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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Grain quality inspection system

A review of grain quality indicators and measurement methods was conducted in order to assess the feasibility of using remote sensing technology to develop a continuous monitoring system for use during grain transfer operations. Most detection methods were found to be too slow or too expensive to be incorporated into the normal inspection procedure of a grain elevator on a continuous basis. Two indicators, moisture content and broken corn and foreign material, show potential for automation and are of an economic value. A microprocessor based system which utilizes commercially available electronic moisture meter was developed and tested. A method for automating BCFM measurement is described. A complete system description is presented along with performance test results.

Flood, C. A., Jr.↗

Ultrasonic quality inspection of bonded honeycomb assemblies is automated

Inspection system for bonded honeycomb assemblies is accurate, fast, and automated. The ultrasonic system consists of inner and outer transducer positioning assemblies with suitable motor controls, a centerless turntable assembly, water squirter assemblies, and an inspection program completely encoded on tape suitable for use on a high speed computer.

Kammerer, C. C.↗

Guidelines for software inspections

Quality control inspections are software problem finding procedures which provide defect removal as well as improvements in software functionality, maintenance, quality, and development and testing methodology is discussed. The many side benefits include education, documentation, training, and scheduling.

Source record↗

System Enhancements for Mechanical Inspection Processes

Quality inspection of parts is a major component to any project that requires hardware implementation. Keeping track of all of the inspection jobs is essential to having a smooth running process. By using HTML, the programming language ColdFusion, and the MySQL database, I created a web-based job management system for the 170 Mechanical Inspection Group that will replace the Microsoft Access based management system. This will improve the ways inspectors and the people awaiting inspection view and keep track of hardware as it is in the inspection process. In the end, the management system should be able to insert jobs into a queue, place jobs in and out of a bonded state, pre-release bonded jobs, and close out inspection jobs.

inspection processes↗

Design and development of polyphenylene oxide foam as a reusable internal insulation for LH2 tanks

Material specification and fabrication process procedures for foam production are presented. The properties of mechanical strength, modulus of elasticity, density and thermal conductivity were measured and related to foam quality. Properties unique to the foam such as a gas layer insulation, density gradient parallel to the fiber direction, and gas flow conductance in both directions were correlated with foam quality. Inspection and quality control tests procedures are outlined and photographs of test equipment and test specimens are shown.

Source record↗

Image Quality Indicator for Infrared Inspections

The quality of images generated during an infrared thermal inspection depends on many system variables, settings, and parameters to include the focal length setting of the IR camera lens. If any relevant parameter is incorrect or sub-optimal, the resulting IR images will usually exhibit inherent unsharpness and lack of resolution. Traditional reference standards and image quality indicators (IQIs) are made of representative hardware samples and contain representative flaws of concern. These standards are used to verify that representative flaws can be detected with the current IR system settings. However, these traditional standards do not enable the operator to quantify the quality limitations of the resulting images, i.e. determine the inherent maximum image sensitivity and image resolution. As a result, the operator does not have the ability to optimize the IR inspection system prior to data acquisition. The innovative IQI described here eliminates this limitation and enables the operator to objectively quantify and optimize the relevant variables of the IR inspection system, resulting in enhanced image quality with consistency and repeatability in the inspection application. The IR IQI consists of various copper foil features of known sizes that are printed on a dielectric non-conductive board. The significant difference in thermal conductivity between the two materials ensures that each appears with a distinct grayscale or brightness in the resulting IR image. Therefore, the IR image of the IQI exhibits high contrast between the copper features and the underlying dielectric board, which is required to detect the edges of the various copper features. The copper features consist of individual elements of various shapes and sizes, or of element-pairs of known shapes and sizes and with known spacing between the elements creating the pair. For example, filled copper circles with various diameters can be used as individual elements to quantify the image sensitivity limit. Copper line-pairs of various sizes where the line width is equivalent to the spacing between the lines can be used as element-pairs to quantify the image resolution limit.

Burke, Eric↗

Printed Circuit Board Inspection and Quality Control - PCB Failure Causes and Cures

This two day workshop will discuss a range of topics, including root cause analysis, physics-of-failure principles and failure mechanisms in printed circuit boards. Printed circuit boards (PCBs) are the baseline for electronics manufacturing upon which electronic components are mounted and formed into electronic systems. PCBs are used in a variety of electronic circuits from simple one-transistor amplifiers to large super computers. A PCB serves three main functions: 1) it provides the necessary mechanical support for the components in the circuit 2) it provides the necessary electrical interconnections, and 3) it bears some form of legend which identifies the components it carries. The failure modes on the PCBs can be categorized in a hierarchical structure, in which the mechanisms and causes are site or location dependant. Specimen preparation techniques, non-destructive and destructive analysis, and materials characterization will also be discussed. The first day of the workshop will present methodologies for identifying potential failure mechanisms in electronics based on the failure history and, systematic approaches to root cause analysis. The second day will cover failure analysis techniques geared towards various failure mechanisms, along with numerous component and PCB assembly failure analysis case studies that illustrate the techniques and analysis. Failure analysis case studies will be used to illustrate the techniques and analysis principles to arrive at the root cause(s) of field failures on printed circuit boards, active components, and assemblies.

Printed circuit boards↗

WELDSMART: A vision-based expert system for quality control

This work was aimed at exploring means for utilizing computer technology in quality inspection and evaluation. Inspection of metallic welds was selected as the main application for this development and primary emphasis was placed on visual inspection, as opposed to other inspection methods, such as radiographic techniques. Emphasis was placed on methodologies with the potential for use in real-time quality control systems. Because quality evaluation is somewhat subjective, despite various efforts to classify discontinuities and standardize inspection methods, the task of using a computer for both inspection and evaluation was not trivial. The work started out with a review of the various inspection techniques that are used for quality control in welding. Among other observations from this review was the finding that most weld defects result in abnormalities that may be seen by visual inspection. This supports the approach of emphasizing visual inspection for this work. Quality control consists of two phases: (1) identification of weld discontinuities (some of which may be severe enough to be classified as defects), and (2) assessment or evaluation of the weld based on the observed discontinuities. Usually the latter phase results in a pass/fail judgement for the inspected piece. It is the conclusion of this work that the first of the above tasks, identification of discontinuities, is the most challenging one. It calls for sophisticated image processing and image analysis techniques, and frequently ad hoc methods have to be developed to identify specific features in the weld image. The difficulty of this task is generally not due to limited computing power. In most cases it was found that a modest personal computer or workstation could carry out most computations in a reasonably short time period. Rather, the algorithms and methods necessary for identifying weld discontinuities were in some cases limited. The fact that specific techniques were finally developed and successfully demosntrated to work illustrates that the general approach taken here appears to be promising for commercial development of computerized quality inspection systems. Inspection based on these techniques may be used to supplement or substitute more elaborate inspection methods, such as x-ray inspections.

Andersen, Kristinn↗

Testing methods and techniques: Quality control and nondestructive testing: A complication

A variety of devices and techniques useful in nondestructive testing is described. Ranging in complexity from an automated ultrasonic testing system designed for complex laminated honeycomb structures, to a flexible leak detector probe, the items represent either potential savings in cost and time, or improvement in inspection quality over past techniques. Data cover weld and braze inspection, leak detection, and inspection of composite materials.

Source record↗

Advanced manufacturing development of a composite empennage component for L-1011 aircraft

This is the final report of technical work conducted during the fourth phase of a multiphase program having the objective of the design, development and flight evaluation of an advanced composite empennage component manufactured in a production environment at a cost competitive with those of its metal counterpart, and at a weight savings of at least 20 percent. The empennage component selected for this program is the vertical fin box of the L-1011 aircraft. The box structure extends from the fuselage production joint to the tip rib and includes front and rear spars. During Phase 4 of the program, production quality tooling was designed and manufactured to produce three sets of covers, ribs, spars, miscellaneous parts, and subassemblies to assemble three complete ACVF units. Recurring and nonrecurring cost data were compiled and documented in the updated producibility/design to cost plan. Nondestruct inspections, quality control tests, and quality acceptance tests were performed in accordance with the quality assurance plan and the structural integrity control plan. Records were maintained to provide traceability of material and parts throughout the manufacturing development phase. It was also determined that additional tooling would not be required to support the current and projected L-1011 production rate.

Alva, T.↗

Optically Stimulated Electron Emission Contamination Monitor and Method

An apparatus and method for performing quality inspections on a test surface based on optically stimulated emission of electrons. In one embodiment, the apparatus comprises a device for producing optical radiation having a plurality of different spectrum lines, selecting at least one of the spectrum lines, and directing the selected spectrum line to the test surface, and circuitry for detecting a current of photoelectrons emitted from the test surface, generating a signal indicative of photoelectron current, and for indicating a condition of quality based on the generated signal indicative of the photoelectron current. In one embodiment, the method comprises producing optical radiation having a plurality of different spectrum lines, selecting at least one of the spectrum lines and directing the selected spectrum line to the test surface, detecting a current of photoelectrons emitted from the test surface and generating a signal indicative of photoelectron current, and indicating a condition of quality based on the generated signal indicative of the photoelectron current.

Christopher S Welch↗

Method Developed for the High-Temperature Nondestructive Evaluation of Fiber-Reinforced Silicon Carbide Ceramic Matrix Composites

Ceramic matrix composites have emerged as candidate materials to allow higher operating temperatures (1000 to 1400 C) in gas turbine engines. A need, therefore, exists to develop nondestructive methods to evaluate material integrity at the material operating temperature by monitoring thermal and mechanical fatigue. These methods would also have potential as quality inspection tools. The goal of this investigation at the NASA Lewis Research Center is to survey and correlate the temperature-dependent damping and stiffness of advanced ceramic composite materials with imposed thermal and stress histories that simulate in-service turbine engine conditions. A typical sample size of 100 by 4 by 2 cubic millimeters, along with the specified stiffness and density, placed the fundamental vibration frequencies between 100 and 2000 Hz. A modified Forster apparatus seemed most applicable to simultaneously measure both damping and stiffness. Testing in vacuum reduced the effects of air on the measurements. In this method, a single composite sample is vibrated at its fundamental tone; then suddenly, the mechanical excitation is removed so that the sample's motion freely decays with time. Typical results are illlustrated in this paper.

Goldsby, Jon C.↗

Inspection criteria ensure quality control of parallel gap soldering

Investigation of parallel gap soldering of electrical leads resulted in recommendation on material preparation, equipment, process control, and visual inspection criteria to ensure reliable solder joints. The recommendations will minimize problems in heat-dwell time, amount of solder, bridging conductors, and damage of circuitry.

Burka, J. A.↗

Source Inspection Scheduling Calendar

Quality is an essential component for creating flight hardware travelling through space since the hardware is extremely expensive and cannot be reworked or repaired once launched. An important step in this process is ensuring the quality of hardware procured from Jet Propulsion Laboratory's (JPL) suppliers. An important element of determining supplier quality is source inspection. Source inspections are performed at suppliers' facilities by JPL employeesto ensure that hardware characteristics are acceptable before being covered up and/or delivered to JPL.

quality assurance↗