Wide-Field, Subsurface Bond Health Evaluation of Heterogeneously-Integrated Microelectronics Using Frequency Domain Thermoreflectance
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Jarzembski, Amun↗
Engineering topics
Antiporda, Logan
Publications and source records attributed to Antiporda, Logan.
Modeling Heat Flow Across a Compression Bonded GaN-Diamond Interface for Vertical Power Devices
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Cook, Esteban Alfonso↗