Engineering topics

DeVinney, Michael

Publications and source records attributed to DeVinney, Michael.

3 records

DOE OSTI2024

Design and analysis of actively-cooled, edge-transport diagnostic for long-pulsed operation in WEST

Next step fusion devices that will operate in steady-state will require complex plasma-facing components (PFCs) that can survive the harsh environment over long timescales not common in current devices. This will require robust plasma facing surfaces that are integrated with active cooling systems. In a collaboration between CEA and ORNL, a plasma-interacting diagnostic is being designed for the W Environment in Steady-state Tokamak (WEST) in Cadarache, France which requires plasma-facing protection like those needed for steady-state PFCs. This integrated diagnostic studies edge transport and impurity migration within WEST, and is planned to include imbedded temperature Langmuir probe sensors, as well as removeable sample slots for ex-situ surface analysis of plasma-material interactions. The entire assembly is expected to move into the plasma edge for periods up to 1000 s having an energy removeable capability of ∼6 kW and seeing a peak heat flux of more than 7 MW/m2. The assembly compliments WEST high fluence campaigns that plan for multiple 1000 s pulses. Within these specifications, the assembly will require a refractory metal plasma facing surface and integral cooling in order to function within the limited space allotted for such diagnostics. Because of the limited space and linear actuator needs, additive manufacturing of the high heat flux working end of the assembly is being considered which could allow for precision cooling-channels and lighter weight designs. Conceptual design along with simulation and analysis results will be presented for this complex diagnostic with novel PFCs.

Lumsdaine, Arnold↗

DOE OSTI2024

Miniaturized Magnetoelastic Sensor System

This article describes the design, assembly, and implementation of a hand-held, magnetic-field-based sensor system that can be adapted for a variety of sensing applications. The miniaturized system is based on Chemical Identification by Magneto-Elastic Sensing (ChIMES) technology, which uses three concentric solenoid coils to wirelessly interrogate a sensor body comprised of a response material coupled to a magnetoelastic wire. The response material expands when it encounters a target, imposing mechanical stress on the wire and altering its magnetic permeability. The sensor bodies are passive, requiring no external power source, and they are small, measuring about 15 mm in length and 3.0 mm in diameter. Up to four sensor bodies can be configured as an evenly-spaced linear array. The sensor system operates by applying a low-frequency, current-stabilized, filtered triangle wave to a uniform-density excitation coil to switch the magnetic domains within the wire. Further, the responses from the sensors are picked up by a detection coil as stress-induced changes in the Faraday voltage, and the strong magnetic field induced by the excitation coil in the detection coil is nullified by a cancellation coil reverse-wound in series with the detection coil. The responses of the sensors in an array are separated in time by a linear gradient dc biasing coil. The sensors can be interrogated through metallic and nonmetallic barriers. The signals from the detection coil and the excitation coil are digitized by a pair of bipolar analog-to-digital converters (ADCs). A Raspberry Pi single-board computer (SBC) and associated software perform data acquisition and control all aspects of the sensor system hardware. The program allows the user to select the number of sensors in the array, the type of signal that is being collected, and the number of samples to take. The program also allows for signal processing of the sensor data, such as baseline correction. The program can differentiate sensor peaks from each other and calculate the magnitude of each sensor response with less than 1% error. The data are then displayed along with a graph of the signal.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2020

Linking thermoset ink rheology to the stability of 3D-printed structures

Thermoset polymer composites show promise for additive manufacturing (AM) applications to address some of the limitations of the more widely used thermoplastic feedstock materials. Thermosets offer attractive mechanical properties while providing excellent interlayer bonding, high thermal and chemical stability, and reduced energy consumption as a result of deposition at room temperature. However, since thermoset resins rely on a crosslinking reaction to solidify, rather than quickly cooling like thermoplastics, viscoelastic properties must be relied upon to maintain deposited shape after deposition until crosslinking can occur. This fact has not impeded development and characterization of new thermoset feedstocks on the small scale, but recent efforts to increase scale of thermoset printing have highlighted issues with structural stability under self-weight. This study addresses issues of self-weight by investigating the mechanisms that cause collapse of tall, thin printed walls. Using nanoclay- and fumed silica-filled epoxy feedstocks, this work compares the collapse height for printed walls to stability models based on yielding and buckling mechanics. Inputs for these models – shear yield stress and storage modulus – were taken directly from parallel plate rheometry measurements. Model predictions were found to be in good agreement with experimental results, where both yielding and buckling behavior were observed, provided the rheological properties after a shear excursion were used as inputs. This work establishes a direct link between basic rheological properties of the feedstock, geometry of the printed object, and achievable height. Overall, the results presented highlight the importance of understanding recovery behavior in thermoset feedstocks and provide valuable guidance on the development of more effective direct-ink writing feedstock materials.

36 MATERIALS SCIENCE↗