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Capen, Bill

Publications and source records attributed to Capen, Bill.

SIR Glass Test Vehicle Designed to Characterize Process Materials

The exposure to harsh environments can result in reliability issues on highly dense electronic packages and circuit assemblies. One area of concern is electrochemical failure mechanisms caused by electrolytic corrosion, electrochemical migration (dendrites), and leakage currents under humid conditions. These no-fault and no-trouble found failure points are challenging to detect and to perform process control during the assembly process. The focus of this research centers on metallizing glass surface insulation resistance test vehicles to characterize materials on electronic packages and components that exhibit the highest risk of failure due to material interactions and process residues. Glass test vehicles provide a visual representation of materials when they are exposed to moisture content in the air. Harsh environments can cause material interactions resulting in morphology changes, opening, and release of active components. A transparent test vehicle is highly functional for environmental stress testing under temperature, humidity, and bias. The designed experiment will evaluate the effects of material and process residues that can undergo changes in behavior during application, which leads to local failures.

Capen, Bill↗

Process Control Plan to Monitor Acceptable Levels of Flux and other residues

IPC J-STD –001G, Amendment 1 requires that the assembler have a sampling plan to assure that the process remains in control once qualified and validated. It is well documented that electrochemical failures occur at component sites where flux residues are not fully activated. It is also well known that specific components have a higher risk of electrochemical failure. Selecting a control plan that monitors the process and its performance on challenging components provides assurance that the process maintains control once established during process qualification. The test board used to qualify the process establishes an upper and lower spec limit for each of the component types on the test board. Surface Insulation Resistance upper and lower control limits, using challenging components that are representative of production hardware, represent a golden process condition. The golden image is a measure of process deviations that represents the performance of a resistance curve within a specific period. The objective is to judge whether the process in or out of control.

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