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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Laser‐Sintered Silver Metallization for Silicon Heterojunction Photovoltaic Cells

Herein, a novel metallization technique is reported for crystalline silicon heterojunction (SHJ) solar cells in which silver (Ag) fingers are printed on the SHJ substrates by dispensing Ag nanoparticle‐based inks through a needle and then sintered with a continuous‐wave carbon dioxide (CO 2 ) laser. The impact of the Ag ink viscosity on the line quality and the line resistance is investigated on three Ag inks with different viscosities. Increasing ink viscosity yields higher Ag contact heights, larger aspect ratios, and lower line resistance values. The Ag line height increases from less than a micrometer to ≈18.62 ± 3.48 μm with the increasing viscosity. Photoluminescence imaging shows that the low‐resistance Ag metal contacts obtained do not result in any passivation damage of the SHJ substrate. This is because the wavelength of light emitted from the CO 2 laser (i.e., 10.6 μm) leads to optical absorption in the Ag, but this light is effectively transparent to the transparent conductive oxide film, amorphous silicon films, and crystalline silicon substrate. Bulk resistivity values as low as 6.5 μΩ cm are obtained for the laser‐sintered Ag contact and printed using the Ag ink with the highest viscosity in this work.

Mousumi, Jannatul Ferdous↗

Studies of reaction geometry in oxidation and reduction of the alkaline silver electrode

Two methods of surface area estimations of sintered silver electrodes have given roughness factors of 58 and 81. One method is based on constant current oxidation, the other is based on potentiostatic oxidation. Examination of both wire and sintered silver electrodes via scanning electron microscopy at various stages of oxidation have shown that important structural features are mounds of oxide. In potentiostatic oxidations these appear to form on sites instantaneously nucleated while in constant current oxidations progressive nucleation is indicated.

Butler, E. A.↗

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

High temperature operation of wide bandgap devices continue to be a challenge for the power electronics packages. Thermal performance and reliability are important factors that determine the viability of a bonded interface for operation at high temperatures. In this presentation, we present the technical approach and key results from the research on sintered silver, transient liquid phase alloy, and polymeric materials. A lifetime prediction model that incorporates the thermomechanical behavior of sintered silver at 200C was developed. The copper-aluminum transient alloy completed 350 thermal cycles from -40C to 200C and little increase in the defect level was observed. In addition to material research, we initiated a time-series analysis on the scanning acoustic microscope images of eutectic solder to explore statistical forecasting methods and machine learning techniques. Initial results that report the accuracy of a few different statistical models are presented.

ADVANCED PROPULSION SYSTEMS↗

Optimization of Structurally Enhanced Solder Transient Liquid Phase Bonding

High temperature packaging technologies are a necessity for high temperature capable devices. SAC305 solder has an operational limit of 174°C imposed by creep effects which aligns well with current junction temperature limits of 175°C. Wide band gap semiconductor materials have the potential to reach junction temperatures of up to 800°C that are not currently attainable with significant reliability. Capitalizing on this potential will requires substrates and attachments that can operate well beyond the current 175°C standard. Silver sintering pastes have received widespread interest as a high temperature attachment alternative. However, the process requires high pressure bonding in an inert environment to achieve acceptable bond quality. Transient liquid phase (TLP) sintering is capable of good bond quality without pressure requirements but suffers from low thermal conductivity and only slightly reduced cost compared to silver sintering. SAC305 solder contains the same constituent materials for TLP as available copper-tin TLP sintering paste. By introducing engineered surface structures into the bond, intermetallic formation can be accelerated producing a bond similar to TLP sintering but in an ambient environment and for reduced cost. While this process has been demonstrated, it has not yet been optimized. Currently bonds are formed using a 75 μm stencil on substrate surface structures 24 μm tall, covering 19% of the bonding area. The process takes about 4 hours not including the formation of surface structures. Here, this study will center on the effects of stencil thickness and coating methods. Samples will be analyzed by scanning acoustic microscopy, die shear testing and cross sectional scanning acoustic microscopy.

42 ENGINEERING↗

Non-gassing nickel-cadmium battery electrodes and cells

The concept of a negative limited nongassing nickel-cadmium battery was demonstrated by constructing and testing practical size experimental cells of approximately 25 Ah capacity. These batteries operated in a gas-free manner and had measured energy densities of 10-11 Wh/lb. Thirty cells were constructed for extensive testing. Some small cells were tested for over 200 cycles at 100% depth. For example, a small cell with an electrodeposited cadmium active mass on a silver screen still had 55% of its theoretical capacity (initial efficiency was 85%). There was no evidence of deterioration of gassing properties with cycling of the nickel electrodes. The charge temperature was observed to be the most critical variable governing nickel electrode gassing. This variable was shown to be age dependent. Four types of cadmium electrodes were tested: an electrodeposited cadmium active mass on a cadmium or silver substrate, a porous sintered silver substrate based electrode, and a Teflon bonded pressed cadmium electrode. The electrodeposited cadmium mass on a silver screen was found to be the best all-around electrode from a performance point of view and from the point of view of manufacturing them in a size required for a 25 Ah size battery.

Luksha, E.↗

Double-Side Cooled 1.2kV, 300A SiC MOSFET Phase-leg Modules for 200 kW, > 100 kW/L Traction Inverters

The packaging of a double-side cooled 1.2 kV, 149 A SiC phase-leg modules has been reported in recent years for making 100 kW, 100 kW/L traction inverters. Each phase-leg module consists of two SiC MOSFETs, one per switch position. Six of the phase-leg modules are assembled into a segmented inverter configuration to meet the power and power density requirement. In this work, the layout of the phase-leg module was redesigned to include four of the SiC MOSFETs, two per switch position, with the aim of doubling the power to 200 kW and increasing the power density beyond 100 kW/L, but with only a 10.25% footprint increase. Key features of the packaging technology developed in the previous work were implemented in the current work, which include silver sintering for chip bonding and porous silver inter-posts for bonding device source pads to substrate. Parasitic extraction simulation showed that the four-chip module has a low parasitic inductance of 4.7 nH, like the two-chip module. Static characterization of the four-chip prototypes showed a low average on-resistance of 9 mΩ and a low average leakage current of 5 nA at Vds of 1.2 kV.

Zhang, Zichen↗

Fabrication and testing of silver-hydrogen cells

Silver electrodes containing various additives were fabricated and tested in single electrode cells in order to improve the electrochemical utilization of sintered silver cathodes in Ag-H2 aerospace batteries. A standard stack arrangement was used which featured a NASA-developed organic-inorganic separator. All cells were cycled in a regime designed to remove 75% of the cells nominal capacity based on 3.3 gms/AHr Ag utilization. In cases where performance degradation was observed, the main feature mode appeared to be corrosion of either the expanded silver current collector or the connection between the silver electrode and the electrode tab. Promising silver electrodes from single electrode studies were used in the construction of 35 AHr Ag-H2 cells. Two such cells were constructed and installed in heavy walled pressure vessels for testing. Based on the data obtained from all cells tested during the program, four lightweight 35 AHr cells were fabricated. During acceptance testing these cells yielded an average gravimetric energy density of 30 WHr/1b.

Debicarri, D. J.↗

NiCd battery electrodes, C-150

A research program to develop and evaluate electrodes for a nongassing negative limited nickel-cadmium cell is described. The concept of the negative limited cell and its implications on electrode structure are discussed. The key element is the development of a cadmium electrode with high hydrogen overvoltage. For this, Teflon-bonded Cd electrodes and silver-sinter based Gc electrodes were manufactured and in preliminary experiments their physical and electrochemical characteristics were evaluated. Hydrogen evolution on cadmium was found to occur approximately 100 mV more cathodic than on silver. Both electrode structures exhibit a fairly sharp potential rise at the end of the charging cycle and the advent of gas evolution occurs at potentials between -1.2 and -1.3 V versus a Hg/HgO reference electrode. These results are compared with conventional Ni-sinter based Cd electrodes.

Holleck, G.↗

Design and fabrication of silver-hydrogen cells

The design and fabrication of silver-hydrogen secondary cells capable of delivering higher energy densities than comparable nickel-cadmium and nickel-hydrogen cells and relatively high cycle life is presented. An experimental task utilizing single electrode pairs for the optimization of the individual electrode components, the preparation of a design for lightweight 20Ahr cells, and the fabrication of four 20Ahr cells in heavy wall test housing containing electrode stacks of the lightweight design are described. The design approach is based on the use of a single cylindrical self-contained cell with a stacked disc sequence of electrodes. The electrode stack design is based on the use of NASA- Astropower Separator Material, PPF fuel cell anodes, an intercell electrolyte reservoir concept and sintered silver electrodes. Results of performance tests are given.

Klein, M. G.↗

Spatiotemporal Learning in Power Modules: Wavelet-Enhanced Forecasting of Thermomechanical Degradation

Detecting internal defects in power electronics packages is critical for their performance and reliability, especially under extreme operating conditions, as these defects can lead to catastrophic failure if not properly addressed. Confocal scanning acoustic microscopy (C-SAM) plays a key role in the nondestructive evaluation of bond layer degradation within a power electronics package by detecting defects such as delamination, voids, and cracks. However, accurately quantifying and predicting these defects from C-SAM images remains a significant challenge due to the low noise-to-signal ratio, which typically arises from both imaging process and bond patterns itself. In this paper, we explore machine learning strategies for processing C-SAM images and providing predictive models of defect growth. We use C-SAM images of sintered copper and sintered silver samples, which are obtained under accelerated thermal experiments, as the representative dataset for our study. We investigate the effect of Fourier transforms and wavelet transforms on these datasets to remove high-frequency noise and address noise across multiple scales with histogram equalization to enhance the contrast and improve the visibility of defects. As a result, defect boundaries can be clearly distinguished, enabling more accurate tracking of their growth over time. We then employ different time-series forecasting algorithms on the denoised images to formulate an image-based lifetime prediction model. Statistical models and deep-learning techniques are trained on images obtained in the early stages of thermal shock, and defect growth in the later stages is predicted. Our work serves as a preliminary attempt to improve the accuracy of lifetime prediction models of power electronics packages, which is critical under extreme operating environments.

24 POWER TRANSMISSION AND DISTRIBUTION↗

Heterogeneous Integration Technologies for High-temperature, High-density, Low-profile Power Modules of Wide Bandgap Devices in Electric Drive Applications (Final Technical Report)

The goal of this project is to develop packaging technologies for making high-temperature, high-density, and low-profile wide-bandgap (WBG) power electronics modules for electric drives. These modules are aimed at enabling the DOE’s University Consortium to reach its 2025 inverter targets of ≥ 100 kW/L and ≤ 2.7 $/kW. The specific objectives are to: design and fabricate SiC half-bridge power modules with double-sided cooling and parasitic inductances < 5 nH, heat flux density > 400 W/cm 2 , and working junction temperature of 200 o C; design, fabricate, and deliver a gate driver with double-sided cooled modules for the construction of a 100 kW/L inverter at Oak Ridge National Lab; and design and prototype intelligent gate drivers with integrated current sensor and a low-profile DC-DC power supply with air-core transformer for testing power modules at 200 o C junction temperature. We followed an iterative technical approach of design, simulation, fabrication, and testing of various versions of modules, current sensors, and power supply. The state-of-the-art silicon carbide devices rated at 1.2 kV and 149 A were packaged by sintered-silver bonding on an aluminum nitride direct-bond-copper substrate for high thermal conductivity, high working temperature, and high joint reliability. Porous silver posts were used to interconnect the device’s source pads to the other direct-bond-copper substrate for low mechanical stresses, ease of manufacturing, and double-sided cooling. A current sensor based on package parasitic inductance was developed to measure switching current. A dynamic feedback scheme was developed to compensate the effect of parasitic resistance and temperature variation. A constant-current class-E dc-dc converter with air-core transformer was developed. Air-core transformer was used due to the unavailability of magnetic core at high temperatures. Gate driver and power supply were integrated with the double-side cooled, high temperature SiC power modules for testing the modules at 200 o C junction temperature. Double-pulse and continuous testing of the integrated technologies validated the design and fabrication of the three component technologies. Throughout the project, we overcame the challenge for design verification caused by low prototyping yield, which then helped train the graduate students, the future workforce, to learn the engineering know-how for low-cost manufacturing of reliable products. Below is a summary of the major accomplishments of this project: development of a prototyping process for fabricating double-side cooled (1200 V, 149 A) SiC phase-leg modules capable of working to 200 o C Tj; simulation and experimental verification of the improvement of thermo-mechanical reliability of the double-side cooled SiC phase-leg module by using rigid encapsulant; design and experimental validation of a current sensor based on package parasitic inductance and a compensation solution for eliminating the effect of parasitic resistance; design and experimental validation of a low-profile power supply with six-output air-core transformer for gate driver; functional demonstration of a SiC phase-leg module integrated with its gate driver, current sensor, and an air-core power supply at 200 o C Tj in a double-pulse switching test setup and Buck converter continuous test setup; successful completion of six PhD and two MS students who are or will work at Apple Inc., Tesla Inc., Wolfspeed Inc., Microchip Inc., Monolithic Power Systems Inc., and LG Magna Inc.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Low Cost High-Performance HRE-Free 3-in-1 Electric Drive Unit

The project team completed work to expand upon American Axle & Manufacturing’s (AAM) baseline technology and develop a high-speed, AC induction electric drive unit (EDU) with total direct-oil-cooling and integrated power electronics. The project accelerated advancements in EDU technology by allowing AAM to build upon the progress made in developing the underlying baseline technologies. The following seven improvements to AAM’s baseline technology were implemented in this research and development program: 1) Increased speed (30k RPM) AC induction motor, 2) Silver-sintering of discrete silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFET) to heat sinks, 3) Electrically insulated rotor bars, 4) Optimized lamination steel, 5) EDU-integrated 650VDC inverter package, 6) Over-molded stator with molded liners, and 7) 650VDC power-dense stator design. The successful development of the technology resulted in a meaningful cost reduction for EDU systems in the market. Coupled with falling battery system costs, lower EDU costs will likely accelerate the market acceptance and related production scaling of battery electric vehicles. The objective of this project was to research, develop, and test a Heavy Rare Earth (HRE)-free 3-In-1 electric drive unit (EDU) that has class leading power density and cost. The key technologies to be developed were anticipated to meet or exceed the Department of Energy (DOE) targets of a cost ≤ $\$$7/kilowatt (kW), power density ≥ 12 kW/liter, and operating voltage ≥ 600 VDC.

33 ADVANCED PROPULSION SYSTEMS↗

NiCd battery electrodes, C-150

Electrodes for a nongassing negative limited nickel-cadmium cell are discussed. The key element is the development of cadmium electrodes with high hydrogen overvoltage. For this, the following electrode structures were manufactured and their physical and electrochemical characteristics were evaluated: (1) silver-sinter-based Cd electrodes, (2) Teflon-bonded Cd electrodes, (3) electrodeposited Cd sponge, and (4) Cd-sinter structures.

Holleck, G.↗

Solar cell with improved N-region contact and method of forming the same

An improved solar cell, and method of forming the same are disclosed. It is characterized by a semiconductor silicon wafer of P-type material having diffused therein a shallow N-type region. A sintered silver contact is affixed to the surface of the N-type region at the outer surface. The improved solar cell is formulated from silver powder blended with silver metaphosphate for establishing a zone of increased carrier concentration. An aluminum or silver-aluminum alloy contact is affixed to the P-type wafer at the outer surface opposite the N-type region.

Bube, K. R.↗

Characterization of Low-Temperature, Co-Fired Ceramic-Manufactured Electrostatic Thruster-Closeout Report

The goal of the project was to evaluate prototypes of an experimental thruster developed by the University of Arkansas (UA), Fayetteville, AR. The design under evaluation is a radio frequency (RF) electrostatic thruster that was fabricated using the low-temperature, co-fired ceramic (LTCC) materials and fabrication process. This materials system is analogous to printed circuit board (PCB) technology with the most significant difference being that the laminate is replaced by a ceramic material and the copper layer is replaced by printed sinterable silver paste. LTCC designs are baked after fabrication and assembled to realize an entirely monolithic structure with internal conductors, vias, and cavities. In this process, the LTCC electrostatic thruster (LTCC-ET) that is the subject of the present work becomes a monolithic ceramic thruster capable of withstanding temperatures in excess of 500 ºC. The UA and NASA Marshall Space Flight Center (MSFC) jointly performed prototype testing on the LTCC-ET under a NASA Cooperative Agreement Notice (CAN) award. The LTCC-ET was tested at MSFC in May 2018 over a 1-week period. There were two goals for the test program: (1) Testing to determine the operating parameters required to create plasma ignition in the test articles. This was explored by setting a propellant flowrate and increasing RF power until plasma ignition was observed. Testing was conducted with both argon and krypton. (2) Investigate the thrust and specific impulse (Isp) performance of the thruster as a function of propellant flowrate and grid voltage. This goal was not met during the project as technical challenges in maintaining stable plasma ignition arose due to stress and heating of the RF power feed. In summary, a prototype thruster design (consisting of three packaged units) was fabricated by UA and tested for the first time under vacuum conditions at MSFC to experimentally determine basic performance metrics and functionality. It was found that the design was not sufficiently optimized or robust enough in its initial iteration to support a significant test campaign or characterization program. It was concluded that the propellant outlet channels must be reduced in size with the flowpaths adjusted to increase propellant residence time in the thruster, and that the RF connector must be replaced with a version capable of handling higher power throughput and heating. However, even in its unoptimized form, a plasma could be produced in the LTCCET, demonstrating the efficacy of the design approach. The design is especially compelling due to its low cost to manufacture and, more importantly, its scalability of size and power throughput. Low cost and scalability are also important in that additional functionalities, such as thrust vectoring and plume charge neutralization, can be integrated into future designs with minimal additional cost. This project has matured the LTCC-ET development Technology Readiness Level (TRL) from 1 to 2. The low-cost RF plasma source portion of the LTCC device was matured from TRL 2 to 4 through the demonstration of RF plasma ignition under vacuum conditions.

Huang, P.-H. A.↗