NASA NTRS · 19790000560
Stitch-bond parallel-gap welding for IC circuits
Abstract
Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics.
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Chvostal, P., Tuttle, J., Vanderpool, R.. 1980-06-01. Stitch-bond parallel-gap welding for IC circuits. https://ntrs.nasa.gov/citations/19790000560
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