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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2024

Thermomechanical Degradation of Sintered Copper Under High-Temperature Thermal Shock

The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronics modules, especially in operating temperatures greater than 150 degrees C. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees C to 200 degrees C) conditions. In the fabrication phase of the samples, we used different stencil patterns and found that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality compared to a full-area print. The paste consisted of Cu microflakes, and we performed sintering using a Budatec SP300 sintering press at 275 degrees C with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained scanning electron microscope images, which revealed adhesive fracture as the dominant failure mechanism.

ADVANCED PROPULSION SYSTEMS,INORGANIC, ORGANIC, PH↗
DOE OSTI2026

Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation

Detecting internal defects in power electronics packages is critical for their performance and reliability, especially under extreme operating conditions, as these defects can lead to catastrophic failure if not properly addressed. Confocal scanning acoustic microscopy (C-SAM) plays a key role in the nondestructive evaluation of bond layer degradation within a power electronics package by detecting defects such as delamination, voids, and cracks. However, accurately quantifying and predicting these defects from C-SAM images remains a significant challenge due to the low noise-to-signal ratio, which typically arises from both imaging process and bond patterns itself. In this paper, we explore machine learning strategies for processing C-SAM images and providing predictive models of defect growth. We use C-SAM images of sintered copper and sintered silver samples, which are obtained under accelerated thermal experiments, as the representative dataset for our study. We investigate the effect of Fourier transforms and wavelet transforms on these datasets to remove high-frequency noise and address noise across multiple scales with histogram equalization to enhance the contrast and improve the visibility of defects. As a result, defect boundaries can be clearly distinguished, enabling more accurate tracking of their growth over time. We then employ different time-series forecasting algorithms on the denoised images to formulate an image-based lifetime prediction model. Statistical models and deep-learning techniques are trained on images obtained in the early stages of thermal shock, and defect growth in the later stages is predicted. Our work serves as a preliminary attempt to improve the accuracy of lifetime prediction models of power electronics packages, which is critical under extreme operating environments.

24 POWER TRANSMISSION AND DISTRIBUTION↗
NASA NTRS1993

Powder metallurgy: Solid and liquid phase sintering of copper

Basic powder metallurgy (P/M) principles and techniques are presented in this laboratory experiment. A copper based system is used since it is relatively easy to work with and is commercially important. In addition to standard solid state sintering, small quantities of low melting metals such as tin, zinc, lead, and aluminum can be added to demonstrate liquid phase sintering and alloy formation. The Taguchi Method of experimental design was used to study the effect of particle size, pressing force, sintering temperature, and sintering time. These parameters can be easily changed to incorporate liquid phase sintering effects and some guidelines for such substitutions are presented. The experiment is typically carried out over a period of three weeks.

Sheldon, Rex↗
NASA NTRS1989

The low magnetic field properties of superconducting bulk yttrium barium copper oxide - Sintered versus partially melted material

A comparison of the low magnetic field properties of sintered (990 C) and partially melted samples (1050 C) has been performed. Changes in the microstructure produced by recrystallization from the melt result in a significant increase in flux pinning at 77 K. Low-frequency (10-100 Hz), low-ac magnetic-field (0.01-9.0 Oe) ac susceptibility data show that gross changes in the loss component accompany the observed changes in microstructure. The effects of applied dc magnetic fields (10-220 Oe) on the ac responses of these microstructures have also been probed.

Hein, R. A.↗
DOE OSTI2024

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

The need for reliable bonded interface materials is critical to realize the performance benefits of wide-bandgap devices in power electronic modules, especially in operating temperatures greater than 150 degrees Celsius. In this paper, we investigate the thermomechanical performance of sintered copper (Cu) as a large-area attachment, bonded between Cu baseplates and active-metal-bonded substrates, under accelerated thermal shock (-40 degrees Celsius to 200 degrees Celsius) conditions. In the fabrication phase of the samples, we used different stencil patterns and found out that the grid and stripe patterns resulted in a better outgassing of the residual organics during the sintering process, thereby ensuring a substantially improved bond quality than a full-area print. The paste consisted of Cu microflakes and we performed sintering using a Budatec SP300 sintering press at 275 degrees Celsius with 15 MPa of bonding pressure for 5 minutes in a nitrogen atmosphere. Under accelerated experiments, we monitored the degradation of the sintered Cu bond in the samples through C-mode scanning acoustic microscope (C-SAM) images. To quantify the defect percentage in C-SAM images, we investigated image denoising techniques to exclude the pattern prints. Finally, we cross-sectioned a sample and obtained digital microscope images, which revealed adhesive fracture as the dominant failure mechanism.

ADVANCED PROPULSION SYSTEMS↗
NASA NTRS1976

Efficient low static-volume water heater

Calrod heating element is surrounded by matrix of fused sintered copper or brass balls, and assembly is then installed in piping of water system. As water flows through matrix, sintered balls cause turbulent flow and heating. Applications include laundromats, laboratories, and photographic labs.

Brown, R. L.↗
NASA NTRSDate not supplied

Process Recipes for Additively Printed Copper Ink Flexible Circuits using Direct Write Methods

In this paper, the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods have been studied. The process has been implemented on the direct write platform. Interest in the use of additive printing methods for the manufacture of micro-circuits has grown immensely in recent times. Direct write methods have been shown to have the ability to create circuits in a limited manner. However, the process recipes and the effect of process parameters on the manufactured properties are not well understood. Copper ink is a good and cost-effective alternative to silver ink but its use has lagged owing to an increased propensity for oxidation. In this paper, photonic curing has been used to sinter copper ink to make the traces conductive. The method flashes high energy light that sinter metal particles instantaneously and the temperature of the substrate remains low. The effect of the different photonic sintering profiles on the mechanical and electrical properties of the printed traces has been studied in this paper.The print process parameters also play an important role in the line width and height that has been studied to print with the desired line profile for the end application. An LC filter circuit is been printed with SMD components been attached using an electrically conductive adhesive (ECA). The manufactured flexible LC filter is been tested for its frequency sweep to compare with the commercially available LC filer with the help of the Bode plot.

Process control↗
NASA NTRS1990

Space-borne He-3 refrigerator

A space-compatible He-3 refrigerator is being developed for cooling the bolometric detectors of the Far Infrared Photometer (FIRP) in the Infrared Telescope in Space (IRTS). The refrigerator is self-contained and compact, and can be recycled in zero gravity with low power dissipation (20 mW or less). A laboratory prototype that contains 2 STP cu dm of He-3 has been successfully cycled upside-down, i.e., against gravity, thus proving the feasibility of the cycle in zero gravity. Sintered copper confines the He-3 to the evaporator during the low temperature phase. Temperatures as low as 280 mK have been achieved with this configuration. Other types of porous material which have lower mass density are currently under investigation.

Duband, L.↗
NASA NTRS1990

A rocket-borne He-3 refrigerator

A self-contained, recyclable He-3 refrigerator suitable for use in space has been developed. The refrigerator is compact, has no moving parts, and requires only electrical connections and thermal contact in order to operate from a 2 K cold stage. A charcoal adsorption pump is used to efficiently condense and cool the He-3. Sintered copper confines the He-3 to the evaporator in zero-gravity and, in fact, allows the refrigerator to operate upside-down in the laboratory. Mounted on a 2 K cold stage, the refrigerator provides 100 microwatts of cooling power at 346 mK, with a 7 hour hold time. On a 1.5 K cold stage, the lowest temperature achieved is 277 mK. The refrigerator has been vibration tested at 7.5 G amplitude from 30 to 400 Hz and 15 G amplitude from 400 to 2000 Hz.

Duband, L.↗
NASA NTRS1978

Upper critical field of copper molybdenum sulfide

The upper critical field of sintered and sputtered copper molybdenum sulfide Cu(x)Mo6S8 was measured and found to exceed the Werthamer, Helfand, and Hohenberg (1966) value for a type II superconductor characterized by dirty limit, weak isotropic electron phonon coupling, and no paramagnetic limiting. It is suggested that the enhancement results from anisotropy or clean limit or both. Other ternary molybdenum sulfides appear to show similar anomalies.

Alterovitz, S. A.↗
DOE OSTI2024

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.

42 ENGINEERING↗
NASA NTRS1973

Fundamental study of transpiration cooling

Isothermal and non-isothermal pressure drop data and heat transfer data generated on porous 304L stainless steel wire forms, sintered spherical stainless steel powder, and sintered spherical OFHC copper powder are reported and correlated. Pressure drop data was collected over a temperature range from 500 R to 2000 R and heat transfer data collected over a heat flux range from 5 to 15 BTU/in2/sec. It was found that flow data could be correlated independently of transpirant temperature and type (i.e., H2, N2). It was also found that no simple relation between heat transfer coefficient and specimen porosity was obtainable.

Koh, J. C. Y.↗
NASA NTRS1990

A YBCO RF-SQUID magnetometer and its applications

An applicable RF-superconducting quantum interference detector (SQUID) magnetometer was made using a bulk sintered yttrium barium copper oxide (YBCO). The temperature range of the magnetometer is 77 to 300 K and the field range 0 to 0.1T. At 77 K, the equivalent flux noise of the SQUID is 5 x 10 to minus 4 power theta sub o/square root of Hz at the frequency range of 20 to 200 Hz. The experiments show that the SQUID noise at low-frequency end is mainly from 1/f noise. A coil test shows that the magnetic moment sensitivity delta m is 10 to the minus 6th power emu. The RF-SQUID is shielded in a YBCO cylinder with a shielding ability B sub in/B sub ex of about 10 to the minus 6th power when external dc magnetic field is about a few Oe. The magnetometer is successfully used in characterizing superconducting thin films.

Luwei, Zhou↗
NASA NTRS2018

Hybrid Additive Manufacturing Deposition and Selective Laser Melting Techniques Applied to Copper-Alloy Liquid Rocket Engine Combustion Chambers

Virgin Orbit and the NASA Marshall Space Flight Center have partnered to fabricate a small, multi-metallic, regeneratively cooled thrust chamber by leveraging the strengths of two different types of additive manufacturing: Direct Metal Laser Sintering (DMLS) for the copper alloy liner and blown powder Directed Energy Deposition (DED) for the Inconel structural jacket. The DED is being developed using Virgin Orbit's DMG Mori Seiki hybrid additive/subtractive machining center to further enable unique processing and further cost savings. The materials chosen are preferred for high performance thrust chamber applications, representing a significant advancement from the compromises typically made in the production of metal 3D printed thrust chambers for rocket engines. The 1.2K-lbf thrust article is a 16" tall, 3" diameter design modified for this effort to be regeneratively cooled with water and hot fired using a RP-1/LOX pintle-style development injector from Virgin Orbit's NewtonFour upper stage engine. The thrust chamber was tested at Virgin Orbit's Necker test site in Mojave, California. Results from this test campaign are reported in addition to information characterizing the liner, jacket, and bimetallic diffusion layer materials. This paper will also highlight some of the future bimetallic thrust chamber developments that MSFC and Virgin Orbit will complete under a recently awarded NASA contract.

Zagorski, Kevin↗
NASA NTRSDate not supplied

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in flexible but also in large area electronics. The technology provides an effective and convenient method to additively deposit conductive and insulating materials on any type of substrate. Comparing with traditional manufacturing processes, which involves chemical etching, this technology also comes to be relatively environmental friendly. Despite its status, it is not without its challenges. Starting from the material being compatible in the printer equipment to the point of achieving fine resolutions, and with excellent properties are some of the challenges that printed electronics face. Among the myriad of printing technologies such as Aerosol Jet, micro-dispensing, gravure printing, screen printing, Inkjet printing, Inkjet has gained much attention due to its low-cost, low material consumption, and roll-to-roll capability for mass manufacturing. The technology has been widely used in home and office, but recently gained interest in printed electronics in a research and development setting. Conductive materials used in Inkjet printing generally comprises of metal Nanoparticles that need to be thermally sintered for it to be conductive. The preferred metal of choice has been mostly silver due to its excellent electrical properties and ease in sintering. However, silver comes to be expensive than its counterpart copper. Since copper is prone to oxidation, much focus has been given towards photonic sintering that involves sudden burst of pulsed light at certain energy to sinter the copper Nanoparticles. With this technique, only the printed material gets sintered in a matter of seconds without having a great impact on its substrate, due to which it is also preferred in low temperature applications. With all the knowledge, there is still a large gap in the process side with copper where it is important to look how the print process affects the resolution of the print along with the effect of post-print processes on electrical and mechanical properties. In this paper, a copper Inkjet ink is utilized for understanding the effect of Inkjet print parameters on the ejected droplet and its resolution. Post-print process is also quantified using a photonic sintering equipment for excellent electrical and mechanical properties. To demonstrate the complete process, commercial-off-the-shelf components will also be mounted on the additively printed pads via Inkjet. Statistically, control charting technique will be utilized to understand the capability of the Inkjet process.

printed electronics↗
DOE OSTI2024

Compensating for Sintering Distortion in Additively Manufactured Shaped Charge Liners using Physics-Informed Machine Learning

Copper is a challenging material to process using laser-based additive manufacturing due to its high reflectivity and high thermal conductivity. Sintering-based processes can produce solid copper parts without the processing challenges and defects associated with laser melting; however, sintering can also cause distortion in copper parts, especially those with thin walls. In this study, we use physics-informed Gaussian process regression to predict and compensate for sintering distortion in thin-walled copper parts produced using a Markforged Metal X bound powder extrusion (BPE) additive manufacturing system. Through experimental characterization and computational simulation of copper’s viscoelastic sintering behavior, we can predict sintering deformation. We can then manufacture, simulate, and test parts with various compensation scaling factors to inform Gaussian process regression and predict a compensated as-printed (pre-sintered) part geometry that produces the desired final (post-sintered) part.

36 MATERIALS SCIENCE↗
DOE OSTI2025

Design, fabrication, simulation, and testing of additively manufactured lattice-based copper heat sinks

Here, this study investigates the potential advantages of lattice structure-based bound metal material extrusion (MEX) 3D printing for fabricating high-performance copper heat sinks. Copper powder-filled polymer filaments, with a copper content of > 90 wt.%, were developed specifically for the bound metal MEX 3D printing process. Three types of structures—planar, strut, and surface lattices—were 3D printed to facilitate efficient heat transfer pathways within the heat sinks. Subsequent post-processing steps, including polymer removal and sintering, were performed to achieve dense copper parts. Hot isostatic pressing was further employed to enhance the sintered density from 93 to 98%. Finite element analysis (FEA) simulations were conducted to assess the heat transfer efficiency of the designs, and heat transfer experiments were performed using a custom setup to validate the simulation results. Additionally, this research explores the use of extended hold times during pre-sintering and a reduced atmosphere to enhance the %IACS values (electrical conductivity) and thermal performance of the bound metal MEX 3D printed copper heat sinks. The investigation combines experimental analysis, including simulations and heat transfer experiments, to gain insights into the structure-material property relationships and optimize the thermal performance of the printed heat sinks.

Ajjarapu, Kameswara Pavan Kumar [Oak Ridge Nationa↗
NASA NTRS1983

Electrodes for solid state devices

The invention relates to coated metal powders and to dispersions of such powders in liquid vehicles forming screenable, sinterable pastes for use in forming electrodes on photovoltaic devices. The primary nickel or copper metal particles are provided with a carrier of lower melting sintering metals such as 1-20% by weight, of a non-oxidizing metal such as lead or tin. The powdered metal systems operate on the basis of fusing together by way of eutectic alloying. As the paste is heated during firing the organic binder is first vaporized. An eutectic of the base metal (copper) and coating (tin) forms at the intersections of the base metal grains. This eutectic dissolves the grains and as the temperature is raised above the eutectic temperature, more of the base metal is dissolved. While the temperature is held at the higher value, the much smaller amount of sintering metal disappears as the eutectic dissolves and diffuses into the base metal until the composition of the eutectic is so enriched with base metal that it no longer has the eutectic properties and it solidifies. In this high temperature solidification, the base metal grains became thoroughly alloyed together and will not separate at the eutectic temperature (a lower temperature than their solidification by diffusion).

Bickler, D. B.↗