Search NASA⌕ Search
Home/Archive/NASA NTRS

NASA NTRS · 19670014339

Nondestructive testing techniques for multilayer printed wiring boards

Blanche, J. F.
View original source ↗Export metadata ↓

Abstract

Axial transverse laminography and mutual coupling nondestructive techniques for inspection of multilayer printed circuit boards

Explore related subjects

CIRCUIT BOARDOPTICAL COUPLINGMULTILAYER STRUCTURENONDESTRUCTIVE TESTING

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

Blanche, J. F.. 1967-01-01. Nondestructive testing techniques for multilayer printed wiring boards. https://ntrs.nasa.gov/citations/19670014339

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related reports

NASA NTRS1967

Investigation of Solder Cracking Problems on Printed Circuit Boards

A Solder Committee designated to investigate a solder cracking phenomena occurring on the SATURN electrical/electronic hardware found the cause to be induced stress in the soldered connections rather than faulty soldering techniques. The design of the printed circuit (PC) board assemblies did not allow for thermal expansion of the boards that occurred during normal operation. The difference between the thermal expansion properties of the boards and component lead materials caused stress and cracking in the soldered connections. The failure mechanism and various PC boards component mounting configurations are examined in this report. Effective rework techniques using flanged tubelets, copper tubelets, and soft copper wiring are detailed. Future design considerations to provide adequate strain relief in mounting configurations are included to ensure successful solder terminations.

CIRCUIT BOARD↗