Search NASA⌕ Search

Engineering topics

Chvostal, P.

Publications and source records attributed to Chvostal, P..

Stitch-bond parallel-gap welding for IC circuits

Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.

Chvostal, P.↗