Requirements for Soldering Fluxes Research using the B-53 Test Board
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Engineering topics
Publications and source records attributed to Bixenman, Mike.
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IPC J-STD-004B standard prescribes general requirements for the classification and testing of soldering flux for high qualify interconnections. This standard defines the classification of soldering materials through specifications of test methods and inspection criteria. The materials include liquid flux, paste flux, solderpaste flux, solder preform flux, and flux-cored solder. This research will use the proposed IPC-53 Surface Insulation Resistance (SIR) test patterns by means of an open comb (2D) and closed comb (3D to simulate a component over the comb pattern). The 2D open comb has uniformity of conductor spacing, sheet resistance, and flux outgassing. The 3D-closed comb simulates the effect of leadless or bottom-terminated components, which have non-uniform sheet resistance and flux outgassing. The response variables will include SIR testing and visual imaging. The objective is to investigate IPC test method improvements for characterizing soldering fluxes when using leadless components with narrow pad-to-pad spacing.
The exposure to harsh environments can result in reliability issues on highly dense electronic packages and circuit assemblies. One area of concern is electrochemical failure mechanisms caused by electrolytic corrosion, electrochemical migration (dendrites), and leakage currents under humid conditions. These no-fault and no-trouble found failure points are challenging to detect and to perform process control during the assembly process. The focus of this research centers on metallizing glass surface insulation resistance test vehicles to characterize materials on electronic packages and components that exhibit the highest risk of failure due to material interactions and process residues. Glass test vehicles provide a visual representation of materials when they are exposed to moisture content in the air. Harsh environments can cause material interactions resulting in morphology changes, opening, and release of active components. A transparent test vehicle is highly functional for environmental stress testing under temperature, humidity, and bias. The designed experiment will evaluate the effects of material and process residues that can undergo changes in behavior during application, which leads to local failures.
IPC J-STD –001G, Amendment 1 requires that the assembler have a sampling plan to assure that the process remains in control once qualified and validated. It is well documented that electrochemical failures occur at component sites where flux residues are not fully activated. It is also well known that specific components have a higher risk of electrochemical failure. Selecting a control plan that monitors the process and its performance on challenging components provides assurance that the process maintains control once established during process qualification. The test board used to qualify the process establishes an upper and lower spec limit for each of the component types on the test board. Surface Insulation Resistance upper and lower control limits, using challenging components that are representative of production hardware, represent a golden process condition. The golden image is a measure of process deviations that represents the performance of a resistance curve within a specific period. The objective is to judge whether the process in or out of control.