Engineering topics
Publications and source records attributed to Bosco, Nick.
We have seen cases of glass in PV modules breaking differently, and more often, than it did five years ago. There have been many changes to PV module design and materials in that time. But there is probably no single change that is responsible for the problem. Here we summarize the current thinking on PV glass breakage in utility-scale power plants. We share insights from multiple still-running projects at NREL.
This project explores the use of femto-second (fs) lasers to form glass-to-glass welds for hermetically sealed, polymer-free solar modules. Low iron solar glass coupons were welded together without the use of glass filler using a fs laser with dedicated optics to elongate the focal plane parallel to the incident beam. The resulting welds were then stress tested to failure to reveal the critical stress intensity factor, KIc. These values were used in a structural mechanics model of a 1 m by 2 m glass/glass module under a simulated static load test. The results show that the fs laser welds are strong enough for a suitably framed module to pass the IEC 61215 static load test with a load of 5400 Pa. Key to this finding is that the module must be framed and braced, and the glass must be ribbed to allow pockets for the cells and welds inside the border of the module. The result is a module design that is completely polymer-free, hermetically sealed, has improved thermal properties, and is easily recycled.
Cracking of crystalline silicon photovoltaic cells remains a challenging topic in accurately assessing the long-term reliability and performance of affected modules. Cells can be damaged in every stage throughout the lifetime of a photovoltaic module, ranging from manufacturing, transportation, and installation to operation. Initially, the metallization can be able to bridge the gap of fractured cells and keep individual cell fragments electrically connected. However, photovoltaic modules and cells experience thermo-mechanical stresses during operation from temperature changes and pressure cycles of wind and snow loads. This causes the cell fragments to move, which, in turn, can lead to the wear out of the metallization and, consequently, to power loss or a safety hazard. The rate at which this degradation mechanism proceeds is currently unknown. Hence, in this work, we quantify the cell fragment movement of polycrystalline and monocrystalline mini-modules. By using digital image correlation, we were able to extract the normal crack opening and tangential sliding distances of adjacent cell fragments during heating of the mini-modules. Those distances are essential to develop wear-out models for the metallization and determine the rate of the degradation mechanism. We found that the interconnect technology has a significant impact on the direction and quantity of the cell fragment movements.
Predictive modeling tools such as the finite element method can be of tremendous help in assessing the reliability and long-term performance of photovoltaic modules. In order to obtain accurate results, the proper modeling of materials and manufacturing processes are of utmost importance. Module fabrication introduces thermo-mechanical stresses inside the module laminate, which need to be accounted for as residual stresses in finite element simulations. We found that cell fragment movement and crack opening displacements of fractured silicon cells within modules are affected by those residual stresses. Cell cracking remains a challenging topic in assessing the reliability and durability of damaged modules. Hence, accurately quantifying the separation and movement between cell fragments creates the foundation for establishing reliable lifetime and performance assessments of fractured silicon modules. Here, we present a modeling approach that uses upper and lower bounds to accurately account for the residual stresses introduced by the module lamination process. We designed a four-point flexure coupon test of a laminated, fractured silicon strip to validate our numerical results and found good agreement between our modeling methodology and the experimental data. Finally, we discuss the implications of the residual stresses on the normal crack opening and metallization wear-out of fractured silicon cells.
Ethylene vinyl acetate (EVA) encapsulants comprise the majority of the encapsulants currently in use; much work has been done to understand and model the adhesive characteristics of EVA-encapsulated modules, but limited work has provided reliable insight into adhesion during the intermediate stages of exposure, limiting the ability to validate model predictions in this range. We provide the adhesion energy measurements for EVA adhesion after nearly six years of field aging and 10 000 h of accelerated aging. Both field and accelerated aging reveal a distinct plateau that emerges during the intermediate exposure periods (after one year in the field and after 1000 h in a chamber). At 10 000 h, adhesion within accelerated aged minimodules falls to a level generally seen after long-term field exposures (>15 years). Previous modeling predicted that adhesion would steadily decrease over the lifetime of a module, but these current results uncover an intermediate plateauing trend that is important to accurately modeling the evolution of adhesion and predicting adhesive failure. Based on these findings, three key model refinements concerning the rate of UV-radical formation and subsequent β-scission, the rate and acceleration of hydrolytic depolymerization, and the profile of the plasticity contribution over time are implemented and discussed.
Here, we employ an existing model of crystalline silicon photovoltaic module cell fracture to explore the effect of cell size and orientation on their probability of fracture under module uniform loading. In addition, we also apply continuum damage mechanics to modify this model to consider the effect of cell fracture on the probability of subsequent cell fracture. We elucidate that cell fracture increases the probability of subsequent cell fracture and that rectangular modules containing half-cells aligned with the module's long orientation are much more robust against cell fracture than full-cell and half-cell short orientation modules.
Here, we applied time-varying air pressure to a PV module containing newly cracked cells. The test used a new dynamic mechanical acceleration (DMX) apparatus. We applied pressure cycles similar to natural, wind-driven cycles. Compared to standard dynamic mechanical load (DML) tests, we applied much lower pressure (10 Pa to 300 Pa RMS) and many more cycles (one million at each of four pressure levels). We present a case study on a single cell in a commercial module. We monitored electrical continuity loss across cracks using electroluminescence (EL) imaging. 10 Pa pressure cycles caused negligible change. 30 Pa pressure cycles caused permanent damage that continued worsening even after tens of thousands of cycles. After one million 30 Pa cycles, a series of 100 Pa cycles still caused new, permanent damage to existing cracks. 300 Pa cycles caused further worsening and introduced new cracks.
Thermomechanical simulation of photovoltaic (PV) modules using the finite element method (FEM) is a useful tool to evaluate module design features in terms of structural integrity, reliability, and durability. One of the main challenges in the numerical modeling of a PV module is the incorporation of residual stresses induced by the manufacturing process. Modeling assumptions and abstractions are necessary to limit the model complexity and reduce the computational time. However, oversimplifications and incorrect assumptions can lead to erroneous numerical results. Unfortunately, much simulation work still neglects process-induced stresses. This can lead to incorrect predictions of the stress-strain history and erroneous conclusions during the design process. In this work, we review current modeling practices for incorporating process-induced stresses, and contrast numerical models that consider residual stresses with those that neglect them. We find that the simulation objective and available material properties dictate which process steps need to be modeled, and explore in depth the modeling of residual stresses induced by the lamination process. We demonstrate that a simplified cooldown procedure at the beginning of the simulation can increase the model accuracy and discuss appropriate choices for starting and reference temperatures in the finite element model.
Lifetime prediction of the fielded c-Si solar modules due to location-specific weather conditions has been an important topic of photovoltaic research and the economic viability of solar energy. Data analytic techniques such as the performance ratio method, Statistical clear sky model, and Suns-Vmp methods quantify the degradation from measured data of a solar farm, however, the nonlinear time-dependence and correlated degradations make it difficult to use the empirical degradation rates for ultimate lifetime projection. In this article, we propose a complementary physics-based model to predict the solder bond failure caused by mechanical stress associated with the variations of the temperature. Integrating the worldwide weather information from NASA/NSRDB databases, the model predicts the location-specific output-power degradation and the lifetime of a module due to solder bond failure. The model parameters are calibrated against qualification tests involving thermal cycling of specific batches of modules from a specific technology/manufacturer. The results may be summarized as: 1) Modules installed at higher latitudes show a longer lifetime due to reduced damage accumulation. 2) The reduction of temperature fluctuation close to large bodies of water, such as seashores, increases solder bond lifetime significantly. 3) Relatively speaking, modules installed close to the Tropic of Cancer/Capricorn (23.5 degrees North/South) suffer from a higher solder bond damage and have a shorter lifetime, suggesting a conservative design. This model should serve as a building block of a comprehensive reliability framework that can predict the lifetime of a module that experiences simultaneous and correlated degradation mechanisms involving yellowing, corrosion, and potential-induced degradation.
Two generations of multiwire modules were studied under dynamic mechanical loading (DML) with in-situ differential conductance (dG) and electroluminescence (EL) imaging. Energy-dispersive x-ray spectroscopy (EDS) was used to identity the solder alloys. The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the current generation module did not demonstrate degradation under DML. Atomic force microscopy scratch testing was used to probe the wear resistance of each solder alloy. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.
Solar cells in PV modules crack during field operation from environmental stressors, including extreme weather events, such as hailstorms and hurricanes. These cracks can lead to gradual or immediate acute power degradation. To directly address cell-crack-induced degradation, we have formulated a carbon nanotube additive for commercial screen printed silver pastes. We have shown in previous work that these metal matrix composites have little to no effect on the cell’s efficiency while enhancing the metallization’s fracture toughness and electrical gap-bridging capability. In this work, we focus on optimizing the composite metallization to achieve the best possible performance. We discover that reducing carbon nanotube agglomerations in the paste not only improves the printability for narrow gridlines, but also increases the modulus of toughness of the metallization by over 500%.
In this work, we explore the influence of module size on the rate of interconnect solder bond thermomechanical fatigue (TMF) damage and the probability of cell fracture. For the solder bond TMF damage evaluation, structural mechanics models of crystalline silicon PV models are created to solve with the Finite Element Method. For the probability of cell fracture evaluation, Weibull analysis and weakest link theory are employed to resolve the probability of crystalline silicon PV cell fracture when measured as bare cells and when stressed in reduced- and full-sized modules. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module and that smaller, representative, modules must be loaded to a much higher level than their parent full-sized modules to achieve an equivalent driving force for cell fracture.
Two generations of multiwire modules were studied under dynamic mechanical loading (DML). The earlier generation module was found to use an In-based solder alloy, and the current generation a Bi-based alloy. The earlier generation module degraded significantly under DML with increasing resistance, while the state-of-the-art module did not demonstrate degradation under DML. The degradation in the earlier module was attributed to damage at the solder-gridline interfaces. Atomic force microscopy scratch testing estimated the wear resistance of each solder alloy to assess susceptibility to degradation. Bi-based alloys appear to be more wear resistant than In-based alloys, consistent with the DML results. These results indicate that current multiwire designs may have higher mechanical durability than earlier generations.
In this article, we explore the influence of module size on the rate of interconnecting solder bond thermomechanical fatigue (TMF) damage. Structural mechanics models of crystalline silicon PV models are created to solve with the finite-element method. Results conclusively demonstrate that the rate of solder bond TMF damage is independent of module size, interconnect location across the cell and cell location across the module.