NASA NTRS · 20060030419
Microelectronics packaging research directions for aerospace applications
Abstract
The Roadmap begins with an assessment of needs from the microelectronics for aerospace applications viewpoint. Needs Assessment is divided into materials, packaging components, and radiation characterization of packaging.
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Galbraith, L.. 2003-02-18. Microelectronics packaging research directions for aerospace applications. https://ntrs.nasa.gov/citations/20060030419
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