DOE OSTI · 2563921
Modeling Heat Flow Across a Compression Bonded GaN-Diamond Interface for Vertical Power Devices
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Cook, Esteban Alfonso, Hodges, Wyatt Lea, Jarzembski, Amun, Delmas, William Grant, Bahr, Matthew Nathaniel, Piontkowski, Zachary Tyler, Treweek, Benjamin, Deitz, Julia Irene, McDonald, Anthony E., Antiporda, Logan, Lu, Ping, Yates, Luke. 2024-04-01. Modeling Heat Flow Across a Compression Bonded GaN-Diamond Interface for Vertical Power Devices. https://doi.org/10.2172/2563921
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