American National Aeronautics and Space Administration (NASA) research in high density packaging reliability
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Engineering topics
Publications and source records attributed to Galbraith, L..
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The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
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This roadmap introduces current technologies, related strategic issues, and research reccomendations for space applications.
This roadmap introduces current technologies in use, related strategic issues and trends, and research recommendations for space applications.
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A roadmap giving technology forecasts and recommendations for research direction for advanced electronic interconnection technology for space applications is presented.
There is a relationship between, defects, failure mechanisms and quality assurance. Methods to design for producibility and reliability are given for low-volume applications.
We describe a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs. In cases where the entire volume for fabrication is less than five products, traditional Statistical Process Control (SPC) is inadequate due to reliance on statistics of much larger volumes and the Central Limit Theorem. Data acquisition for process parameter estimation from such a small sample size is difficult; however, it is critical to producing high reliability product.
There is a need for high reliability surface mount assembly processes for aerospace, military, and medical applications. This approach for improving design for producibility and reliability of electronic system assembly processes can be utilized as a starting framework. Described herein is a general methodology to Design for Producibility and Reliability (DFPAR) for very small volume production runs.