Search NASA⌕ Search

Engineering topics

Blanche, J. F.

Publications and source records attributed to Blanche, J. F..

5 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2012

Lead-Free Experiment in a Space Environment

This Technical Memorandum addresses the Lead-Free Technology Experiment in Space Environment that flew as part of the seventh Materials International Space Station Experiment outside the International Space Station for approximately 18 months. Its intent was to provide data on the performance of lead-free electronics in an actual space environment. Its postflight condition is compared to the preflight condition as well as to the condition of an identical package operating in parallel in the laboratory. Some tin whisker growth was seen on a flight board but the whiskers were few and short. There were no solder joint failures, no tin pest formation, and no significant intermetallic compound formation or growth on either the flight or ground units.

Blanche, J. F.↗
NASA NTRS2011

Microcoil Spring Interconnects for Ceramic Grid Array Integrated Circuits

As integrated circuit miniaturization trends continue, they drive the need for smaller higher input/output (I/O) packages. Hermetically sealed ceramic area array parts are the package of choice by the space community for high reliability space flight electronic hardware. Unfortunately, the coefficient of thermal expansion mismatch between the ceramic area array package and the epoxy glass printed wiring board limits the life of the interconnecting solder joint. This work presents the results of an investigation by Marshall Space Flight Center into a method to increase the life of this second level interconnection by the use of compliant microcoil springs. The design of the spring and its attachment process are presented along with thermal cycling results of microcoil springs (MCS) compared with state-of-the-art ball and column interconnections. Vibration testing has been conducted on MCS and high lead column parts. Radio frequency simulation and measurements have been made and the MCS has been modeled and a stress analysis performed. Thermal cycling and vibration testing have shown MCS interconnects to be significantly more reliable than solder columns. Also, MCS interconnects are less prone to handling damage than solder columns. Future work that includes shock testing, incorporation into a digital signal processor board, and process evaluation of expansion from a 400 I/O device to a device with over 1,100 I/O is identified.

Strickland, S. M.↗