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Gaps in Thermal Design Guidelines in the Goddard Space Flight Center GOLD Rules
The GSFC (Goddard Space Flight Center) GOLD Rules (Goddard Open Learning Design; GSFC-STD-1000) provide a reasonably comprehensive list of guidelines for the design and testing of spacecraft and instruments based on the long heritage of successful GSFC missions. In general, all GSFC missions are required to comply with the GOLD Rules across a number of subsystems or to seek waivers to particular GOLD rules where compliance is not practical, either due to the risk posture of a mission or the cost and/or schedule associated with compliance. In thermal subsystems, GOLD Rules are applied to design margins throughout the project life cycle and include temperature margins, heater power margins, and two-phase transport margins. However, no explicit guidance is provided for two thermal design aspects: heater control authority (for stability requirements) and cryogenic design margins (which are often not reasonable to express in terms of temperatures). This can lead to ambiguity and inconsistency among projects when demonstrating GOLD Rules compliance. Two current GSFC projects, TIRS-2 (Thermal InfraRed Sensor 2) and WFIRST (Wide Field InfraRed Survey Telescope), are both missions with cryogenic aspects and active thermal control for stability. This paper seeks to outline the characterization of cryogenic margins during the design process for TIRS-2 and WFIRST as well as the project derived guidelines for heater control authority margin. This effort serves as potential first steps for updating the GOLD Rules to address these two areas in guiding thermal designs at GSFC.
Thermal Cycle Reliability of PBGA/CCGA 717 I/Os
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its plastic ball grid array (PBGA) version. both having 560 I/Os. were presented in last year's conference. Test results included environmental data for three different thermal cycle regimes (-55 C/125 C, -55 C/100 C, and -50 C /75 C). Update information on these - especially failure type for assemblies with high and low solder volumes-were presented. The thermal cycle test procedure followed those recommended IPC-9701 for tin-lead solder joint assemblies. Revision A of this specification covers guideline thermal cycle requirements for Pb-free solder joints. Some background information discussed during release of this specification with its current guideline recommendations were also presented. In a recent reliability investigation a fully populated CCGA with 717 I/Os was also considered for assembly reliability. evaluation. The functional package is a field-programmable gate array that has much higher processing power than its previous version. This new package is smaller in dimension, has no interposer, and has a thinner column wrapped with copper for reliability improvement. This paper will also present thermal cycle test results for this package assembly and its plastic version with 728 I/Os. both of which were exposed to three different cycle regimes. Two cycle profiles were those specified by IPC- 9701A for tin-lead, i.e. -55 to 100 C and -55 to 125 C and one was a cycle profile specified by Mil-Std-883, i.e.. -65 C/150 C which is generally used for ceramic hybrid packages. Per IPC-9701 A, test vehicles were built using daisy chain packages and were continuously monitored. The effects of many process and assembly variables-including corner staking commonly used for improving resistance to mechanical loading such as drop and vibration loads--were also considered as part of the test matrix. Optical photomicrographs were taken at various thermal cycle intervals to document damage progress and behavior. Representative samples of these along with cross-sectional photomicrographs at higher magnification taken by scanning electron microscopy (SEM) to determine crack propagation and failure analyses for packages are also presented.
Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.
Thermal interface materials selection and application guidelines: in perspective of Xilinx Virtex-5QV thermal management
The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device.
Thermal Environments and Margin Guidelines for NASA’s X-57 “Maxwell” Flight Demonstrator
NASA’s X-57 project includes development and flight demonstration of new electrified propulsion systems and equipment. The system components are designed to operate without active thermal management, which places increased emphasis on the ambient conditions as well as environmental stress screening for the newly designed equipment. Since the X-57 will not be operated outside of the Dryden Aeronautical Test Range at NASA’s Armstrong Flight Research Center, the X-57 team developed a series of reference atmospheres, described in this paper, based on the 2019 Edwards Range Reference Atmosphere to guide system development and testing. These four reference atmospheres include a standard day reference atmosphere that is identical to the 1976 U. S. Standard Atmosphere, a mean operational day atmosphere based on the mean 2019 Edwards Range Reference Atmosphere, and hot and cold day atmospheres based on the ±2σ yearly temperature variations in the Edwards Range Reference Atmosphere. As described herein, these reference atmospheres were then used to develop anticipated operational extremes for thermal cycle testing for the X-57 systems, which were developed from an amalgamation of two standards:SMC-S-016 and DO-160G. The project also adopted thermal margin guidance from SMC-S-016 to set requirements for the development of new electrified propulsion system components.
Rapid Development of Instrument Thermal Models: Perspectives and Guidelines from NASA Goddard’s Instrument Design Laboratory
- The design and development of robotic spaceflight instruments is a critical part of NASA’s vision to discover and expand knowledge for the benefit of humanity - For typical flight instrument projects, thermal engineers will develop initial instrument thermal models over weeks or months, then iterate them over a project’s lifespan – In each iteration, the engineer will: - Refine their thermal models and thermal designs in accordance with updates from other subsystems - Perform trade studies - Solve very detailed and complex analysis problems, including worst-cases and contingencies - Pick hardware and plan for testing and integration - However, prior to a project being established, or for proposal development at an early conceptual stage, the luxury of multiple instrument design iterations may be limited or nonexistent – Within a short timeline, how do you complete a thermal model or explore multiple possible instrument configurations? – What are the critical parameters for your model? Which details do you include or leave out?
Rapid Development of Instrument Thermal Models: Perspectives and Guidelines from NASA Goddard’s Instrument Design Laboratory
The Instrument Design Laboratory (IDL), part of NASA Goddard Space Flight Center’s Integrated Design Center (IDC), is a concurrent and collaborative environment which allows for rapid development of science instrumentation concepts within the span of less than two weeks. Science goals set by a Principal Investigator from government, industry or academia are translated into engineering requirements, from which a team of engineers spanning multiple disciplines use an established study process and a suite of analysis tools to work towards an instrument point design. As part of this process, a staff thermal engineer is tasked with designing a thermal control system which meets all incoming thermal requirements, while iterating real-time with other subsystems to ensure compatibility and functionality as a completed system. Thermal engineers on spaceflight projects typically have weeks or months to develop thermal models. However, the severe time limitation in this conceptual study setting makes thermal design particularly difficult, as rapid thermal modeling solely over the span of a few days is required to develop the instrument thermal design and understand the performance over its intended mission, especially if the instrument concept contains multiple thermal challenges such as dynamic environments or high heat dissipating components. In this paper, the authors provide a condensed guide for the most efficient ways to develop thermal models and conduct thermal analysis within the span of one-to-two weeks, as informed by decades of design experience and best practices in the IDL. The authors also focus on quick methods for determining worst-case thermal environments, deciding which modeling details are essential at this early phase, and quantifying the engineering resources necessary for thermal control. This paper concludes with specific thermal design tips for different instrument types across the electromagnetic spectrum.
Guidelines for CubeSat's Thermal Design
Thermal and Fluids Analysis Workshop 2015, Silver Spring, MD. NCTS 19104-15. What does it take to thermally designlow cost, low mass cubesats? What are the differences in the approach when you compare with large scale missions?What additional risk is acceptable? What is the approach to hardware? How is the testing campaign run? These aresome of the questions that will be addressed in this course, which is designed to equip the attendees to support thedevelopment of cubesats at their organization.
Rapid Development of Instrument Thermal Models: Perspectives and Guidelines from NASA Goddard’s Instrument Design Laboratory
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Introduction to Heat Pipes
This is the presentation file for the short course Introduction to Heat Pipes, to be conducted at the 2015 Thermal Fluids and Analysis Workshop, August 3-7, 2015, Silver Spring, Maryland. NCTS 21070-15. Course Description: This course will present operating principles of the heat pipe with emphases on the underlying physical processes and requirements of pressure and energy balance. Performance characterizations and design considerations of the heat pipe will be highlighted. Guidelines for thermal engineers in the selection of heat pipes as part of the spacecraft thermal control system, testing methodology, and analytical modeling will also be discussed.
Spacecraft Glow and the Eisg/skirt Experiment
The objective of this experiment is to develop an understanding of the physical processes leading to spacecraft glow phenomena. The emphasis is to be on surface temperature and altitude effects. A complete understanding of the phenomena could be used to accomplish the following: (1) characterize optical instrument backgrounds; (2) provide guidelines for thermal insulations; (3) characterize material selection for flight optics and associated spacecraft; and (4) affect flight-operation altitude selection for relevant missions.
Toward High-Endurance Nonvolatile Reconfigurable Metasurfaces
The applications of adaptive optics extend across multiple sectors, encompassing areas such as LiDAR, biological and chemical sensing, and free-space optical communications. The advent of metasurfaces optics with reconfigurability has offered a versatile platform for the design of compact optical components, offering a compelling alternative to their conventional bulky counterparts. In this study, we introduce the PROWESS (Phase change Reconfigurable Optical WavEfront Synthesis System project at NASA LaRC), electrically reconfigurable metasurfaces using low-loss, high-contrast phase change material (PCM), Ge2Sb2Se4Te integrated with IR-transparent silicon microheater for various practical applications. The talk covers a reliable platform for switching large-scale PCM-based devices utilizing a microheater and an architecture for the metasurface switching within an integrated circuit configuration, which is compatible with standard foundry fabrication processes. The utilization of near- to midinfrared transparent silicon microheater in the proposed architecture opens possibilities for the development of reconfigurable transmissive optics such as filters, zoom lenses, and beam steering modules. We demonstrated switching of 140 µm × 140 µm PCM pixel, on a 200 µm × 200 µm silicon microheater for several thousand cycles. Further, we performed an in-depth investigation into the failure mechanism utilizing techniques such as transmission electron microscopy and thermal modeling. Guidelines for device performance improvement are proposed, and an improved design with larger endurance is shown in progress. With further progress, we aim to unlock the full potential of PCM-based devices and advance the field of adaptive optics with demonstrable examples including a reconfigurable beam steerer for ocean surface flash LiDAR and Navigation Doppler LiDAR for precise lunar landing missions.
Design guides for irradiation experiments with fast spectrum reactor fuel elements in thermal test reactors
Design guidelines for irradiation experiments with fast spectrum reactor fuel elements in thermal test reactors
NCTM workshop splinter session, IR thermal measurement instruments
The splinter session dealing with commercial industrial thermal measurement state-of-the-hardware had a total attendance of 15. Two papers were presented in the splinter session as follows: (1) Development of an Infrared Imaging System for the Surface Tension Driven Convection Experiment, Alexander D. Pline, NASA LeRC; (2) A Space-qualified PtSi Thermal Imaging System, Robert W. Astheimer, Barnes Engineering Div., EDO Corp. In addition a brief description of SPRITE detector technology was presented by Richard F. Leftwich of Magnovox. As anticipated, the discussions were concerned mainly with thermal imaging figures of merit rather than those for point measurement instruments. The need for uniform guidelines whereby infrared thermal imaging instruments could be specified and evaluated was identified as most important, particularly where temperature measurements are required. Presently there are differences in the way different manufacturers present significant performance parameters in their instrument data sheets. Furthermore, the prospective user has difficulty relating these parameters to actual measurement needs, and procedures by which performance can be verified are poorly defined. The current availability of powerful thermal imaging diagnostic software was discussed.
Simplified thermal estimation techniques for large space structures
A tool for making rapid estimates of the response of space structures to thermal environments encountered in earth orbits is provided for the designer of these structures. Charts giving heating rates and temperatures for certain typical large spacecraft structural elements are provided. Background information for spacecraft thermal design considerations is presented. Environments, requirements, thermal control techniques, design guidelines, and approaches available for more detailed thermal response analysis are discussed.
Guidelines for Developing Spacecraft Structural Requirements: A Thermal and Environmental Perspective
Spacecraft are typically designed with a primary focus on weight in order to meet launch vehicle performance parameters. However, for pressurized and/or man-rated spacecraft, it is also necessary to have an understanding of the vehicle operating environments to properly size the pressure vessel. Proper sizing of the pressure vessel requires an understanding of the space vehicle's life cycle and compares the physical design optimization (weight and launch "cost") to downstream operational complexity and total life cycle cost. This paper will provide an overview of some major environmental design drivers and provide examples for calculating the optimal design pressure versus a selected set of design parameters related to thermal and environmental perspectives. In addition, this paper will provide a generic set of cracking pressures for both positive and negative pressure relief valves that encompasses worst case environmental effects for a variety of launch / landing sites. Finally, several examples are included to highlight pressure relief set points and vehicle weight impacts for a selected set of orbital missions.
Guidelines for the Selection of Near-Earth Thermal Environment Parameters for Spacecraft Design
Thermal analysis and design of Earth orbiting systems requires specification of three environmental thermal parameters: the direct solar irradiance, Earth's local albedo, and outgoing longwave radiance (OLR). In the early 1990s data sets from the Earth Radiation Budget Experiment were analyzed on behalf of the Space Station Program to provide an accurate description of these parameters as a function of averaging time along the orbital path. This information, documented in SSP 30425 and, in more generic form in NASA/TM-4527, enabled the specification of the proper thermal parameters for systems of various thermal response time constants. However, working with the engineering community and SSP-30425 and TM-4527 products over a number of years revealed difficulties in interpretation and application of this material. For this reason it was decided to develop this guidelines document to help resolve these issues of practical application. In the process, the data were extensively reprocessed and a new computer code, the Simple Thermal Environment Model (STEM) was developed to simplify the process of selecting the parameters for input into extreme hot and cold thermal analyses and design specifications. In the process, greatly improved values for the cold case OLR values for high inclination orbits were derived. Thermal parameters for satellites in low, medium, and high inclination low-Earth orbit and with various system thermal time constraints are recommended for analysis of extreme hot and cold conditions. Practical information as to the interpretation and application of the information and an introduction to the STEM are included. Complete documentation for STEM is found in the user's manual, in preparation.