligned with the qualification and certification mission for LPBF Ti-6Al-4V components.

Qualification

Electrical Resistance as a NDE Technique to Monitor Processing and Damage Accumulation in SiC/SiC Composites

Ceramic matrix composites are suitable for high temperature structural applications such as turbine airfoils and hypersonic thermal protection systems. The employment of these materials in such applications is limited by the ability to process components reliable and to accurately monitor and predict damage evolution that leads to failure under stressed-oxidation conditions. Current nondestructive methods such as ultrasound, x-ray, and thermal imaging are limited in their ability to quantify small scale, transverse, in-plane, matrix cracks developed over long-time creep and fatigue conditions. Electrical resistance of SiC/SiC composites is one technique that shows special promise towards this end. Since both the matrix and the fibers are conductive, changes in matrix or fiber properties should relate to changes in electrical conductivity along the length of a specimen or part. Initial efforts to quantify the electrical resistance of different fiber and different matrix SiC/SiC composites will be presented. Also, the effect of matrix cracking on electrical resistivity for several composite systems will be presented. The implications towards electrical resistance as a technique applied to composite processing, damage detection, and life-modeling will be discussed.

Smith, Craig

End-of-fabrication CMOS process monitor

A set of test 'modules' for verifying the quality of a complementary metal oxide semiconductor (CMOS) process at the end of the wafer fabrication is documented. By electrical testing of specific structures, over thirty parameters are collected characterizing interconnects, dielectrics, contacts, transistors, and inverters. Each test module contains a specification of its purpose, the layout of the test structure, the test procedures, the data reduction algorithms, and exemplary results obtained from 3-, 2-, or 1.6-micrometer CMOS/bulk processes. The document is intended to establish standard process qualification procedures for Application Specific Integrated Circuits (ASIC's).

Buehler, M. G.

Modeling and Real-Time Process Monitoring of Organometallic Chemical Vapor Deposition of III-V Phosphides and Nitrides at Low and High Pressure

The purpose of this paper is to review modeling and real-time monitoring by robust methods of reflectance spectroscopy of organometallic chemical vapor deposition (OMCVD) processes in extreme regimes of pressure. The merits of p-polarized reflectance spectroscopy under the conditions of chemical beam epitaxy (CBE) and of internal transmission spectroscopy and principal angle spectroscopy at high pressure are assessed. In order to extend OMCVD to materials that exhibit large thermal decomposition pressure at their optimum growth temperature we have designed and built a differentially-pressure-controlled (DCP) OMCVD reactor for use at pressures greater than or equal to 6 atm. We also describe a compact hard-shell (CHS) reactor for extending the pressure range to 100 atm. At such very high pressure the decomposition of source vapors occurs in the vapor phase, and is coupled to flow dynamics and transport. Rate constants for homogeneous gas phase reactions can be predicted based on a combination of first principles and semi-empirical calculations. The pressure dependence of unimolecular rate constants is described by RRKM theory, but requires variational and anharmonicity corrections not included in presently available calculations with the exception of ammonia decomposition. Commercial codes that include chemical reactions and transport exist, but do not adequately cover at present the kinetics of heteroepitaxial crystal growth.

Bachmann, K. J.

Regulated bioluminescence as a tool for bioremediation process monitoring and control of bacterial cultures

An effective on-line monitoring technique for toxic waste bioremediation using bioluminescent microorganisms has shown great potential for the description and optimization of biological processes. The lux genes of the bacterium Vibrio fischeri are used by this species to produce visible light. The lux genes can be genetically fused to the control region of a catabolic gene, with the result that bioluminescence is produced whenever the catabolic gene is induced. Thus the detection of light from a sample indicates that genetic expression from a specific gene is occurring. This technique was used to monitor biodegradation of specific contaminants from waste sites. For these studies, fusions between the lux genes and the operons for naphthalene and toluene/xylene degradation were constructed. Strains carrying one of these fusions respond sensitively and specifically to target substrates. Bioluminescence from these cultures can be rapidly measured in a nondestructive and noninvasive manner. The potential for this technique in this and other biological systems is discussed.

Burlage, Robert S.