Engineering topics
Publications and source records attributed to Cocks, F. H..
This autonomous experiment for foaming metals in space involved: (1) payload support structure; (2) furnace and foaming apparatus; (3) electronic controls; (4) battery power; and (5) metallurgy. Emphasis was laid on a modular design which was easily modifiable and which offered maximum durability, safety, and failure tolerance.
High Na vapor pressure, peritectic decomposition, and high reactivity of the melt complicate the growth of beta-alumina crystals. These difficulties were overcome by using a high-pressure (300 psig) growth chamber, Na2O-rich melts, and Ir for all surfaces in contact with the melt. These procedures were combined with the edge-defined film-fed growth technique to produce single-crystal beta-alumina tubes and ribbons.
Edge-defined, film-fed growth process allows both tubular shapes and single crystallinity to be achieved. Beta alumina in single crystal form makes possible membranes with improved conductivities. Single crystal membranes also eliminate problems associated with electrical short circuiting of membrane due to possible sodium metal diffusion.
The design and construction of a high pressure crystal growth chamber was accomplished which would allow the growth of crystals under inert gas pressures of 2 MN/sq m (300 psi). A novel crystal growth technique called EFG was used to grow tubes and rods of the hollandite compounds, BaMgTi7O16, K2MgTi7O16, and tubes of sodium beta-alumina, sodium magnesium-alumina, and potassium beta-alumina. Rods and tubes grown are characterized using metallographic and X-ray diffraction techniques. The hollandite compounds are found to be two or three-phase, composed of coarse grained orientated crystallites. Single crystal c-axis tubes of sodium beta-alumina were grown from melts containing excess sodium oxide. Additional experiments demonstrated that crystals of magnesia doped beta-alumina and potassium beta-alumina also can be achieved by this EFG technique.
Silicon ribbon growth experiments were conducted using orifices (dies) fabricated from SiC-SiO2 mixtures, fused quartz, SiC, and fine-grained, high density graphite. The best results were obtained from graphite dies. A number of different approaches was tried in modifying the thermal gradient in the dies and in holding the dies. The best results here were obtained from a 0.25-in. thick Mo disc holding a graphite die directly and fitting the die quite closely. Ribbon growths as wide as 9 mm were obtained, while the longest ribbon was 450 x 3.5 x 0.5 mm. Resistivities of ribbons grown from graphite dies have been measured over the range of 0.03 to 1.6 ohm-cm. Some thoughts and literature findings are presented regarding refractory oxide materials as potential orifices.
Thick film silicon ribbons were produced by means of the edge-defined, film-fed growth (EFG) technique. EFG is a process by which single crystals may be grown having a shape controlled by the outside dimensions of a die, the growth taking place from an extremely thin film of liquid fed by capillary action from a crucible below. The principal problem to be overcome in the application of this process to the growth of thick film silicon ribbon relates to the material, such as the shaping die. For the method to operate, this die material must be wet by the liquid silicon. To preserve semiconductor quality, the liquid silicon must not react significantly with the die material. The most promising die material for this application appears to be SiC and SiC-SiO2 admixture. In this case good wetting occurs between the molten silicon and the SiC. C is a relatively unharmful contaminant of Si and additions of quartz to SiC are found to decrease the extent of reaction.
An investigation has been carried out to examine the relationship of the observed chemical and mechanical properties of Al-Cu and Al-Zn-Mg alloys to the stress corrosion mechanisms which dominate in each case. Two high purity alloys and analogous commercial alloys were selected. Fundamental differences between the behavior of Al-Cu and of Al-Zn-Mg alloys were observed. These differences in the corrosion behavior of the two types of alloys are augmented by substantial differences in their mechanical behavior. The relative cleavage energy of the grain boundaries is of particular importance.
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Stress corrosion resistance is increased by distorting surface grain-boundary structure and by interrupting the corrosion and stress corrosion. The first is accomplished by machining or shot peening and the second by removal from and later reexposure to the corrosive environment.
Precorrosion effects on strained Al alloy electrochemical response, examining strain test results graphically
Stress corrosion testing method to separate corrosion and stress effects applied to Al and Ti alloys
Feasibility of instrumental methods to detect stress corrosion cracking property of aluminum alloys
Stress corrosion mechanism in aluminum alloys and development of detection techniques
Corrosion and stress effects separation in stress corrosion of Al-Zn-Mg-Cu alloy, considering machined surface finishing role
Newly developed tempering treatment considerably increases the corrosion resistance of 7075-T6 alloy and concomitantly preserves its yield strength. The results of tests on samples of the alloy subjected to the above treatments show that when the overaging period is 12 hours /at 325 degrees F/, the alloy exhibits a yield strength of 73,000 psi.
Stress corrosion of aluminum alloys and development of techniques for its detection
Mechanism of stress corrosion cracking in aluminum alloys and techniques for detection of surface defects
Stress corrosion cell for uniaxial tensile tests to study metal cracking, emphasizing Al and Ti alloys