Recent Advancements in (Al)GaN High Electron Mobility Transistor Power Electronics at Sandia
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Klein, Brianna Alexandra↗
Engineering topics
Chung, Hyunim
Publications and source records attributed to Chung, Hyunim.
2.5D HI Packaging of the Power Converter using TSV interposer.
Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.
Chung, Hyunim↗