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Engineering topics

Anstead, R. J.

Publications and source records attributed to Anstead, R. J..

8 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1975

Failure analysis of electronic parts: Laboratory methods

Failure analysis test methods are presented for use in analyzing candidate electronic parts and in improving future design reliability. Each test is classified as nondestructive, semidestructive, or destructive. The effects upon applicable part types (i.e. integrated circuit, transitor) are discussed. Methodology is given for performing the following: immersion tests, radio graphic tests, dewpoint tests, gas ambient analysis, cross sectioning, and ultraviolet examination.

Anstead, R. J.↗
NASA NTRS1975

Techniques of Final Preseal Visual Inspection

A dissertation is given on the final preseal visual inspection of microcircuit devices to detect manufacturing defects and reduce failure rates in service. The processes employed in fabricating monolithic integrated circuits and hybrid microcircuits, various failure mechanisms resulting from deficiencies in those processes, and the rudiments of performing final inspection are outlined.

Anstead, R. J.↗
NASA NTRS1972

Using the scanning electron microscope on the production line to assure quality semiconductors

The use of the scanning electron microscope to detect metallization defects introduced during batch processing of semiconductor devices is discussed. A method of determining metallization integrity was developed which culminates in a procurement specification using the scanning microscope on the production line as a quality control tool. Batch process control of the metallization operation is monitored early in the manufacturing cycle.

Adolphsen, J. W.↗
NASA NTRS1971

Use a SEM on a production line

Scanning electron microscope for poor metallization detection in manufacturing cycle of semiconductor devices

Adolphsen, J. W.↗