Search NASA⌕ Search

SEARCH · Search NASA

Results for “program package”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 19 records

Energetic particles experiment instrumentation packaging program for IMP-F (Explorer 34) and IMP-G (Explorer 41) NASA Interplanetary Monitoring Platform program

The package design and assembly techniques for the IMP-F and IMP-G space-physics experiments, provided for the NASA Interplanetary Monitoring Platform Program are described. Thin-film, hybrid, integrated circuits used in these instruments to increase component density and reliability, and special procedures and precautions for the fabrication of space hardware are described.

Source record↗

Supplemental Structural Analyses Used in Support of Certification of the Defense Programs Package 3

The Defense Programs Package (DPP)-3 is to be certified by the National Nuclear Security Administration (NNSA) Packaging and Transportation Division (PTD). Certification is based on successful physical testing of the package, and six certification test units (CTUs) have been subjected to the normal conditions of transport (NCT) and hypothetical accident conditions (HAC) outlined in Title 10 of the Code of Federal Regulations Part 71 (10 CFR 71). During regulatory testing of one of the CTUs, the drum lid closure bolt closest to the impact surface failed during the HAC 30-ft side drop. One of the testing goals for this CTU was to minimize the thermal pathway from the drum exterior shell to the containment vessel (CV) flange and O-rings, leading to the maximum damage scenario in preparation for thermal testing at 1475 °F. Therefore, the puncture bar impact proceeded as originally planned by striking the side wall of the package exterior closest to the location of the CV flange. This puncture bar impact did not attempt to exploit the region of the failed drum lid closure bolt to potentially cause more damage to the package. After the conclusion of regulatory testing, the DPP-3 package finite element model was used to numerically evaluate the effects of puncture bar impacts to the drum exterior in the vicinity of the failed drum lid closure bolt to further demonstrate the robustness of the DPP-3 design. Three alternate puncture bar impact locations and orientations were evaluated to demonstrate that these puncture bar impacts would not substantially reduce the effectiveness of the DPP-3 packaging. This paper describes the supplemental finite element models performed and structural analysis results that demonstrate the alternate HAC 40-in. puncture bar impact tests would have no deleterious effect on the performance of the DPP-3.

Sakalaukus Jr., Peter J.↗

Modal analysis computer program package

Modal analysis computer program package for finding frequencies and mode shapes of any linear discrete system governed by generalized eigenvalue equation

Mather, D. L.↗

Structural Analysis Approach for the Defense Programs Package 3 (DPP-3)

The Pacific Northwest National Laboratory (PNNL) is the design authority for a new Type B hazardous materials transportation package designated as the Defense Programs Package 3 (DPP-3) for the U.S. Department of Energy (DOE) National Nuclear Security Administration (NNSA). The DPP-3 has been developed using similar materials and fabrication methods employed in previous U.S. Nuclear Regulatory Commission (NRC), DOE, and NNSA certified packages. The DPP-3 design criteria are derived from the American Society of Mechanical Engineers (ASME) Boiler and Pressure Vessel Code (BPVC), NNSA guidance and NRC regulatory guides in order to safely and securely transport a variety of payloads. Final regulatory approval by the NNSA will require physical testing to demonstrate that the containment vessel (CV) remains leaktight after enduring the entire regulatory testing sequence prescribed in Title 10 of the Code of Federal Regulations Part 71 (10 CFR 71). In order to gain confidence that the DPP-3 will remain leaktight after testing, the DPP-3 has been structurally analyzed using the Finite Element Analysis (FEA) software LS-DYNA. The FEA analyses serve two general purposes: first, they aid in design and development of the package, and second, they advise as to which drop orientations are expected to cause the most damage during regulatory testing. This paper will discuss how the design criteria are incorporated into analytical techniques needed to evaluate the FEA structural simulation results for 10 CFR 71 conditions to give confidence the DPP-3 testing campaign will be successful.

Sakalaukus Jr., Peter J.↗

The State of NEPP NASA Electronic Parts & Packaging Program

The presentation is about the NASA Electronic Parts & Packaging (NEPP) Program. The mission statement of NEPP, “Provide NASA’s leadership for developing and maintaining guidance for the screening, qualification, test, and reliable use of EEE parts by NASA, in collaboration with other government agencies and industry” is dissected and explained using examples.

manufacturing↗

ChemML : A machine learning and informatics program package for the analysis, mining, and modeling of chemical and materials data

ChemML is an open machine learning (ML) and informatics program suite that is designed to support and advance the data-driven research paradigm that is currently emerging in the chemical and materials domain. ChemML allows its users to perform various data science tasks and execute ML workflows that are adapted specifically for the chemical and materials context. Key features are automation, general-purpose utility, versatility, and user-friendliness in order to make the application of modern data science a viable and widely accessible proposition in the broader chemistry and materials community. Finally, ChemML is also designed to facilitate methodological innovation, and it is one of the cornerstones of the software ecosystem for data-driven in silico research.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

Coupled-cluster techniques for computational chemistry: The CFOUR program package

An up-to-date overview of the CFOUR program system is given. After providing a brief outline of the evolution of the program since its inception in 1989, a comprehensive presentation is given of its well-known capabilities for high-level coupled-cluster theory and its application to molecular properties. Subsequent to this generally well-known background information, much of the remaining content focuses on lesser-known capabilities of CFOUR, most of which have become available to the public only recently or will become available in the near future. Each of these new features is illustrated by a representative example, with additional discussion targeted to educating users as to classes of applications that are now enabled by these capabilities. Lastly, some speculation about future directions is given, and the mode of distribution and support for CFOUR are outlined in the appendix.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

An improved multiple linear regression and data analysis computer program package

NEWRAP, an improved version of a previous multiple linear regression program called RAPIER, CREDUC, and CRSPLT, allows for a complete regression analysis including cross plots of the independent and dependent variables, correlation coefficients, regression coefficients, analysis of variance tables, t-statistics and their probability levels, rejection of independent variables, plots of residuals against the independent and dependent variables, and a canonical reduction of quadratic response functions useful in optimum seeking experimentation. A major improvement over RAPIER is that all regression calculations are done in double precision arithmetic.

Sidik, S. M.↗

COLUMBUS─An Efficient and General Program Package for Ground and Excited State Computations Including Spin–Orbit Couplings and Dynamics

The COLUMBUS program system provides the tools for performing high-level multireference (MR) computations, including the multireference configuration interaction (MRCI) method and its multireference averaged quadratic coupled cluster (MR-AQCC) extension, allowing computations on a wide range of fascinating atomic and molecular systems, including the treatment of open-shells and complicated excited state phenomena. The inclusion of spin−orbit coupling (SOC) directly within the MRCI step enables the description of systems containing heavy elements, such as lanthanides and actinides, whose properties are strongly influenced by SOC. Analytic energy gradients and nonadiabatic couplings at the correlated MRCI level provide the foundation for a variety of dynamics studies, giving insight into ultrafast photochemistry. New and ongoing method developments in COLUMBUS include the computation of spin densities, improved descriptions of ionic states, enhancements to the AQCC method, and the porting of COLUMBUS to graphical processing units (GPUs). New external interfaces enable an enhanced description of electronic resonances and molecules in strong laser fields. This work highlights these new developments while providing a detailed account of the diverse applications of COLUMBUS in recent years.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗

NASA Electronic Parts and Packaging Program

NEPP program objectives are to: (1) Access the reliability of newly available electronic parts and packaging technologies for usage on NASA projects through validations, assessments, and characterizations, and the development of test methods/tools; (2)Expedite infusion paths for advanced (emerging) electronic parts and packaging technologies by evaluations of readiness for manufacturability and project usage consideration; (3) Provide NASA projects with technology selection, application, and validation guidelines for electronic parts and packaging hardware and processes; nd (4) Retain and disseminate electronic parts and packaging quality assurance, reliability validations, tools, and availability information to the NASA community.

Kayali, Sammy↗

Board Level Proton Testing Book of Knowledge for NASA Electronic Parts and Packaging Program

This book of knowledge (BoK) provides a critical review of the benefits and difficulties associated with using proton irradiation as a means of exploring the radiation hardness of commercial-off-the-shelf (COTS) systems. This work was developed for the NASA Electronic Parts and Packaging (NEPP) Board Level Testing for the COTS task. The fundamental findings of this BoK are the following. The board-level test method can reduce the worst case estimate for a board's single-event effect (SEE) sensitivity compared to the case of no test data, but only by a factor of ten. The estimated worst case rate of failure for untested boards is about 0.1 SEE/board-day. By employing the use of protons with energies near or above 200 MeV, this rate can be safely reduced to 0.01 SEE/board-day, with only those SEEs with deep charge collection mechanisms rising this high. For general SEEs, such as static random-access memory (SRAM) upsets, single-event transients (SETs), single-event gate ruptures (SEGRs), and similar cases where the relevant charge collection depth is less than 10 μm, the worst case rate for SEE is below 0.001 SEE/board-day. Note that these bounds assume that no SEEs are observed during testing. When SEEs are observed during testing, the board-level test method can establish a reliable event rate in some orbits, though all established rates will be at or above 0.001 SEE/board-day. The board-level test approach we explore has picked up support as a radiation hardness assurance technique over the last twenty years. The approach originally was used to provide a very limited verification of the suitability of low cost assemblies to be used in the very benign environment of the International Space Station (ISS), in limited reliability applications. Recently the method has been gaining popularity as a way to establish a minimum level of SEE performance of systems that require somewhat higher reliability performance than previous applications. This sort of application of the method suggests a critical analysis of the method is in order. This is also of current consideration because the primary facility used for this type of work, the Indiana University Cyclotron Facility (IUCF) (also known as the Integrated Science and Technology (ISAT) hall), has closed permanently, and the future selection of alternate test facilities is critically important. This document reviews the main theoretical work on proton testing of assemblies over the last twenty years. It augments this with review of reported data generated from the method and other data that applies to the limitations of the proton board-level test approach. When protons are incident on a system for test they can produce spallation reactions. From these reactions, secondary particles with linear energy transfers (LETs) significantly higher than the incident protons can be produced. These secondary particles, together with the protons, can simulate a subset of the space environment for particles capable of inducing single event effects (SEEs). The proton board-level test approach has been used to bound SEE rates, establishing a maximum possible SEE rate that a test article may exhibit in space. This bound is not particularly useful in many cases because the bound is quite loose. We discuss the established limit that the proton board-level test approach leaves us with. The remaining possible SEE rates may be as high as one per ten years for most devices. The situation is actually more problematic for many SEE types with deep charge collection. In cases with these SEEs, the limits set by the proton board-level test can be on the order of one per 100 days. Because of the limited nature of the bounds established by proton testing alone, it is possible that tested devices will have actual SEE sensitivity that is very low (e.g., fewer than one event in 1 × 10(exp 4) years), but the test method will only be able to establish the limits indicated above. This BoK further examines other benefits of proton board-level testing besides hardness assurance. The primary alternate use is the injection of errors. Error injection, or fault injection, is something that is often done in a simulation environment. But the proton beam has the benefit of injecting the majority of actual SEEs without risk of something being missed, and without the risk of simulation artifacts misleading the SEE investigation.

Guertin, Steven M.↗

Evaluation of Small Form Factor Fiber Optic Interconnects for the NASA Electronics Parts and Packaging Program (NEPP)

The Diamond AVIM optical fiber connector has been used for over a decade in flight environments. AVIM which stands for Aviation Intermediate Maintenance is always referenced as a fiber optic connector type from the DIN (Deutsches Institut fur Normung) family of optical fiber connectors. The newly available Mini AVIM and DMI (Definition Multimedia Interface) connectors also by Diamond provide similar features as the high performance AVIM with the added benefits of being small form factor for board mount and internal box use where long connectors and strain relief can not be accommodated. Transceiver, fiber laser technology and receiver optic technology based on small sized constraints will benefit the most by the reduction in connector form factor. It is for this reason that the Mini AVIM is being evaluated for multimode and single mode optical fiber use in both fiber based and cable based packaging configurations. In a fiber based termination, there are no cable materials to bond to the connector. The only bonding that is conducted is the mounting of the fiber with epoxy to the connector ferrules (which are called DMI ferrules). In a cable configuration, the compatibility of the connector subcomponents along with the upjacketing materials of the cable around the fiber needs to be considered carefully for termination fabrication. Cabled terminations will show greater insertion loss and high probability of failures during thermal cycling testing. This is due to the stressing of the combination of materials that each have different Coefficients of Thermal Expansion (CTE's) and that are bonded together to the connector subcomponents. As the materials flex during thermal excursions, forces are applied to the termination and can make the system fail if the grouping of materials (per their CTE's) are not compatible and this includes cable materials, epoxies, ferrule and connector body components. For this evaluation, multimode 100 micron core step index fiber was used for the fiber terminated condition, and single mode SMF-28 upjacketed with W.L. Gore Flexlite was used for the cabled configuration. For background purposes, a comparison is presented here for information purposes between the high performance AVIM connector features and the Mini AVIM small form factor connectors. Basic connector features are described here.

Ott, Melanie↗

Recent developments in the PySCF program package

PySCF is a Python-based general-purpose electronic structure platform that supports first-principles simulations of molecules and solids as well as accelerates the development of new methodology and complex computational workflows. Here, we explain the design and philosophy behind PySCF that enables it to meet these twin objectives. With several case studies, we show how users can easily implement their own methods using PySCF as a development environment. We then summarize the capabilities of PySCF for molecular and solid-state simulations. Finally, we describe the growing ecosystem of projects that use PySCF across the domains of quantum chemistry, materials science, machine learning, and quantum information science.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗