Electromagnetic coils for a 3000 psi hydraulic MEMS valve assembly
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Finnegan, Patrick Sean↗
Engineering topics
Young, Andrew Ian
Publications and source records attributed to Young, Andrew Ian.
2.5D HI Packaging of the Power Converter using TSV interposer.
Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.
Chung, Hyunim↗
Extending the Frequency of Piezoelectric Resonators to Microwave Frequencies and Beyond.
Abstract not provided.
Nordquist, Christopher↗
High Density Microbump Development for Multi-Project Wafer (MPW) Die.
Abstract not provided.
Jordan, Matthew↗