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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Embedded Temperature-Change Sensors

Transducers sensitive to rates of change of temperature embedded in integrated circuits and discrete electronic components damaged by overheating, according to proposal. Used to detect onset of rapid heating and to trigger shutoffs of power or other corrective actions before temperatures rise beyond safe limits. Sensors respond fast and reliably to incipient overheating because they are in direct thermal contact with vulnerable circuit elements.

Thakoor, Sarita↗
NASA NTRS2010

Evaluation of 3D Plus Packaging Test Structures for NASA Goddard Space Flight Center

Environmental tests were performed on packaging test structures designed and manufactured for ESA and CNES by 3D PLus ELectronics. The design provided circuit elements that acted as thermal, mechanical and moisture sensors. Other design features showed the compatibility of the packaging with chip passives, bare electronic dice and plastic encapsulated microcircuits packaged together in an innovative, stacked multichip module. The NASA GSFC testing augmented long duration testing on the same units carried out by ESA and CNES. The NASA portion demonstrated packaging stability over temperature, in moisture, with voltage stress, in shock and in vibration environments.

Plante, Jeannette↗
NASA NTRS1984

Miniature Temperature-Control Circuit

Operates on any power supply voltage from 6 to 28 volts. Miniature thermostate circuit controls electric heating element to maintain constant temperature in oven or other thermal environment.

Couch, R. H.↗
NASA NTRS2011

Design and Test of Advanced Thermal Simulators for an Alkali Metal-Cooled Reactor Simulator

The Early Flight Fission Test Facility (EFF-TF) at NASA Marshall Space Flight Center (MSFC) has as one of its primary missions the development and testing of fission reactor simulators for space applications. A key component in these simulated reactors is the thermal simulator, designed to closely mimic the form and function of a nuclear fuel pin using electric heating. Continuing effort has been made to design simple, robust, inexpensive thermal simulators that closely match the steady-state and transient performance of a nuclear fuel pin. A series of these simulators have been designed, developed, fabricated and tested individually and in a number of simulated reactor systems at the EFF-TF. The purpose of the thermal simulators developed under the Fission Surface Power (FSP) task is to ensure that non-nuclear testing can be performed at sufficiently high fidelity to allow a cost-effective qualification and acceptance strategy to be used. Prototype thermal simulator design is founded on the baseline Fission Surface Power reactor design. Recent efforts have been focused on the design, fabrication and test of a prototype thermal simulator appropriate for use in the Technology Demonstration Unit (TDU). While designing the thermal simulators described in this paper, effort were made to improve the axial power profile matching of the thermal simulators. Simultaneously, a search was conducted for graphite materials with higher resistivities than had been employed in the past. The combination of these two efforts resulted in the creation of thermal simulators with power capacities of 2300-3300 W per unit. Six of these elements were installed in a simulated core and tested in the alkali metal-cooled Fission Surface Power Primary Test Circuit (FSP-PTC) at a variety of liquid metal flow rates and temperatures. This paper documents the design of the thermal simulators, test program, and test results.

Garber, Anne E.↗
NASA NTRS2010

Use of a Frequency Divider to Evaluate an SOI NAND Gate Device, Type CHT-7400, for Wide Temperature Applications

Frequency dividers constitute essential elements in designing phase-locked loop circuits and microwave systems. In addition, they are used in providing required clocking signals to microprocessors and can be utilized as digital counters. In some applications, particularly space missions, electronics are often exposed to extreme temperature conditions. Therefore, it is required that circuits designed for such applications incorporate electronic parts and devices that can tolerate and operate efficiently in harsh temperature environments. While present electronic circuits employ COTS (commercial-off- the-shelf) parts that necessitate and are supported with some form of thermal control systems to maintain adequate temperature for proper operation, it is highly desirable and beneficial if the thermal conditioning elements are eliminated. Amongst these benefits are: simpler system design, reduced weight and size, improved reliability, simpler maintenance, and reduced cost. Devices based on silicon-on-insulator (SOI) technology, which utilizes the addition of an insulation layer in the device structure to reduce leakage currents and to minimize parasitic junctions, are well suited for high temperatures due to reduced internal heating as compared to the conventional silicon devices, and less power consumption. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a divide-by-two frequency divider circuit built using COTS SOI logic gates was evaluated over a wide temperature range and thermal cycling to determine suitability for use in space exploration missions and terrestrial fields under extreme temperature conditions.

Patterson, Richard L.↗
NASA NTRS2009

Wide-Range Temperature Sensors with High-Level Pulse Train Output

Two types of temperature sensors have been developed for wide-range temperature applications. The two sensors measure temperature in the range of -190 to +200 C and utilize a thin-film platinum RTD (resistance temperature detector) as the temperature-sensing element. Other parts used in the fabrication of these sensors include NPO (negative-positive- zero) type ceramic capacitors for timing, thermally-stable film or wirewound resistors, and high-temperature circuit boards and solder. The first type of temperature sensor is a relaxation oscillator circuit using an SOI (silicon-on-insulator) operational amplifier as a comparator. The output is a pulse train with a period that is roughly proportional to the temperature being measured. The voltage level of the pulse train is high-level, for example 10 V. The high-level output makes the sensor less sensitive to noise or electromagnetic interference. The output can be read by a frequency or period meter and then converted into a temperature reading. The second type of temperature sensor is made up of various types of multivibrator circuits using an SOI type 555 timer and the passive components mentioned above. Three configurations have been developed that were based on the technique of charging and discharging a capacitor through a resistive element to create a train of pulses governed by the capacitor-resistor time constant. Both types of sensors, which operated successfully over the wide temperature range, have potential use in extreme temperature environments including jet engines and space exploration missions.

Hammoud, Ahmad↗
NASA NTRS1991

A three-dimensional finite-element thermal/mechanical analytical technique for high-performance traveling wave tubes

Current research in high-efficiency, high-performance traveling wave tubes (TWT's) has led to the development of novel thermal/ mechanical computer models for use with helical slow-wave structures. A three-dimensional, finite element computer model and analytical technique used to study the structural integrity and thermal operation of a high-efficiency, diamond-rod, K-band TWT designed for use in advanced space communications systems. This analysis focused on the slow-wave circuit in the radiofrequency section of the TWT, where an inherent localized heating problem existed and where failures were observed during earlier cold compression, or 'coining' fabrication technique that shows great potential for future TWT development efforts. For this analysis, a three-dimensional, finite element model was used along with MARC, a commercially available finite element code, to simulate the fabrication of a diamond-rod TWT. This analysis was conducted by using component and material specifications consistent with actual TWT fabrication and was verified against empirical data. The analysis is nonlinear owing to material plasticity introduced by the forming process and also to geometric nonlinearities presented by the component assembly configuration. The computer model was developed by using the high efficiency, K-band TWT design but is general enough to permit similar analyses to be performed on a wide variety of TWT designs and styles. The results of the TWT operating condition and structural failure mode analysis, as well as a comparison of analytical results to test data are presented.

Bartos, Karen F.↗
NASA NTRS1992

A three-dimensional finite-element thermal/mechanical analytical technique for high-performance traveling wave tubes

Current research in high-efficiency, high-performance traveling wave tubes (TWT's) has led to the development of novel thermal/mechanical computer models for use with helical slow-wave structures. A three-dimensional, finite element computer model and analytical technique used to study the structural integrity and thermal operation of a high-efficiency, diamond-rod, K-band TWT designed for use in advanced space communications systems. This analysis focused on the slow-wave circuit in the radiofrequency section of the TWT, where an inherent localized heating problem existed and where failures were observed during earlier cold compression, or 'coining' fabrication technique that shows great potential for future TWT development efforts. For this analysis, a three-dimensional, finite element model was used along with MARC, a commercially available finite element code, to simulate the fabrication of a diamond-rod TWT. This analysis was conducted by using component and material specifications consistent with actual TWT fabrication and was verified against empirical data. The analysis is nonlinear owing to material plasticity introduced by the forming process and also to geometric nonlinearities presented by the component assembly configuration. The computer model was developed by using the high efficiency, K-band TWT design but is general enough to permit similar analyses to be performed on a wide variety of TWT designs and styles. The results of the TWT operating condition and structural failure mode analysis, as well as a comparison of analytical results to test data are presented.

Shalkhauser, Kurt A.↗
NASA NTRS1991

Ceramic superconducting components

An approach to the application of high-Tc ceramic superconductors to practical circuit elements was developed and demonstrated. This method, known as the rigid conductor process (RCP), involves the mounting of a preformed, sintered, and tested superconductor material onto an appropriate, rigid substrate with an epoxy adhesive which also serves to encapsulate the element from the ambient environment. Circuit elements such as straight conductors, coils and connectors were fabricated from YBa2Cu3O(7-x) superconducting material. Performance results are included for a low-noise low-thermal-conductivity superconducting grounding link for NASA.

Haertling, G. H.↗
NASA NTRS2016

Predictive Evaluations of Oxygen-Rich Hydrocarbon Combustion Gas-Centered Swirl Coaxial Injectors using a Flamelet-Based 3-D CFD Simulation Approach

NASA Marshall Space Flight Center (MSFC) has embarked upon a joint project with the Air Force to improve the state-of-the-art of space application combustion device design and operational understanding. One goal of the project is to design, build and hot-fire test a 40,000 pound-thrust Oxygen/Rocket Propellant-2 (RP-2) Oxygen-Rich staged engine at MSFC. The overall project goals afford the opportunity to test multiple different injector designs and experimentally evaluate the any effect on the engine performance and combustion dynamics. To maximize the available test resources and benefits, pre-test, combusting flow, Computational Fluid Dynamics (CFD) analysis was performed on the individual injectors to guide the design. The results of the CFD analysis were used to design the injectors for specific, targeted fluid dynamic features and the analysis results also provided some predictive input for acoustic and thermal analysis of the main Thrust Chamber Assembly (TCA). MSFC has developed and demonstrated the ability to utilize a computationally efficient, flamelet-based combustion model to guide the pre-test design of single-element Gas Centered Swirl Coaxial (GCSC) injectors. Previous, Oxygen/RP-2 simulation models utilizing the Loci-STREAM flow solver, were validated using single injector test data from the EC-1 Air Force test facility. The simulation effort herein is an extension of the validated, CFD driven, single-injector design approach applied to single injectors which will be part of a larger engine array. Time-accurate, Three-Dimensional, CFD simulations were performed for five different classes of injector geometries. Simulations were performed to guide the design of the injector to achieve a variety of intended performance goals. For example, two GCSC injectors were designed to achieve stable hydrodynamic behavior of the propellant circuits while providing the largest thermal margin possible within the design envelope. While another injector was designed to purposefully create a hydrodynamic instability in the fuel supply circuit as predicted by the CFD analysis. Future multi-injector analysis and testing will indicate what if any changes occur in the predicted behavior for the single-element injector when the same injector geometry is placed in a multi-element array.

Richardson, Brian R.↗
NASA NTRSDate not supplied

X-Ray Missions Based on LTD Technologies

Microcalorimeter arrays used as imaging spectrometers will enable ground-breaking science in X-ray astrophysics. Their development has been one of the driving applications of the low temperature detector community since the early 1980s. While their application in space remains in relative infancy, we are on the verge of an era in which microcalorimeter spectrometers are likely to dominate instrumentation for high-energy astrophysics missions. NASA sounding rocket experiments such as the X-ray Quantum Calorimeter (XQC) and Micro-X have now paved the way for orbital observatories. JAXA’s Astro-H gave us a glimpse of this fantastic new capability before its unfortunate demise. The launch of XRISM later this year should finally demonstrate the sort of large suite of observations that X-ray microcalorimeter arrays will make major contributions to. In the mid-2030s, we will see the launch of ESA’s flagship Athena mission, that will further advance the imaging and spectroscopic capabilities for the high-energy X-ray community enormously. Numerous other potential new mission concepts using X-ray microcalorimeters have been studied in detail such as NASA’s Lynx and the Light Element Mapper (LEM), JAXA’s Super-DIOS, and China’s Hot Universe Baryon Surveyor (HUBS). In the first half of this presentation, I will review the development and desired requirements of the X-ray microcalorimeter missions and concepts, and describe the current progress and status missions being implemented and proposed. In the second half of this presentation, I will focus on The Line Emission Mapper (LEM) which is a probe-class mission concept under study by NASA that is designed to provide unprecedented insight into the physics of galaxy formation, including stellar and black-hole feedback and flows of baryonic matter into and out of galaxies. LEM incorporates a light-weight X-ray optic with 10” angular resolution and a large-format microcalorimeter array with a 15” pixel pitch over a 29’ field of view (FOV). The main microcalorimeter array and readout design takes advantage of mature technology that has been developed for Athena X-IFU. The central 7’ region of the array consists of ~ 800 transition-edge sensors (TESs), optimized for a bandpass of 0.3-2 keV and with an energy resolution of 1.2 eV at 1 keV. The rest of the FOV is covered by 4-pixel TES hydras with 2.5 eV energy resolution at 1 keV. Hydras are position-sensitive (‘thermally multiplexed’) detectors that enable extremely large numbers of effective pixels in an array, without a commensurate increase in the number of wires, bias circuit, and readout components. In total the array will have ~ 4k TESs with ~ 14k imaging elements on a 290 micron-pitch. The array will be read out with state-of-the-art time-division multiplexing (TDM), implement with 59 pixels (and 1 dark pixel) in each of the 69 TDM columns. Here we present a detailed overview of the baseline microcalorimeter detector design and present first results from both single pixel TESs and 4-pixel hydras. Our prototype LEM pixels utilize 15um x 50um Mo/Au TESs with a transition temperature of around 58 mK. These pixels incorporate high-fill-factor Au absorbers of thickness 0.54um. We have demonstrated an energy resolution of 0.90+/-0.02 eV and 1.90 +/-0.02 eV at 1.5 keV for single pixel and 4-pixel hydras, respectively, meeting the performance requirements of LEM. We show how the position discrimination in the hydra pixels can be achieved, down to energies of a few 100 eV, using the measured pulse rise-times. Finally, we will show that the properties of the LEM pixels are well optimized for the proposed TDM read out architecture.

Simon Richard Bandler↗
NASA NTRS2008

Cosmic Microwave Background Polarization Detector with High Efficiency, Broad Bandwidth, and Highly Symmetric Coupling to Transition Edge Sensor Bolometers

Four probe antennas transfer signals from waveguide to microstrip lines. The probes not only provide broadband impedance matching, but also thermally isolate waveguide and detector. In addition, we developed a new photonic waveguide choke joint design, with four-fold symmetry, to suppress power leakage at the interface. We have developed facilities to test superconducting circuit elements using a cryogenic microwave probe station, and more complete systems in waveguide. We used the ring resonator shown below to measure a dielectric loss tangent < 7x10(exp -4) over 10 - 45 GHz. We have combined component simulations to predict the overall coupling from waveguide modes to bolometers. The result below shows the planar circuit and waveguide interface can utilize the high beam symmetry of HE11 circular feedhorns with > 99% coupling efficiency over 30% fractional bandwidth.

Wollack, E.↗
NASA NTRS1998

3-D Modeling of Double-Diffusive Convection During Directional Solidification of a Non-Dilute Alloy with Application to the HgCdTe Growth Under Microgravity Conditions

A numerical calculation for a non-dilute alloy solidification was performed using the FIDAP finite element code. For low growth velocities plane front solidification occurs. The location and the shape of the interface was determined using melting temperatures from the HgCdTe liquidus curve. The low thermal conductivity of the solid HgCdTe causes thermal short circuit through the ampoule walls, resulting in curved isotherms in the vicinity of the interface. Double-diffusive convection in the melt is caused by radial temperature gradients and by material density inversion with temperature. Cooling from below and the rejection at the solid-melt interface of the heavier HgTe-rich solute each tend to reduce convection. Because of these complicating factors dimensional rather then non-dimensional modeling was performed. Estimates of convection contributions for various gravity conditions was performed parametrically. For gravity levels higher then 1 0 -7 of earth's gravity it was found that the maximum convection velocity is extremely sensitive to gravity vector orientation and can be reduced at least by factor of 50% for precise orientation of the ampoule in the microgravity environment. The predicted interface shape is in agreement with one obtained experimentally by quenching. The results of 3-D modeling are compared with previous 2-D finding. A video film featuring melt convection will be presented.

Bune, Andris V.↗
NASA NTRS2009

Operation of SOI P-Channel Field Effect Transistors, CHT-PMOS30, under Extreme Temperatures

Electronic systems are required to operate under extreme temperatures in NASA planetary exploration and deep space missions. Electronics on-board spacecraft must also tolerate thermal cycling between extreme temperatures. Thermal management means are usually included in today s spacecraft systems to provide adequate temperature for proper operation of the electronics. These measures, which may include heating elements, heat pipes, radiators, etc., however add to the complexity in the design of the system, increases its cost and weight, and affects its performance and reliability. Electronic parts and circuits capable of withstanding and operating under extreme temperatures would reflect in improvement in system s efficiency, reducing cost, and improving overall reliability. Semiconductor chips based on silicon-on-insulator (SOI) technology are designed mainly for high temperature applications and find extensive use in terrestrial well-logging fields. Their inherent design offers advantages over silicon devices in terms of reduced leakage currents, less power consumption, faster switching speeds, and good radiation tolerance. Little is known, however, about their performance at cryogenic temperatures and under wide thermal swings. Experimental investigation on the operation of SOI, N-channel field effect transistors under wide temperature range was reported earlier [1]. This work examines the performance of P-channel devices of these SOI transistors. The electronic part investigated in this work comprised of a Cissoid s CHT-PMOS30, high temperature P-channel MOSFET (metal-oxide semiconductor field-effect transistor) device [2]. This high voltage, medium-power transistor is designed for geothermal well logging applications, aerospace and avionics, and automotive industry, and is specified for operation in the temperature range of -55 C to +225 C. Table I shows some specifications of this transistor [2]. The CHT-PMOS30 device was characterized at various temperatures over the range of -190 C to +225 C in terms of its voltage/current characteristic curves. The test temperatures included +22, -50, -100, -150, -175, -190, +50, +100, +150, +175, +200, and +225 C. Limited thermal cycling testing was also performed on the device. These tests consisted of subjecting the transistor to a total of twelve thermal cycles between -190 C and +225 C. A temperature rate of change of 10 C/min and a soak time at the test temperature of 10 minutes were used throughout this work. Post-cycling measurements were also performed at selected temperatures. In addition, re-start capability at extreme temperatures, i.e. power switched on while the device was soaking for a period of 20 minutes at the test temperatures of -190 C and +225 C, was investigated.

Patterson, Richard↗
NASA NTRS1979

Environmental performance evaluation of an advanced-design solid-state television camera

The development of an advanced-design black-and-white solid-state television camera which can survive exposure to space environmental conditions was undertaken. A 380 x 488 element buried-channel CCD is utilized as the image sensor to ensure compatibility with 525-line transmission and display equipment. Specific camera design approaches selected for study and analysis included: (1) component and circuit sensitivity to temperature; (2) circuit board thermal and mechanical design; and (3) CCD temperature control. Preferred approaches were determined and integrated into the final design for two deliverable solid-state TV cameras. One of these cameras was subjected to environmental tests to determine stress limits for exposure to vibration, shock, acceleration, and temperature-vacuum conditions. These tests indicate performance at the design goal limits can be achieved for most of the specified conditions.

Source record↗
NASA NTRS1992

Aerodynamic roughness measured in the field and simulated in a wind tunnel

This study evaluates how well values of aerodynamic surface roughness, z sub 0, measured over scale models in wind tunnels correlate with values of z sub 0 measured at full scale in the field. A field experiment was conducted in which values of z sub 0 and u* (wind friction speed) were measured over three arrays of non-erodible roughness elements on a dry lake bed. Wind profiles were measured by ten anemometers on a 15 m mast under thermally neutral atmospheric conditions. Values of z sub 0 increased from .00014 m (dry lake bed only) to .026 m with increasing roughness element density. The three roughness element arrays were simulated at 1/10 and 1/20 scale in an open-circuit atmospheric boundary-layer wind tunnel. Velocities were measured with a boundary-layer pitot-tube rake from the same relative position within the scale model arrays as the anemometers were relative to the field arrays. Each array at each scale was sampled three times at five freestream velocities. Average values of z sub 0 for each model array at each scale were compared with full-scale values of z sub 0 obtained in the field. The field vs. wind tunnel correspondence of z sub 0 is found to be z sub 0 field = 0.2661 x (z sub(0 model) x scale(exp -1))exp .8159.

Sullivan, Robert↗
NASA NTRS2000

Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical Systems (MEMS) for Space Applications

MEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc. Standard semiconductor microelectronics packaging needs the integrated circuits (IC) to be protected from the harsh environment, and provide electrical communication with the other parts of the circuit, facilitate thermal dissipation efficiently, and impart mechanical strength to the silicon die. Microelectronics packaging involves wafer dicing, bonding, lead attachment, encapsulation to protect from the environment, electrical integrity, and package leak tests to assure the reliable IC packaging technology. Active elements or microstructures in MEMS devices often interfaces with the hostile environment where packaging leak tests and testing of such devices using chemical and mechanical parameters will be very difficult and expensive. Packaging of MEMS is significantly complex as they serve to protect from the environment and microstructures interact with the same environment to measure or affect the desired physical or chemical parameters. The most of the silicon circuitry is sensitive to temperature, moisture, magnetic field, light, and electromagnetic interference. The package must then protect the on-board silicon circuitry while simultaneously exposing the microsensor to the effect it measures to assure the packaging technology of MEMS. MEMS technology has a major application in developing a microspacecraft for space systems provided reliability of MEMS packaging technology is sufficiently addressed. This MEMS technology would eventually miniaturize many of the components of the spacecraft to reach the NASA's goal by building faster, cheaper, better, smaller spacecraft to explore the space more effectively. This paper discusses the latest developments in the MEMS technology and challenging technical issues in the packaging of hermetically sealed and non-hermetically sealed MEMS sensor devices for microspacecraft applications.

Ramesham, Rajeshuni↗
NASA NTRS1986

Compensation of reflector surface distortions using conjugate field matching

The feasibility of compensating for reflector surface distortions has been investigated. The performance characteristics (gain, sidelobe level, null location, beamwidth, etc.) of space communication reflector antenna systems degrade as the reflector surface distorts due to thermal effects from a varying solar flux. The technique reported here will maintain the design radiation performance independently of thermal effects on the reflector surface. With the advent of monolithic microwave integrated circuits (MMIC), a greater flexibility in array-fed reflector system design can be achieved. MMIC arrays provides independent control of amplitude and phase for each of many radiating elements of the feed array. The conjugate field matching technique provide a basis for obtaining the required element excitations under surface distortion for maintaining the design radiation performance. It is assumed that the surface characteristics (x, y, z, first derivatives, and second derivatives) under distortion are known.

Acosta, R. J.↗