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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Overview of a new slicing method: Fixed Abrasive Slicing Technique (FAST)

The fixed abrasive slicing technique (FAST) was developed to slice silicon ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10 cm diameter and 19 wafers/cm from 15 cm diameter ingots. This was achieved with a combination of machine development and wire-blade development programs. Correlation was established between cutting effectiveness and high surface speeds. A high speed slicer was designed and fabricated for FAST slicing. Wirepack life of slicing three 10 cm diameter ingots was established. Electroforming techniques were developed to control widths and prolong life of wire-blades. Economic analysis indicates that the projected add-on price of FAST slicing is compatible with the DOE price allocation to meet the 1986 cost goals.

Schmid, F.↗
NASA NTRS1982

Part 2: Multi-wire slicing. Fixed Abrasive Slicing Technique (FAST)

The Fixed Abrasive Slicing Techniques (FAST) is a new slicing technique that was developed to slice ingots more effectively. It was demonstrated that 25 wafers/cm can be sliced from 10cm diameter and 19 wafers/cm from 15 cm diameter ingots. Over 99% yield (222 out of a possible 224) was demonstrated during slicing of a 10 cm diameter ingots at 25 wafers/cm. The average thickness of wafers was 0.249 mm and the kerf was 0.151 mm. Slicing rates as high as 0.14 mm/min were also demonstrated for 10 cm diameter ingots.

Source record↗
NASA NTRS1979

Silicon ingot casting: Heat exchanger method. Multi-wire slicing: Fixed abrasive slicing technique, phase 3

In the area of ingot casting the proof of concept of heat exchanger method (HEM) was established. It was also established that HEM cast silicon yielded solar cell performance comparable to Czochralski grown material. Solar cells with conversion efficiencies of up to 15% were fabricated. It was shown that square cross-section ingots can be cast. In the area of crystal slicing, it was established that silicon can be sliced efficiently with the fixed abrasive slicing technique approach. This concept was carried forward to 10 cm diameter workpiece.

Schmid, F.↗
NASA NTRS1982

Silicon slicing by fixed abrasive slicing technique

One of the major cost factors in silicon ingot technology adaptation for terrestrial photovoltaic application is in slicing boules into wafers. The most developed industrial practice is the Internal Diameter (ID) slicing. This method utilizes diamond cutting. The diamond stands up for long periods, hence, the cost of expendable materials is low. However, the ID technology as practiced today has poor material utilization. The Multiblade Slurry (MBS) method has low equipment and labor costs but its expendable material costs are high. Recently Multiwire Slurry (MWS) technology has shown very good material utilization, but its expendable material costs are even higher than MBS. The multiwire Fixed Abrasive Slicing Technique (FAST) still in advanced development stage, combines the low expendable material costs of ID method, the low labor and equipment costs of MBS and high material utilization of MWS.

Schmid, F.↗
NASA NTRS1981

Silicon Ingot Casting - Heat Exchanger Method (HEM). Multi-Wire Slicing - Fixed Abrasive Slicing Technique (Fast). Phase 4 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-Cost Solar Array Project

The crystallinity of large HEM silicon ingots as a function of heat flow conditions is investigated. A balanced heat flow at the bottom of the ingot restricts spurious nucleation to the edge of the melted-back seed in contact with the crucible. Homogeneous resistivity distribution over all the ingot has been achieved. The positioning of diamonds electroplated on wirepacks used to slice silicon crystals is considered. The electroplating of diamonds on only the cutting edge is described and the improved slicing performance of these wires evaluated. An economic analysis of value added costs of HEM ingot casting and band saw sectioning indicates the projected add on cost of HEM is well below the 1986 allocation.

Schmid, F.↗
NASA NTRS1982

Wire blade development for Fixed Abrasive Slicing Technique (FAST) slicing

A low cost, effective slicing method is essential to make ingot technology viable for photovoltaics in terrestrial applications. The fixed abrasive slicing technique (FAST) combines the advantages of the three commercially developed techniques. In its development stage FAST demonstrated cutting effectiveness of 10 cm and 15 cm diameter workpieces. Wire blade development is still the critical element for commercialization of FAST technology. Both impregnated and electroplated wire blades have been developed; techniques have been developed to fix diamonds only in the cutting edge of the wire. Electroplated wires show the most near term promise and this approach is emphasized. With plated wires it has been possible to control the size and shape of the electroplating, it is expected that this feature reduces kerf and prolongs the life of the wirepack.

Khattak, C. P.↗
NASA NTRS1979

Silicon Ingot Casting - Heat Exchanger Method Multi-wire Slicing - Fixed Abrasive Slicing Technique. Phase 3 Silicon Sheet Growth Development for the Large Area Sheet Task of the Low-cost Solar Array Project

Several 20 cm diameter silicon ingots, up to 6.3 kg. were cast with good crystallinity. The graphite heat zone can be purified by heating it to high temperatures in vacuum. This is important in reducing costs and purification of large parts. Electroplated wires with 45 um synthetic diamonds and 30 um natural diamonds showed good cutting efficiency and lifetime. During slicing of a 10 cm x 10 cm workpiece, jerky motion occurred in the feed and rocking mechanisms. This problem is corrected and modifications were made to reduce the weight of the bladeheat by 50%.

Schmid, F.↗
NASA NTRS1979

Silicon Ingot Casting: Heat Exchanger Method. Multi-wire Slicing: Fixed Abrasine Slicing Technique, Phase 3

Ingot casting was scaled up to 16 cm by 16 cm square cross section size and ingots weighing up to 8.1 kg were cast. The high degree of crystallinity was maintained in the large ingot. For large sizes, the nonuniformity of heat treatment causes chipping of the surface of the ingot. Progress was made in the development of a uniform graded structure in the silica crucibles. The high speed slicer blade-head weight was reduced to 37 pounds, allowing surface speeds of up to 500 feet per minute. Slicing of 10 cm diameter workpieces at these speeds increased the through-put of the machine to 0.145 mm/min.

Schmid, F.↗
NASA NTRS1992

The topology of large-scale structure. VI - Slices of the universe

Results of an investigation of the topology of large-scale structure in two observed slices of the universe are presented. Both slices pass through the Coma cluster and their depths are 100 and 230/h Mpc. The present topology study shows that the largest void in the CfA slice is divided into two smaller voids by a statistically significant line of galaxies. The topology of toy models like the white noise and bubble models is shown to be inconsistent with that of the observed slices. A large N-body simulation was made of the biased cloud dark matter model and the slices are simulated by matching them in selection functions and boundary conditions. The genus curves for these simulated slices are spongelike and have a small shift in the direction of a meatball topology like those of observed slices.

Park, Changbom↗
NASA NTRS1985

Temperature effects on evoked potentials of hippocampal slices from euthermic chipmunks, hamsters and rats

1. Neural activity was recorded in hippocampal slices from euthermic chipmunks, hamsters and rats. 2. While recording the evoked potentials, the temperature of the Ringer's solution bathing the slice was varied by controlling the temperature of an outer chamber jacketing the recording chamber. 3. The temperature just below that at which a population spike could be evoked, Tt, was 10.4 +/- 0.3 degrees C (mean +/- SEM) for chipmunk slices, 14.1 +/- 0.4 degrees C for rat slices and 14.8 +/- 0.4 degrees C for hamster slices. Tt was significantly lower in the chipmunk slices (P<0.01) than in the rat and hamster slices. 4. Data were interpreted as consistent with the hypothesis that chipmunk hippocampal neurons are intrinsically cold resistant.

NASA Discipline Number 40-30↗
NASA NTRS1976

Slicing of silicon into sheet material: Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array project

Multiblade slurry sawing is used to slice 10 cm diameter silicon ingots into wafers 0.024 cm thick using 0.050 cm of silicon per slice (0.026 cm kerf loss). Total slicing time is less than twenty hours, and 143 slices are produced simultaneously. Productivity (slice area per hour per blade) is shown as a function or blade load and thickness, and abrasive size. Finer abrasive slurries cause a reduction in slice productivity, and thin blades cause a reduction of wafer accuracy. Sawing induced surface damage is found to extend 18 microns into the wafer.

Holden, S. C.↗
NASA NTRS1979

LSA Large Area Silicon Sheet Task Enhanced I.D. Slicing Technology for Silicon Ingots

Development of inside diameter slicing technology to significantly increase the number of useable slices per inch of crystal over industry practice is discussed. The required reduction of both blade and slice thickness is to be accomplished by a combination of three key elements of slicing technology: (1) ingot rotation with minimum exposed blade area; (2) dynamic cutting edge control; and (3) the use of prefabricated insert blades. Design modifications on a slicing saw with microprocessor controls and hardware fabrication to complete this conversion were initiated. Several runs were conducted on the engineering saw incorporating the method of ingot rotation. Ingots with diameters up to six inches were sliced successfully on a production saw.

Walters, D.↗
NASA NTRS1979

Development of Methods of Producing Large Areas of Silicon Sheet by the Slicing of Silicon Ingots Using Inside Diameter (I.D.) Saws

Methods of producing large areas of silicon sheets were developed by using inside diameter (I.D.) saws to slice silicon ingots. A 16 inch automated I.D. slicing machine was modified to accept programmable electric feed system, a crystal rotating system and a dyna-track blade monitoring and control system. The saw and accessories were used to slice 75 mm diameter single crystal silicon ingots while rotating them. The automated saw automatically recovered the wafers and loaded them into a cassette. The amount of material lost during slicing was reduced by using smaller blades than ones normally used to slice the wafers. Slicing runs on 100 mm diameter silicon is the next goal.

Aharonyan, P.↗
NASA NTRS1982

Current economic and sensitivity analysis for ID slicing of 4 inch and 6 inch diameter silicon ingots for photovoltaic applications

The economics and sensitivities of slicing large diameter silicon ingots for photovoltaic applications were examined. Current economics and slicing add on cost sensitivities are calculated using variable parameters for blade life, slicing yield, and slice cutting speed. It is indicated that cutting speed has the biggest impact on slicing add on cost, followed by slicing yield, and by blade life as the blade life increases.

Roberts, E. G.↗
NASA NTRS1993

Integrating interface slicing into software engineering processes

Interface slicing is a tool which was developed to facilitate software engineering. As previously presented, it was described in terms of its techniques and mechanisms. The integration of interface slicing into specific software engineering activities is considered by discussing a number of potential applications of interface slicing. The applications discussed specifically address the problems, issues, or concerns raised in a previous project. Because a complete interface slicer is still under development, these applications must be phrased in future tenses. Nonetheless, the interface slicing techniques which were presented can be implemented using current compiler and static analysis technology. Whether implemented as a standalone tool or as a module in an integrated development or reverse engineering environment, they require analysis no more complex than that required for current system development environments. By contrast, conventional slicing is a methodology which, while showing much promise and intuitive appeal, has yet to be fully implemented in a production language environment despite 12 years of development.

Beck, Jon↗
NASA NTRS1993

A survey of program slicing for software engineering

This research concerns program slicing which is used as a tool for program maintainence of software systems. Program slicing decreases the level of effort required to understand and maintain complex software systems. It was first designed as a debugging aid, but it has since been generalized into various tools and extended to include program comprehension, module cohesion estimation, requirements verification, dead code elimination, and maintainence of several software systems, including reverse engineering, parallelization, portability, and reuse component generation. This paper seeks to address and define terminology, theoretical concepts, program representation, different program graphs, developments in static slicing, dynamic slicing, and semantics and mathematical models. Applications for conventional slicing are presented, along with a prognosis of future work in this field.

Beck, Jon↗