Engineering topics

Fettig, Rainer

Publications and source records attributed to Fettig, Rainer.

8 records

NASA NTRS2011

Programmable Aperture with MEMS Microshutter Arrays

A microshutter array (MSA) has been developed for use as an aperture array for multi-object selections in James Webb Space Telescope (JWST) technology. Light shields, molybdenum nitride (MoN) coating on shutters, and aluminum/aluminum oxide coatings on interior walls are put on each shutter for light leak prevention, and to enhance optical contrast. Individual shutters are patterned with a torsion flexure that permits shutters to open 90 deg. with a minimized mechanical stress concentration. The shutters are actuated magnetically, latched, and addressed electrostatically. Also, micromechanical features are tailored onto individual shutters to prevent stiction. An individual shutter consists of a torsion hinge, a shutter blade, a front electrode that is coated on the shutter blade, a backside electrode that is coated on the interior walls, and a magnetic cobalt-iron coating. The magnetic coating is patterned into stripes on microshutters so that shutters can respond to an external magnetic field for the magnetic actuation. A set of column electrodes is placed on top of shutters, and a set of row electrodes on sidewalls is underneath the shutters so that they can be electrostatically latched open. A linear permanent magnet is aligned with the shutter rows and is positioned above a flipped upside-down array, and sweeps across the array in a direction parallel to shutter columns. As the magnet sweeps across the array, sequential rows of shutters are rotated from their natural horizontal orientation to a vertical open position, where they approach vertical electrodes on the sidewalls. When the electrodes are biased with a sufficient electrostatic force to overcome the mechanical restoring force of torsion bars, shutters remain latched to vertical electrodes in their open state. When the bias is removed, or is insufficient, the shutters return to their horizontal, closed positions. To release a shutter, both the electrode on the shutter and the one on the back wall where the shutter sits are grounded. The shutters with one or both ungrounded electrodes are held open. Sub-micron bumps underneath light shields and silicon ribs on back walls are the two features to prevent stiction. These features ensure that the microshutter array functions properly in mechanical motions. The MSA technology can be used primarily in multi-object imaging and spectroscopy, photomask generation, light switches, and in the stepper equipment used to make integrated circuits and MEMS (microelectromechanical systems) devices.

Moseley, Samuel↗

NASA NTRS2006

Fabrication of MEMS Microshutter Arrays for Cryogenic Applications

Two-dimensional MEMS microshutter arrays are being developed for use as a high contrast field selector for the Near Infrared Spectrograph (NIRSpec) on the James Webb Space Telescope (JWST). We present details of microshutter array fabrication and give results of work done to optimize the flatness of microshutter elements through film stress control for both room temperature and cryogenic (35K) operation.

Denis Kevin↗

NASA NTRS2004

In-flight Far-Infrared Performance of the CIRS Instrument on Cassini

The Composite Infrared Spectrometer (CIRS) on-board Cassini consists of two interferometers: a conventional Michelson for the mid-infrared; and a Martin-Puplett type in the far-infrared employing wire grid polarizers to split, recombine and analyze the radiation. The far-IR focal plane (FP1) assembly uses two thermopile detectors to measure the final transmitted and reflected beams at the polarizer-analyzer: if one fails, the interferometer can still operate, albeit with a lower efficiency. The combined effect is for good response from 10 to 300/cm, and declining response to 600/cm. This paper will examine in-flight performance of the far-IR interferometer, including NESR and response. Regular noise spikes, resulting from pickup from other electrical sub-systems has been found on the CIRS interferograms, and the removal of these effects is discussed. The radiometric calibration is described, and then we show how the calibration was applied to science data taken during the Jupiter flyby of December 2000. Finally, we discuss signal-to-noise on the calibrated spectra, emphasizing limitations of the current instrument and the potential for improvement in future missions.

Nixon, Conor A.↗

NASA NTRS2004

Microshutter Arrays for James Webb Space Telescope

Two-dimensional MEMS microshutter arrays are being developed at NASA Goddard Space Flight Center for use in the near-infrared region on the James Webb Space Telescope (JWST). The microshutter arrays are designed for the selective transmission of light with high efficiency and high contrast. The JWST environment requires cryogenic operation at 35K. Microshutter arrays are fabricated out of silicon-oxide-insulated (SOI) silicon wafers. Arrays are close-packed silicon nitride membranes with a pixel size of 100x200 p. Individual shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. The mechanical shutter arrays are fabricated using MEMS technologies. The processing includes a multi- layer metal deposition and patterning of shutter electrodes and magnetic pads, reactive ion etching (NE) of the front side to form shutters out of the nitride membrane, an anisotropic back-etch for wafer thinning, followed by a deep RIE (DRIE) back-etch down to the nitride shutter membrane to form W e s and relieve shutters from the silicon substrate. An additional metal deposition and patterning is used to form back electrodes. Shutters are actuated using a magnetic force and latched using an electrostatic force. . . . KEYWORDS: microshutter, MEMS, RIE, DRIE, micro-optics, near inbred, space telescope

Li, Mary J.↗

NASA NTRS2001

Microshutter Array Development for the Multi-Object Spectrograph for the New Generation Space Telescope, and Its Ground-based Demonstrator

The 6.5-m NASA/ESA/Canada New Generation Space Telescope to be operated at the L2 Lagrangian point will require a multi-object spectrograph (MOS) operating from 1 to 5 microns. Up to 3000 targets will be selected for simultaneous spectroscopy using a programmable cryogenic (approx. 35K) aperture array, consisting of a mosaic of arrays of micromirrors or microshutters. We describe the current status of the GSFC microshutter array development. The 100 micron square shutters are opened magnetically and latched open or closed electrostatically. Selection will be by two crossed one-dimensional addressing circuits. We will demonstrate the use of a 512 x 512 unit array on a ground-based IR MOS which will cover 0.6 to 5 microns, and operate rapidly to include spectroscopy of gamma ray burst afterglows.

Woodgate, Bruce E.↗

NASA NTRS1999

Broadband Infrared Antireflection Structured Silicon Surfaces

Silicon and germanium are materials often used for IR windows and optical elements. However they have a very high index of refraction, in the order of three to four, which causes large reflection losses on each surface. These losses are especially high under large angles of incidence which are often desirable if signals are faint and fast optics are to be used. Solid antireflection coatings are either not available because materials with appropriate index of refraction do not exist, or their use is limited to a small wavelength range and small angles of incidence. We will present the status of our work to calculate, create, and test the performance of graded structures in Si to reduce its surface reflection. The structures are expected to work over the very broad wavelength range of 10 to 1000 micrometers and a wide range of angle of incidence. We have identified several high aspect ratio MEMS process techniques to Create the structures and have done 3D electromagnetic modeling, which predicts significant effects. Measurements on different samples have validated our modeling.

Stewart, Kenneth↗

NASA NTRS1999

Broadband Infrared Antireflection Structured Silicon Surfaces

Silicon and germanium are materials often used for infrared (IR) windows and optical elements. However they have a very high index of refraction, in the order of three to four, which causes large reflection losses on each surface. These losses are especially high under large angles of incidence which are often desirable if signals are faint and fast optics are to be used. Solid antireflection coatings are either not available because materials with appropriate index of refraction do not exist, or their use is limited to a small wavelength range and small angles of incidence. We will present the status of our work to calculate, create, and test the performance of graded structures in Si to reduce its surface reflection. The structures are expected to work over the very broad wavelength range of 10 micron to 1000 micron and a wide range of angle of incidence. We.have identified several high aspect ratio MEMS process techniques to create the structures and have done 3D electromagnetic modeling, which predicts significant effects. Measurements on different samples have validated our modeling.

Stewart, Kenneth↗

NASA NTRS1998

Broadband Infrared Antireflection Structured Silicon Surfaces

Silicon and germanium are materials often used for IR windows and optical elements. However they have a very high index of refraction, in the order of three to four, which causes large reflection losses on each surface. These losses are especially high under large angles of incidence which are often desirable if signals are faint and fast optics are to be used. Solid antireflection coatings are either not available because materials with appropriate index of refraction do not exist, or their use is limited to a small wavelength range and small angles of incidence. We will present the status of our work to calculate, create, and test the performance of graded structures in Si to reduce its surface reflection. The structures are expected to work over the very broad wavelength range of 10 microns to 1000 microns and a wide range of angle of incidence. We have identified several high aspect ratio MEMS process techniques to create the structures and have done 3D electromagnetic modeling, which predicts significant effects. Measurements on different samples have validated our modeling.

Stewart, Kenneth↗