DOE OSTI · 2584822
2.5D HI Packaging of the Power Converter using TSV interposer.
Abstract
Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.
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Chung, Hyunim, Young, Andrew Ian, Klein, Brianna Alexandra, McDonough, Matthew, Neely, Jason Christopher. 2023-08-01. 2.5D HI Packaging of the Power Converter using TSV interposer.. https://doi.org/10.2172/2584822
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