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At least 19 records

Damage Assessment of Stress-Thermal Cycled high temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycles range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees Celsius associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle; the number of cycles; the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles: 1. Ambient temperature - -196 degrees celsius. 2. Ambient temperature - 150 degrees Celsius; 200 degrees Celsius; 250 degrees Celsius. 3. -196 degrees Celsius - 250 degrees Celsius. The Principle findings are that the full cycles from -196 degrees Celsius to to 250 degrees Celsius cause the most significant microcrack of development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associate with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M60JB carbon fabric [0f,90f,90f,0f,0f,90f]ls composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75% of the composite cryogenic (-196 degrees Celsius) ultimate strength.

Ju, Jae-Hyung↗

Thermal stress cycling of GaAs solar cells

Thermal stress cycling was performed on gallium arsenide solar cells to investigate their electrical, mechanical, and structural integrity. Cells were cycled under low Earth orbit (LEO) simulated temperature conditions in vacuum. Cell evaluations consisted of power output values, spectral response, optical microscopy and ion microprobe mass analysis, and depth profiles on both front surface inter-grid areas and metallization contact grid lines. Cells were examined for degradation after 500, 5,000, 10,000 and 15,245 thermal cycles. No indication of performance degradation was found for any vendor's cell lot.

Francis, Robert W.↗

Damage Assessment of Stress-Thermal Cycled High Temperature

We report on the characterization of bismaleimide and polyimide carbon fiber composite, microcrack development under stress thermal cycling loading. Such cycle range from cryogenic temperatures associated with cryogenic fuel (LN, LOX) containment to high temperatures of 300 degrees associated with future hypervelocity aeropropulsion systems. Microcrack development thresholds as a function of temperature range of the thermal cycle, the number of cycles, and the applied stress level imposed on the composite are reported. We have conducted stress-thermal cycles on thin bismaleimide-woven carbon fiber foils for three temperature range cycles. The principle findings are that the full cycles from -196 degree celsius up to 250 degree celsius cause the most significant microcrack development. These observations indicate that the high temperature portion of the cycle under load causes fiber-matrix interface failure and subsequent exposure to higher stresses at the cryogenic, low temperature region results in composite matrix microcracking as a result of the additional stresses associated with the fiber-matrix thermal expansion mismatch. Our initial studies for 12 ply PMR-II-50 polyimide/M6OJB carbon fabric [0f, 90f, 90f, 0f, 0f, 90f] composites will be presented. The stress-thermal cycle test procedure for these will be described. Moisture absorption characteristics between cycles will be used to monitor interconnected microcrack development. The applied stress level will be 75 percent of the composite cryogenic -196 degree celsius ultimate strength.

Ju, Jach-Yung↗

Thermal stress cycling of GaAs solar cells

A thermal cycling experiment was performed on GaAs solar cells to establish the electrical and structural integrity of these cells under the temperature conditions of a simulated low-Earth orbit of 3-year duration. Thirty single junction GaAs cells were obtained and tests were performed to establish the beginning-of-life characteristics of these cells. The tests consisted of cell I-V power output curves, from which were obtained short-circuit current, open circuit voltage, fill factor, and cell efficiency, and optical micrographs, spectral response, and ion microprobe mass analysis (IMMA) depth profiles on both the front surfaces and the front metallic contacts of the cells. Following 5,000 thermal cycles, the performance of the cells was reexamined in addition to any factors which might contribute to performance degradation. It is established that, after 5,000 thermal cycles, the cells retain their power output with no loss of structural integrity or change in physical appearance.

Janousek, B. K.↗

Develop Silicone Encapsulation Systems for Terrestrial Silicon Solar Arrays

The results of a study for Task 3 of the Low Cost Solar Array Project, directed toward the development of a cost effective encapsulation system for photovoltaic modules using silicon based materials, are reported. Results of the following are discussed: (1) weather-ometer stressing vs. weathering history of silicon and silicon modified materials; (2) humidity/temperature cycling exposure; (3) exposure at high humidity/high temperature; (4) outdoor exposure stress; (5) thermal cycling stress; and (6) UV screening agents. The plans for the next quarter are outlined.

Source record↗

Fast Quasi-Static Time-Series Simulation for Accurate PV Inverter Semiconductor Fatigue Analysis with a Long-Term Solar Profile

Power system simulations with long-term data typically have large time steps varying from one second to a few minutes. However, for PV inverter semiconductors, the minimum thermal stress cycle occurs over the fundamental grid frequency (50 or 60 Hz). This requires the time step of the fatigue simulation to be around 100 µs. This small time step requires long computation times to process yearly power production profiles. This paper proposes a fast fatigue simulation for inverter semiconductors using the quasi-static time series (QSTS) simulation concept. The proposed simulation calculates the steady state of the semiconductor junction temperature by using a Fast Fourier Transform (FFT). The small thermal cycling during a switching period and even over the fundamental waveform is disregarded to further accelerate the simulation speed. The resulting time step of the fatigue simulation is 15 minutes, which is consistent with the solar dataset. The error of the proposed simulation is 0.16% compared to the fatigue simulation results using the complete thermal stress profile. A PV inverter that responds to a Transactive Energy System (TES) is simulated to demonstrate the use of the proposed fatigue simulation. The proposed simulation has the potential to co-simulate with system level simulation tools that also adopt the QSTS concept.

Liu, Yunting↗

Effect of thermal cycling on stress in metallic films on ceramic substrates

The hydrogen maser is the most stable frequency standard currently available for averaging intervals of hours to weeks. A major contributor to maser frequency variations is the maser's microwave resonant cavity: by means of the cavity pulling effect, a change in the cavity's resonance frequency produces a proportional change in the maser's output frequency. To minimize variations in the cavity's dimensions, and thus in its resonance frequency, maser cavities are often constructed of a low-expansivity glass-ceramic material coated on its surface with a conductive metallic film. It was previously shown that silver films like those used in SAO maser cavities develop tensile stress when cooled to room temperature after being fired onto the cavity, and that the stress in such films relaxes with time at a rate proportional to the level of stress. Stress relaxation in maser cavity coatings can alter the shape, and hence the resonance frequency, of the cavity, resulting in a slow variation in the maser's output frequency. The possibility was investigated of reversing the initial tensile stress by precooling the coated cavity material. It was hypothesized that cooling the material well below its normal working temperature and then warming it to its normal temperature would result in a lower tensile stress or even a compressive stress. Under such a condition stress relaxation, and thus any consequent frequency drifts, might be reduced or reversed.

Mattison, Edward M.↗

On the Recovery Stress of a Ni50.3Ti29.7Hf20 High Temperature Shape Memory Alloy

Recovery stress in shape memory alloys (SMAs), also known as blocking stress, is an important property generally obtained during heating under a dimensional constraint as the material undergoes the martensitic phase transformation. This property has been instinctively utilized in most SMA shape-setting procedures, and has been used in numerous applications such as fastening and joining, rock splitting, safety release mechanisms, reinforced composites, medical devices, and many other applications. The stress generation is also relevant to actuator applications where jamming loads (e.g., in case the actuator gets stuck and is impeded from moving) need to be determined for proper hardware sizing. Recovery stresses in many SMA systems have been shown to reach stresses in the order of 800 MPa, achieved via thermo-mechanical training such as pre-straining, heat treatments or other factors. With the advent of high strength, high temperature SMAs, recovery stress data has been rarely probed, and there is no information pertinent to the magnitudes of these stresses. Thus, the purpose of this work is to investigate the recovery stress capability of a precipitation strengthened, Ni50.3Ti29.7Hf20 (at.) high temperature SMA in uniaxial tension and compression. This material has been shown to exhibit outstanding strength and stability during constant-stress, thermal cycling, but no data exists on constant-strain thermal cycling. Several training routines were implemented as part of this work including isothermal pre-straining, isobaric thermal cycling, and isothermal cyclic training routines. Regardless of the training method used, the recovery stress was characterized using constant-strain (strain-controlled condition) thermal cycling between the upper and lower cycle temperatures. Preliminary results indicate recovery stresses in excess of 1.5 GPa were obtained after a specific training routine. This stress magnitude is significantly higher than conventional NiTi stress generation capability.

Recovery Stress↗

Hotspot testing of glass/backsheet and glass/glass PV modules pre-stressed in extended thermal cycling

This paper investigates the effect of hotspot (HS) stress endurance of two of the latest designs of monocrystalline modules: a half-cell glass/backsheet (G/B) module and a full-cell glass/glass (G/G) module. These modules have already been pre-stressed in extended thermal cycling with 600 cycles per the IEC 61215 standard to represent field-stressed modules. This study differs from the other conventional studies wherein only fresh modules are subjected to hotspot endurance stress. The G/G module reached a maximum temperature of approximately 200 °C at a cell shading of 25 %, 55 °C higher than the maximum hotspot temperature of 145 °C in the G/B module. A significant burn mark, without glass shattering, was observed in the hotspot-stressed cell of the G/G module due to the current mismatch induced by partial shading. Most of the cells in the G/G module appear to be severely damaged (severe dark areas), as observed in the electroluminescence (EL) image, while the dark regions were rarely present in the G/B module. The EL image also illustrates multiple cell cracks that resist current flow and eventually contribute to the full-cell module degradation. About 8.3 % degradation in maximum power was observed for the G/G module and 1.3 % for the G/B module after the sequential stress tests. The lower degradation in the G/B module can potentially be attributed to its design, which comprises of two parallel strings, each having 72-half-cells and benefits from lower heat dissipation. Furthermore, this indicates that the half-cell design could potentially minimize the hotspot degradation and failures in crystalline-silicon modules.

14 SOLAR ENERGY↗

Experiment and Modeling of Simultaneous Creep, Plasticity and Transformation of High Temperature Shape Memory Alloys During Cyclic Actuation

The present work is focused on studying the cycling actuation behavior of HTSMAs undergoing simultaneous creep and transformation. For the thermomechanical testing, a high temperature test setup was assembled on a MTS frame with the capability to test up to temperatures of 600 C. Constant stress thermal cycling tests were conducted to establish the actuation characteristics and the phase diagram for the chosen HTSMA. Additionally, creep tests were conducted at constant stress levels at different test temperatures to characterize the creep behavior of the alloy over the operational range. A thermodynamic constitutive model is developed and extended to take into account a) the effect of multiple thermal cycling on the generation of plastic strains due to transformation (TRIP strains) and b) both primary and secondary creep effects. The model calibration is based on the test results. The creep tests and the uniaxial tests are used to identify the viscoplastic behavior of the material. The parameters for the SMA properties, regarding the transformation and transformation induced plastic strain evolutions, are obtained from the material phase diagram and the thermomechanical tests. The model is validated by predicting the material behavior at different thermomechanical test conditions.

Kumar, Parikshith K.↗

Contact thermal shock test of ceramics

A novel quantitative thermal shock test of ceramics is described. The technique employs contact between a metal-cooling rod and hot disk-shaped specimen. In contrast with traditional techniques, the well-defined thermal boundary condition allows for accurate analyses of heat transfer, stress, and fracture. Uniform equibiaxial tensile stresses are induced in the center of the test specimen. Transient specimen temperature and acoustic emission are monitored continuously during the thermal stress cycle. The technique is demonstrated with soda-lime glass specimens. Experimental results are compared with theoretical predictions based on a finite-element method thermal stress analysis combined with a statistical model of fracture. Material strength parameters are determined using concentric ring flexure tests. Good agreement is found between experimental results and theoretical predictions of failure probability as a function of time and initial specimen temperature.

Rogers, W. P.↗

Development of Testing Methods to Predict Cracking in Photovoltaic Backsheets

In recent years there have been some significant failures of photovoltaic backsheets resulting from inadequacies of design that are not detected in current versions of the qualification standards. In some cases, this has resulted in catastrophic failure in less than 5 y of deployment. In this work, we develop a test sample construction and evaluate accelerated exposure conditions necessary to duplicate the cracking field failure of backsheets using a small and manageable coupon. This sample uses a piece of solder wire to put some controlled topology and stress into the backsheet. Through exposure to different environmental stressors it was found that the application of thermal cycling stresses, after ultraviolet radiation exposure, is of primary importance to duplicate field failures.

14 SOLAR ENERGY↗

Alumina Paste Layer as a Sublimation Suppression Barrier for Yb14MnSb11

Sublimation is a major cause of degradation of thermoelectric power generation systems. Most thermoelectric materials tend to have peak values at the temperature where sublimation occurs. A sublimation barrier is needed that is stable at operating temperatures, inert against thermoelectric materials, and able to withstand thermal cycling stress. A porous alumina paste layer is suitable as a sublimation barrier for Yb14MnSb11. It can accommodate stress generated by the thermal expansion discrepancy between the suppression layer and thermoelectric materials. Sublimation suppression is achieved by filling pores naturally with YbO2, a natural byproduct of sublimation. YbO2 generated during the sublimation of Yb14MnSb11 fills the porous structure of the alumina paste, causing sublimation to decrease with time as the pores become filled.

Paik, Jong-Ah↗

Quasi-Static Time Series Fatigue Simulation for PV Inverter Semiconductors with Long-Term Solar Profile

Power system simulations with long-term data tend to have large time steps varying from one second to a few minutes. However, for PV inverter semiconductors, the minimum thermal stresses cycle is with line frequency. This requires the time step of the fatigue simulation to be much smaller than the line period. This small time step results in poor simulation speed, especially for long-term simulations. This paper proposes a fast fatigue simulation for inverter semiconductors using the quasi-static time series (QSTS) simulation concept. The fatigue analysis typically focuses on the peak and valley values of a strain and neglect the transients from peaks to valleys. The proposed simulation utilizes this property of fatigue analysis and calculates the steady state of the semiconductor junction temperature only. The resulting time step of the fatigue simulation is 15 minutes, which is consistent with the solar dataset without losing accuracy.

fast simulation↗

Reliability of Materials and Components for Solid Oxide Fuel Cells

Planar stack solid-oxide fuel cells (SOFCs) require seals that must operate reliably under demanding conditions for lifetimes of 40000 hours. This includes temperature fluctuations between 800°C and RT during on and off cycles, thermal stresses, oxidizing environments and chemical degradation to name a few. This comprehensive report provides results from long term testing of two commercially available multicomponent barium alkali silicate glasses: SCN and G6, chosen as sealing candidates. In this scope, the glass seals were deposited on YSZ and Al 2 O 3 substrates simulating electrolytes (Zrbased) and coatings (both zirconia and Al 2 O 3 ). The seal-substrate couples were subjected to 800°C under air and steam+H 2 +N 2 environments up to 40000 hours to test their integrity under real operating conditions. Extensive studies on the effects of exposure have been conducted over the span of testing at various time intervals. Within the context of characterization, mechanical properties such as density, roughness, thermal expansion and glass transition, viscosity and wettability behavior; and microstructural properties such as glass chemistries, defect formation (cracks and pores), phase transformations (devitrification) and glass-interface reactions are investigated. Results and discussions are provided with a focus on the degradation of the properties over long term interrupted testing.

30 DIRECT ENERGY CONVERSION↗

High performance polymer development

The term high performance as applied to polymers is generally associated with polymers that operate at high temperatures. High performance is used to describe polymers that perform at temperatures of 177 C or higher. In addition to temperature, other factors obviously influence the performance of polymers such as thermal cycling, stress level, and environmental effects. Some recent developments at NASA Langley in polyimides, poly(arylene ethers), and acetylenic terminated materials are discussed. The high performance/high temperature polymers discussed are representative of the type of work underway at NASA Langley Research Center. Further improvement in these materials as well as the development of new polymers will provide technology to help meet NASA future needs in high performance/high temperature applications. In addition, because of the combination of properties offered by many of these polymers, they should find use in many other applications.

Hergenrother, Paul M.↗