Engineering topics

Adcock, Edward E.

Publications and source records attributed to Adcock, Edward E..

5 records

NASA NTRS2011

Two-axis direct fluid shear stress sensor

A micro sized multi-axis semiconductor skin friction/wall shear stress induced by fluid flow. The sensor design includes a shear/strain transduction gimble connected to a force collecting plate located at the flow boundary surface. The shear force collecting plate is interconnected by an arm to offset the tortional hinges from the fluid flow. The arm is connected to the shear force collecting plate through dual axis torsional hinges with piezoresistive torsional strain gauges. These gauges are disposed on the tortional hinges and provide a voltage output indicative of applied shear stress acting on the force collection plate proximate the flow boundary surface. Offsetting the torsional hinges creates a force concentration and resolution structure that enables the generation of a large stress on the strain gauge from small shear stress, or small displacement of the collecting plate. The design also isolates the torsional sensors from exposure to the fluid flow.

Bajikar, Sateesh↗

NASA NTRS2011

Two-Axis Direct Fluid Shear Stress Sensor for Aerodynamic Applications

This miniature or micro-sized semiconductor sensor design provides direct, nonintrusive measurement of skin friction or wall shear stress in fluid flow situations in a two-axis configuration. The sensor is fabricated by microelectromechanical system (MEMS) technology, enabling small size and multiple, low-cost reproductions. The sensors may be fabricated by bonding a sensing element wafer to a fluid-coupling element wafer. Using this layered machine structure provides a truly three-dimensional device.

Bajikar, Sateesh S.↗

NASA NTRS2010

A Two-Axis Direct Fluid Shear Stress Sensor

This innovation is a miniature or micro sized semiconductor sensor design that provides two axis direct non-intrusive measurement of skin friction or wall shear stress in fluid flow. The sensor is fabricated by micro-electro-mechanical system (MEMS) technology, enabling small size and low cost reproductions. The sensors have been fabricated by utilizing MEMS fabrication processes to bond a sensing element wafer to a fluid coupling wafer. This layering technique provides for an out of plane dimension that is on the same order of length as the inplane dimensions. The sensor design has the following characteristics: a shear force collecting plate with dimensions that can be tailored to various application specific requirements such as spatial resolution, temporal resolution and shear force range and resolution. This plate is located coplanar to both the sensor body and flow boundary, and is connected to a dual axis gimbal structure by a connecting column or lever arm. The dual axis gimbal structure has torsional hinges with embedded piezoresistive torsional strain gauges which provide a voltage output that is correlated to the applied shear stress (and excitation current) on force collection plate that is located on the flow boundary surface (hence the transduction method). This combination of design elements create a force concentration and resolution structure that enables the generation of a large stress on the strain gauge from the small shear stress on the flow boundary wall. This design as well as the use of back side electrical contacts establishes a non-intrusive method to quantitatively measure the shear force vector on aerodynamic bodies.

Adcock, Edward E.↗

NASA NTRS1993

Acoustical Detection Of Flameout In A Combustor

Acoustic flameout detector contains relatively simple decision circuits, because only decision it makes is whether acoustic wave in specific frequency band strong enough. If not, flameout about to occur, and acoustic flameout detector sends signal to turn off supply of fuel.

Puster, Richard L.↗

NASA NTRS1992

A cryogenic multichannel electronically scanned pressure module

Consideration is given to a cryogenic multichannel electronically scanned pressure (ESP) module developed and tested over an extended temperature span from -184 to +50 C and a pressure range of 0 to 5 psig. The ESP module consists of 32 pressure sensor dice, four analog 8 differential-input multiplexers, and an amplifier circuit, all of which are packaged in a physical volume of 2 x 1 x 5/8 in with 32 pressure and two reference ports. Maximum nonrepeatability is measured at 0.21 percent of full-scale output. The ESP modules have performed consistently well over 15 times over the above temperature range and continue to work without any sign of degradation. These sensors are also immune to repeated thermal shock tests over a temperature change of 220 C/sec.

Shams, Qamar A.↗