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Results for “thermal contact resistance”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records

Thermal Contact Resistance

Thermal, surface, and deformation analyses for predicting thermal contact resistance for metal surface characteristics in vacuum and fluid environment

METAL SURFACE↗

Significance of thermal contact resistance in two-layer thermal-barrier-coated turbine vanes

The importance of thermal contact resistance between layers in heat transfer through two layer, plasma sprayed, thermal barrier coatings applied to turbine vanes was investigated. Results obtained with a system of NiCrAlY bond and yttria stabilized zirconia ceramic show that thermal contact resistance between layers is negligible. These results also verified other studies which showed that thermal contact resistance is negligible for a different coating system of NiCr bond calcia stabilized zirconia ceramic. The zirconia stabilized ceramic thermal conductivity data scatter presented in the literature is ?20 to -10 percent about a curve fit of the data. More accurate predictions of heat transfer and metal wall temperatures are obtained when the thermal conductivity values are used at the ?20 percent level.

Liebert, C. H.↗

Noncured Graphene Thermal Interface Materials for High-Power Electronics: Minimizing the Thermal Contact Resistance

We report on experimental investigation of thermal contact resistance, RC, of the noncuring graphene thermal interface materials with the surfaces characterized by different degree of roughness, Sq. It is found that the thermal contact resistance depends on the graphene loading, ξ, non-monotonically, achieving its minimum at the loading fraction of ξ ~15 wt%. Decreasing the surface roughness by Sq~1 μm results in approximately the factor of ×2 decrease in the thermal contact resistance for this graphene loading. The obtained dependences of the thermal conductivity, KTIM, thermal contact resistance, RC, and the total thermal resistance of the thermal interface material layer on ξ and Sq can be utilized for optimization of the loading fraction of graphene for specific materials and roughness of the connecting surfaces. Our results are important for the thermal management of high-power-density electronics implemented with diamond and other wide-band-gap semiconductors.

36 MATERIALS SCIENCE↗

Thermal contact resistance in vacuum.

Similar or dissimilar materials thermal contact resistance in vacuum with negligible film effect, obtaining constriction resistance

THERMAL CONDUCTOR↗

Review of Thermal Contact Resistance of Flexible Graphite Materials for Thermal Interfaces in High Heat Flux Applications

In this report the data is reviewed on thermal contact conductance (TCC) and/or thermal contact resistance (TCR) at material interfaces which employs flexible graphite (FG) materials as thermal interface materials (TIM). FG materials are often used as TIM due to their conforming nature. While the overall TCR can be estimated straightforward from measured data, the interface TCR is much more difficult to obtain. The report also discusses the interfacial thermal contact conductance between FG-tungsten and FG-Glidcop-Al15, which are envisioned for high-heat flux applications.

36 MATERIALS SCIENCE↗

Measurements of the effects of thermal contact resistance on steady state heat transfer in phosphoric-acid fuel cell stack

The influence of the thermal contact resistance on the heat transfer between the electrode plates, and the cooling system plate in a phosphoric-acid fuel-cell stack was experimentally investigated. The investigation was conducted using a set-up that simulates the operating conditions prevailing in a phosphoric acid fuel-cell stack. The fuel-cell cooling system utilized three types of coolants, water, engine oil, and air, to remove excess heat generated in the cell electrode and to maintain a reasonably uniform temperature distribution in the electrode plate. The thermal contact resistance was measured as a function of pressure at the interface between the electrode plate and the cooling system plate. The interface pressure range was from 0 kPa to 3448 kPa, while the Reynolds number for the cooling limits varied from 15 to 79 for oil, 1165 to 6165 for water, and 700 to 6864 for air. Results showed that increasing the interface pressure resulted in a higher heat transfer coefficient.

Abdul-Aziz, Ali↗

Improvement of thermal contact resistance by carbon nanotubes and nanofibers

Interfacial thermal resistance results of various nanotube and nanofiber coatings, prepared by chemical vapor deposition (CVD) methods, are reported at relatively low clamping pressures. The five types of samples examined include multi-walled and single-walled nanotubes growth by CVD, multi-walled nanotubes grown by plasma enhanced CVD (PECVD) and carbon nanofibers of differing aspect ratio grown by PECVD. Of the samples examined, only high aspect ratio nanofibers and thermally grown multi-walled nanotubes show an improvement in thermal contact resistance. The improvement is approximately a 60% lower thermal resistance than a bare Si-Cu interface and is comparable to that attained by commercially available thermal interface materials.

Evaluation Studies↗

Thermal contact resistance in a non-ideal joint

Analysis has been conducted to determine thermal contact resistance at interface of two heat conductors and effect of roughness of mating surfaces on pressure distribution. Investigation reveals how heat transfer resistance may be decreased or increased by changing surface properties of particular interface being considered.

Roca, R. T.↗

Significance of thermal contact resistance in two-layer, thermal-barrier-coated turbine vanes

The paper studies calculated and measured metal wall temperatures of uncoated vanes and the same vanes coated with a thermal barrier coating system of NiCrAlY bond and yttria-stabilized zirconia ceramic. It is shown that thermal contact between layers is negligible. The significance of data scatter and of published ceramic thermal conductivity values is discussed.

Liebert, C. H.↗