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Results for “solder joint reliability systems-in-a-package SIP”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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SIP qualification and PRA approaches

System in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package level and even more at the second and system levels.

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