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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2017

Thermophysical Properties of Cold- and Vacuum Plasma-Sprayed Cu-Cr-X Alloys, NiAl and NiCrAlY Coatings I: Electrical and Thermal Conductivity, Thermal Diffusivity, and Total Hemispherical Emissivity

This two-part paper reports the thermophysical properties of several cold- and vacuum plasma-sprayed monolithic Cu- and Ni-based alloy coatings. Part I presents the electrical and thermal conductivity, thermal diffusivity, and total hemispherical emissivity data, while Part II reports the specific heat capacity data for these coatings. Metallic copper alloys and stoichiometric NiAl and NiCrAlY coatings were fabricated by either the cold spray or the vacuum plasma spray deposition processes for thermal property measurements between 77 and 1223 K. The temperature dependencies of the thermal conductivities, thermal diffusivities, electrical conductivities, and total hemispherical emissivities of these cold- and vacuum-sprayed monolithic coatings are reported in this paper. The electrical and thermal conductivity data correlate reasonably well for Cu-8%Cr-1%Al, Cu-23%Cr-5%Al, and NiAl in accordance with the Wiedemann–Franz (WF) law although a better fit is obtained using the Smith–Palmer relationship. The Lorentz numbers determined from the WF law are close to the theoretical value.

36 MATERIALS SCIENCE↗
NASA NTRS2017

Thermophysical Properties of Cold and Vacuum Plasma Sprayed Cu-Cr-X Alloys, NiAl and NiCrAlY Coatings: Electrical and Thermal Conductivity, Thermal Diffusivity, and Total Hemispherical Emissivity - Part 1

This two-part paper reports the thermophysical properties of several cold and vacuum plasma sprayed monolithic Cu and Ni-based alloy coatings. Part I presents the electrical and thermal conductivity, thermal diffusivity, and total hemispherical emissivity data while Part II reports the specific heat capacity data for these coatings. Metallic copper alloys, stoichiometric NiAl and NiCrAlY coatings were fabricated by either the cold sprayed or the vacuum plasma spray deposition processes for thermal property measurements between 77 and 1223 K. The temperature dependencies of the thermal conductivities, thermal diffusivities, electrical conductivities and total hemispherical emissivities of these cold and vacuum sprayed monolithic coatings are reported in this paper. The electrical and thermal conductivity data correlate reasonably well for Cu-8%Cr-1%Al, Cu-23%Cr-5%Al and NiAl in accordance with the Wiedemann-Franz (WF) law although a better fit is obtained using the Smith-Palmer relationship. The Lorentz numbers determined from the WF law are close to the theoretical value.

Raj, S. V.↗
NASA NTRS1991

Experimental thermal conductivity, thermal diffusivity, and specific heat values for mixtures of nitrogen, oxygen, and argon

Experimental measurements of thermal conductivity and thermal diffusivity obtained with a transient hot-wire apparatus are reported for three mixtures of nitrogen, oxygen, and argon. Values of the specific heat, Cp, are calculated from these measured values and the density calculated with an equation of state. The measurements were made at temperatures between 65 and 303 K with pressures between 0.1 and 70 MPa. The data cover the vapor, liquid, and supercritical gas phases for the three mixtures. The total reported points are 1066 for the air mixture (78.11 percent nitrogen, 20.97 percent oxygen, and 0.92 percent argon), 1058 for the 50 percent nitrogen, 50 percent oxygen mixture, and 864 for the 25 percent nitrogen, 75 oxygen mixture. Empirical thermal conductivity correlations are provided for the three mixtures.

Perkins, R. A.↗
DOE OSTI2011

In-flight alloying of nanocrystalline yttria-stabilized zirconia using suspension spray to produce ultra-low thermal conductivity thermal barriers.

Previous researchers have shown that it is possible to combine rare-earth oxides with the standard thermal barrier coating material (4.5 mol% Y{sub 2}O{sub 3}-ZrO{sub 2} or YSZ) to form ultra-low thermal conductivity coatings using a standard powder manufacturing route. A similar approach to making low thermal conductivity coatings by adding rare-earth oxides is discussed presently, but a different manufacturing route was used. This route involved dissolving hydrated ytterbium and neodymium nitrates into a suspension of 80 nm diameter 4.5 mol% YSZ powder and ethanol. Suspension plasma spray was then used to create coatings in which the YSZ powders were alloyed with rare-earth elements while the plasma transported the melted powders to the substrate. Mass spectrometry measurements showed a YSZ coating composition, in mol%, of ZrO{sub 2}-4.4 Y{sub 2}O{sub 3}-1.4 Nd{sub 2}O{sub 3}-1.3 Yb{sub 2}O{sub 3}. The amount of Yb{sup 3+} and Nd{sup 3+} ions in the final coating was {approx}50% of that added to the starting suspension. Wide-angle X-ray diffraction revealed a cubic ZrO{sub 2} phase, consistent with the incorporation of more stabilizer into the zirconia crystal structure. The total porosity in the coatings was {approx}35-36%, with a bulk density of 3.94 g/cm{sup 3}. Small-angle X-ray scattering measured an apparent void specific surface area of {approx}2.68 m{sup 2}/cm{sup 3} for the alloyed coating and {approx}3.19 m{sup 2}/cm{sup 3} for the baseline coating. Thermal conductivity (k{sub th}) of the alloyed coating was {approx}0.8 W/m/K at 800 C, as compared with {approx}1.5 W/m/K at 800 C for the YSZ-only baseline coating. After 50 h at 1200 C, k{sub th} increased to {approx}1.1 W/m/K at 800 C for the alloyed samples, with an associated decrease in the apparent void specific surface area to {approx}1.55 m{sup 2}/cm{sup 3}.

36 MATERIALS SCIENCE↗
NASA NTRS2003

Low Thermal Conductivity Thermal Barrier Coatings Developed

Thermal barrier coatings (TBCs) are used extensively in modern gas turbine engines to thermally insulate air-cooled metallic components from the hot gases in the engine. These coatings typically consist of a zirconia-yttria ceramic that has been applied by either plasma spraying or physical vapor deposition. Future engines will rely even more heavily on TBCs and will require materials that have even higher temperature capability with improved insulation (i.e., lower thermal conductivity even after many hours at high temperature). This report discusses new TBCs that have been developed with these future requirements in mind. The Ultra-Efficient Engine Technology Program at the NASA Glenn Research Center is funding this effort, which has been conducted primarily at Glenn with contractor support (GE and Howmet) for physical vapor deposition. As stated, the new TBC not only had to be more insulating but the insulation had to persist even after many hours of exposure-that is, the new TBC had to have both lower conductivity and improved sintering resistance. A new type of test rig was developed for this task. This new test approach used a laser to deliver a known high heat flux in an essentially uniform pattern to the surface of the coating, thereby establishing a realistic thermal gradient across its thickness. This gradient was determined from surface and backside pyrometry; and since the heat flux and coating thickness are known, this permitted continuous monitoring of thermal conductivity. Thus, this laser rig allowed very efficient screening of candidate low-conductivity, sinter-resistant TBCs. The coating-design approach selected for these new low-conductivity TBCs was to identify oxide dopants that had the potential to promote the formation of relatively large and stable groupings of defects known as defect clusters. This approach was used because it was felt that such clusters would reduce conductivity while enhancing stability. The approach proved to be successful: low-conductivity TBCs having improved sintering resistance were developed.

Zhu, Dongming↗
DOE OSTI2020

Experimental Investigation of Low Cost, Low Thermal Conductivity Thermal Barrier Coating on HCCI Combustion, Efficiency, and Emissions

In-cylinder surface temperature is of heightened importance for Homogeneous Charge Compression Ignition (HCCI) combustion since the combustion mechanism is thermo-kinetically driven. Thermal Barrier Coatings (TBCs) selectively manipulate the in-cylinder surface temperature, providing an avenue for improving thermal and combustion efficiency. A surface temperature swing during combustion/expansion reduces heat transfer losses, leading to more complete combustion and reduced emissions. At the same time, achieving a highly dynamic response sidesteps preheating of charge during intake and eliminates the volumetric efficiency penalty. The magnitude and temporal profile of the dynamic surface temperature swing is affected by the TBC material properties, thickness, morphology, engine speed, and heat flux from the combustion process. This study follows prior work of authors with Yttria Stabilized Zirconia, which systematically engineered coatings for HCCI combustion. Herein, a modeling study was used to assess the impacts of various TBC material properties, e.g. density, thickness, and thermal conductivity on the temperature swing effect. Reducing conductivity emerged as a most promising avenue, rather than reducing both the density and effective conductivity by increasing porosity, the current work emphasizes a material with natively low conductivity. A novel TBC formulation was developed, leverages a class of materials that, to the author’s best knowledge, have not been used as a thermal barrier coating previously. Here, a systematic experimental investigation was carried out using single-cylinder research engine. Experimental engine studies utilizing the novel ‘glassy’ low-K coating exhibit advanced ignition phasing and reduced combustion duration relative to the baseline engine. Heat transfer measurements indicate a net reduction in heat flux over the entire cycle, although main effect is felt during expansion, and the reduced heat transfer losses manifest in higher gross indicated thermal efficiency by approximately 5-6% on a relative basis.

42 ENGINEERING↗
DOE OSTI2012

Theoretical investigation of the impact of grain boundaries and fission gases on UO 2 thermal conductivity

Thermal conductivity is one of the most important metrics of nuclear fuel performance. Therefore, it is crucial to understand the impact of microstructure features on thermal conductivity, especially since the microstructure evolves with burn-up or time in the reactor. For example, UO 2 fuels are polycrystalline and for high-burnup fuels the outer parts of the pellet experience grain sub-division leading to a very fine grain structure. This is known to impact important physical properties such as thermal conductivity as fission gas release. In a previous study, we calculated the effect of different types of {Sigma}5 grain boundaries on UO 2 thermal conductivity and predicted the corresponding Kapitza resistances, i.e. the resistance of the grain boundary in relation to the bulk thermal resistance. There have been reports of pseudoanisotropic effects for the thermal conductivity in cubic polycrystalline materials, as obtained from molecular dynamics simulations, which means that the conductivity appears to be a function of the crystallographic direction of the temperature gradient. However, materials with cubic symmetry should have isotropic thermal conductivity. For this reason it is necessary to determine the cause of this apparent anisotropy and in this report we investigate this effect in context of our earlier simulations of UO 2 Kapitza resistances. Another source of thermal resistance comes from fission products and fission gases. Xe is the main fission gas and when generated in sufficient quantity it dissolves from the lattice and forms gas bubbles inside the crystalline structure. We have performed studies of how Xe atoms dissolved in the UO 2 matrix or precipitated as bubbles impact thermal conductivity, both in bulk UO 2 and in the presence of grain boundaries.

11 NUCLEAR FUEL CYCLE AND FUEL MATERIALS↗
DOE OSTI2023

Carbon Fiber Reinforced Plastic with Substantially Improved Through-plane Thermal Conductivity

Thermal conductivity of carbon fiber support structures that also serve as cooling substrates is of increasing importance for high energy physics detectors. One of the shortcomings of current carbon fiber laminates is that they exhibit excellent thermal conductivity of order several hundred W/(m*K) along the fiber direction, whereas the through plane thermal conductivity perpendicular to the fibers is orders of magnitude lower, and at about 1 W/(m*K) more in the range of thermal insulators. This proposal aims to significantly improve the through plane thermal conductivity, by at least a factor five, changing CFRP from being a thermal insulator to a thermal conductor in the through plane direction. Between June 2021 and December 2022, a total of 36 carbon fiber laminate test samples and two carbon loaded epoxy test samples were manufactured and analyzed for thermal performance. Unfortunately, the promising results obtained with a similar sample manufactured in 2017 were not reproduced. We believe this to be mainly due the excessive age of the carbon fiber prepreg material used for this SBIR - the same material batch, produced in 2015, was used in 2017 and in 2021/2022, i.e. the material was seven years old when the final samples were produced - , and to a lesser degree to the difference in pressure attainable with the 2017 and 2021/2022 laminate curing setups. While disappointing, the results are not completely discouraging, since for the samples with the highest compression the through-plane thermal conductivities plotted as a function of per-ply thickness extrapolate well to the data point from the 2017 sample.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2020

Higher-order phonon scattering: advancing the quantum theory of phonon linewidth, thermal conductivity and thermal radiative properties

Phonon scattering plays a central role in the quantum theory of phonon linewidth, which in turn governs important properties including infrared spectra, Raman spectra, lattice thermal conductivity, thermal radiative properties, and also signifi- cantly affects other important processes such as hot electron relaxation. Since Maradudin and Fein’s classic work in 1962, three-phonon scattering had been considered as the dominant intrinsic phonon scattering mechanism and has seen tremendous advances. However, the role of the higher-order four-phonon scattering had been persistently unclear and so was ignored. The tremendous complexity of the formalism and computational challenges stood in the way, prohibiting the direct and quantitative treatment of four-phonon scattering. In 2016, a rigorous four-phonon scattering formalism was developed, and the prediction was realized using empirical potentials. In 2017, the method was extended using first-principles calculated force constants, and the thermal conductivities of boron arsenides (BAs), Si and diamond were predicted. The predictions for BAs were later confirmed by several independent experiments. Four-phonon scattering has since been investigated in a range of materials and established as an important intrinsic scattering mechanism for thermal transport and radiative properties. Specifically, four-phonon scattering is important when the fourth-order scattering potential or phase space becomes relatively large. The former scenario includes: (i) nearly all materials when the temperature is high; (ii) strongly anharmonic (low thermal conductivity) materials, including most rocksalt compounds, halides, hydrides, chalcogenides and oxides. The latter scenario includes: (iii) materials with large acoustic–optical phonon band gaps, such as XY compounds with a large atomic mass ratio between X and Y; (iv) two- dimensional materials with reflection symmetry, such as single-layer graphene, single-layer boron nitride and carbon nanotubes; and (v) phonons with a large density of states, such as optical phonons, which are important for Raman, infrared and thermal radiative properties. Four-phonon scattering is expected to gain broad interest in various technologically important materials for thermoelectrics, thermal barrier coatings, thermal energy storage, phase change, nuclear power, ultra-high temperature ceramics, infrared spectra, Raman spectra, radiative transport, hot electron relaxation and radiative cooling. Four-phonon scattering has been, and will continue to be, established as an important intrinsic phonon scattering mechanism beyond three-phonon scattering. The prediction of four-phonon scattering will transition from a breakthrough to a new routine in the next decade.

Feng, Tianli↗
DOE OSTI2019

Thermal Conductivity of Thermal Interface Materials Evaluated By a Transient Plane Source Method

The thermal conductivity of thermal interface materials (TIMs) has been investigated using a transient plane source (TPS) method. In thermoelectric generators designed for vehicle waste heat recovery, high thermal conductivity materials are needed for the cold-side interface between a polyamide flexible circuit and an aluminum plate heat exchanger. The conventional heat flow method described by ASTM D5470 is often used to determine thermal contact resistance of an interface with a thin layer of interface material. The apparent thermal conductivity values provided by materials manufacturers are used to calculate heat transfer through the interface. Yet, estimated parameters based on the thermal conductivity of a TIM often do not agree with the actual heat transfer through the interface. Thermal conductivity of a series of 10 commercial TIMs were evaluated by applying a small quantity to an embedded TPS sensor. The 2-mm radius sensor was able to operate under standard bulk material measurement mode and produced consistent thermal conductivity measurements of the interface materials. The TPS method is demonstrated to be effective in ranking the available interface materials by thermal conductivity and to ensure that the material with consistent performance can be selected for the thermoelectric generator applications.

36 MATERIALS SCIENCE↗
DOE OSTI2012

Visible photoluminescence in polycrystalline terbium doped aluminum nitride (Tb:AlN) ceramics with high thermal conductivity

Thermal management continues to be one of the major challenges in the development of high powered light sources such as solid state lasers. In particular, the relatively low thermal conductivity of standard photoluminescent (PL) materials limits the overall power output and/or duty cycle. We present a method based on current activated pressure assisted densification for the fabrication of high thermal conductivity PL materials: rare earth doped polycrystalline bulk aluminum nitride. Specifically, the ceramics are translucent and are doped with Tb{sup 3+}, allowing for emission in the visible. Remarkably, the ceramics have a room temperature thermal conductivity of 94 W/(m K) which is almost seven times higher than that of the state of the art host material, Nd-doped yttrium aluminum garnet. These light emitting properties coupled with very high thermal conductivity should enable the development of a wide variety of more powerful light sources.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗
DOE OSTI2014

Generalized Procedure for Improved Accuracy of Thermal Contact Resistance Measurements for Materials With Arbitrary Temperature-Dependent Thermal Conductivity

Thermal contact resistance (TCR) is most commonly measured using one-dimensional steady-state calorimetric techniques. In the experimental methods we utilized, a temperature gradient is applied across two contacting beams and the temperature drop at the interface is inferred from the temperature profiles of the rods that are measured at discrete points. During data analysis, thermal conductivity of the beams is typically taken to be an average value over the temperature range imposed during the experiment. Our generalized theory is presented and accounts for temperature-dependent changes in thermal conductivity. The procedure presented enables accurate measurement of TCR for contacting materials whose thermal conductivity is any arbitrary function of temperature. For example, it is shown that the standard technique yields TCR values that are about 15% below the actual value for two specific examples of copper and silicon contacts. Conversely, the generalized technique predicts TCR values that are within 1% of the actual value. The method is exact when thermal conductivity is known exactly and no other errors are introduced to the system.

42 ENGINEERING↗
DOE OSTI2023

High-throughput screening of hypothetical metal-organic frameworks for thermal conductivity

Thermal energy management in metal-organic frameworks (MOFs) is an important, yet often neglected, challenge for many adsorption-based applications such as gas storage and separations. Despite its importance, there is insufficient understanding of the structure-property relationships governing thermal transport in MOFs. To provide a data-driven perspective into these relationships, here we perform large-scale computational screening of thermal conductivity k in MOFs, leveraging classical molecular dynamics simulations and 10,194 hypothetical MOFs created using the ToBaCCo 3.0 code. We found that high thermal conductivity in MOFs is favored by high densities (> 1.0 g cm -3 ), small pores (< 10 Å), and four-connected metal nodes. We also found that 36 MOFs exhibit ultra-low thermal conductivity (< 0.02 W m -1 K -1 ), which is primarily due to having extremely large pores (~65 Å). Furthermore, we discovered six hypothetical MOFs with very high thermal conductivity (>10 Wm -1 K -1 ), the structures of which we describe in additional detail.

36 MATERIALS SCIENCE↗
DOE OSTI2014

Effect of interfacial interactions on the thermal conductivity and interfacial thermal conductance in tungsten–graphene layered structure

Graphene film was deposited by microwave plasma assisted deposition on polished oxygen free high conductivity copper foils. Tungsten–graphene layered film was formed by deposition of tungsten film by magnetron sputtering on the graphene covered copper foils. Tungsten film was also deposited directly on copper foil without graphene as the intermediate film. The tungsten–graphene–copper samples were heated at different temperatures up to 900 °C in argon atmosphere to form an interfacial tungsten carbide film. Tungsten film deposited on thicker graphene platelets dispersed on silicon wafer was also heated at 900 °C to identify the formation of tungsten carbide film by reaction of tungsten with graphene platelets. The films were characterized by scanning electron microscopy, Raman spectroscopy, and x-ray diffraction. It was found that tungsten carbide film formed at the interface upon heating only above 650 °C. Transient thermoreflectance signal from the tungsten film surface on the samples was collected and modeled using one-dimensional heat equation. The experimental and modeled results showed that the presence of graphene at the interface reduced the cross-plane effective thermal conductivity and the interfacial thermal conductance of the layer structure. Heating at 650 and 900 °C in argon further reduced the cross-plane thermal conductivity and interface thermal conductance as a result of formation nanocrystalline tungsten carbide at the interface leading to separation and formation of voids. The present results emphasize that interfacial interactions between graphene and carbide forming bcc and hcp elements will reduce the cross-plane effective thermal conductivity in composites.

36 MATERIALS SCIENCE↗
NASA NTRS2001

Thermal Conductivity and Thermal Gradient Cyclic Behavior of Refractory Silicate Coatings on SiC/SiC Ceramic Matrix Composites

Plasma-sprayed mullite and BSAS coatings have been developed to protect SiC/SiC ceramic matrix composites from high temperature environmental attack. In this study, thermal conductivity and thermal barrier functions of these coating systems are evaluated using a laser high-heat-flux test rig. The effects of water vapor on coating thermal conductivity and durability are studied by using alternating furnace and laser thermal gradient cyclic tests. The influence of laser high thermal-gradient cycling on coating failure modes is also investigated.

Zhu, Dongming↗
DOE OSTI2012

Low thermal conductivity oxides

Oxides hold great promise as new and improved materials for thermal-barrier coating applications. The rich variety of structures and compositions of the materials in this class, and the ease with which they can be doped, allow the exploration of various mechanisms for lowering thermal conductivity. In this article, we review recent progress in identifying specific oxides with low thermal conductivity from both theoretical and experimental perspectives. We explore the mechanisms of lowering thermal conductivity, such as introducing structural/chemical disorder, increasing material density, increasing the number of atoms in the primitive cell, and exploiting the structural anisotropy. We conclude that further systematic exploration of oxide crystal structures and chemistries are likely to result in even further improved thermal-barrier coatings.

36 MATERIALS SCIENCE↗
DOE OSTI2017

Effects of basal-plane thermal conductivity and interface thermal conductance on the hot spot temperature in graphene electronic devices

In this study, electrostatic force microscopy and scanning thermal microscopy are employed to investigate the electric transport and localized heating around defects introduced during transfer of graphene grown by chemical vapor deposition to an oxidized Si substrate. Numerical and analytical models are developed to explain the results based on the reported basal-plane thermal conductivity, κ, and interfacial thermal conductance, G , of graphene and to investigate their effects on the peak temperature. Irrespective of the κ values, increasing G beyond 4 × 10 7 W m –2 K –1 can reduce the peak temperature effectively for graphene devices made on sub-10 nm thick gate dielectric, but not for the measured device made on 300-nm-thick oxide dielectric, which yields a cross-plane thermal conductance ( G ox ) much smaller than the typical G of graphene. In contrast, for typical G values reported for graphene, increasing κ from 300 W m –1 K –1 toward 3000 W m –1 K –1 is effective in reducing the hot spot temperature for the 300-nm-thick oxide devices but not for the sub-10 nm gate dielectric case, because the heat spreading length (l) can be appreciably increased relative to the micron-scale localized heat generation spot size ( r 0 ) only when the oxide layer is sufficiently thick. As such, enhancement of κ increases the vertical heat transfer area above the gate dielectric only for the thick oxide case. In all cases considered, the hot spot temperature is sensitive to varying G and κ only when the G / G ox ratio and r 0 /l ratio are below about 5, respectively.

36 MATERIALS SCIENCE↗