Recent Advancements in (Al)GaN High Electron Mobility Transistor Power Electronics at Sandia
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Klein, Brianna Alexandra↗
Engineering topics
McDonough, Matthew
Publications and source records attributed to McDonough, Matthew.
2.5D HI Packaging of the Power Converter using TSV interposer.
Abstract: Advantages of the 2.5D HI (Heterogeneous Integration) electronics packaging of the power electronics compared to PCB packaging will be presented. Current 2.5D packaging effort using TSV (Through Silicon Via) will be presented in terms of fabrication, microstructural analysis, reliability, and thermal simulation.
Chung, Hyunim↗
Fly-Buck Converter Parametric Analysis and ZVS Operation for Multiple Outputs.
Abstract not provided.
Gill, Lee↗
Fly-buck Converter Parametric Analysis and ZVS Operation for Multiple Outputs.
Abstract not provided.
Gill, Lee↗
Design and Evaluation of Nanocomposite Core Inductors for Efficiency Improvement in High-Frequency Power Converters.
Abstract not provided.
Langlois, Eric↗