Engineering topics

Hergenrother, P. M.

Publications and source records attributed to Hergenrother, P. M..

At least 37 records · Page 2

NASA NTRS1991

Imide/arylene ether copolymers. I

The preparation of a series of novel imide/arylene ether copolymers is described together with the results of viscosity and DSC Tg(Tm) measurements. The copolymers were synthesized from an arylene ether block and either an amorphous or semicrystalline imide block. One block copolymer was end-capped, and the molecular weight was controlled to improve compression moldability. The paper also presents results of mechanical properties tests on copolymer samples.

Jensen, B. J.↗

NASA NTRS1991

Recent developments in high temperature organic polymers

Developments in high temperature organic polymers during the last 5 years with major emphasis on polyimides and poly(arylene ether)s are discussed. Specific polymers or series of polymers have been selected to demonstrate unique properties or the effect chemical structure has upon certain properties. This article is not intended to be a comprehensive review of high temperature polymer advancements during the last 5 years.

Hergenrother, P. M.↗

NASA NTRS1990

Polyamideimides containing carbonyl and ether connecting groups

Polyamidenimides were prepared from the reaction of trimellitic anhydride chloride with seven diamines containing carbonyl and ether groups between the aromatic rings. Several of these polyamideimides were semicrystalline as evidenced by wide-angle X-ray diffraction and differential scanning calorimetry. Glass transition temperatures ranged between 187 and 245 C, and crystalline transition temperatures ranged between 317 and 416 C. A series of copolyamideimides from a mixture of 1,3-bis(4-aminophenoxy 4-prime-benzoyl) benzene and 1,4-bis(4-aminophenoxy 4-prime-benzoyl)benzene were similarly prepared. These copolyamideimides were semicrystalline and formed tough, solvent resistant films with good tensile properties.

Havens, S. J.↗

NASA NTRS1990

Chemistry and properties of new poly(arylene ether imidazoles)

As part of a program to develop high-temperature high-performance structural resins for aerospace applications, the chemistry and properties of new poly(arylene ether imidazoles) were investigated. The polymers were prepared by the nucleophilic displacement reaction of aromatic bis(imidazolephenols) with activated aromatic difluoro compounds. The amorphous thermoplastic polymers exhibited glass transition temperatures from 230 to 301 C, inherent viscosities from 0.46 to 1.46 dL/g, and number-average molecular weights as high as 59,300 g/mole. The polymers exhibit good toughness, adhesive, composite, and film properties. The chemical, physical, and mechanical properties of these materials are discussed.

Connell, J. W.↗

NASA NTRS1990

Functionalized poly(arylene ethers) as toughness modifiers for bismaleimides

A family of novel, low molecular weight functionalized poly(arylene ether) resins has been investigated to ascertain its members' toughness-imparting contribution to neat bismaleimide (BMI) resin and BMI-matrix laminate composite properties. Attention is given to the contribution of the reactive poly(arylene ether)'s backbone chemistry to fracture toughness, as well as to the comparative influence of high and low molecular weight reactive poly(arylene ether) types on the modified BMI resin systems. The modified BMIs possess a polyphase morphology, with good adhesion between the thermoplastic nodules and the host thermoset systems.

Stenzenberger, H. D.↗

NASA NTRS1989

Condensation polyimides

Polyimides belong to a class of polymers known as polyheterocyclics. Unlike most other high temperature polymers, polyimides can be prepared from a variety of inexpensive monomers by several synthetic routes. The glass transition and crystalline melt temperature, thermooxidative stability, toughness, dielectric constant, coefficient of thermal expansion, chemical stability, mechanical performance, etc. of polyimides can be controlled within certain boundaries. This versatility has permitted the development of various forms of polyimides. These include adhesives, composite matrices, coatings, films, moldings, fibers, foams and membranes. Polyimides are synthesized through both condensation (step-polymerization) and addition (chain growth polymerization) routes. The precursor materials used in addition polyimides or imide oligomers are prepared by condensation method. High molecular weight polyimide made via polycondensation or step-growth polymerization is studied. The various synthetic routes to condensation polyimides, structure/property relationships of condensation polyimides and composite properties of condensation polyimides are all studied. The focus is on the synthesis and chemical structure/property relationships of polyimides with particular emphasis on materials for composite application.

Hergenrother, P. M.↗

NASA NTRS1989

Polyimides containing carbonyl and ether connecting groups - II

In a study of polyimides containing carbonyl and ether connecting groups between aromatic rings, several new polyimides were prepared and characterized. A few of these polymers were semicrystalline. Glass transition temperatures ranged from 164 to 258 C, and crystalline melt temperatures were observed between 350 and 424 C. The semicrystalline polyimide from the reaction of 3.3',4,4'-benzophenonetetracarboxylic dianhydride and 1,3-bis(4-aminophenoxy-4'-benzoyl)benzene provided transparent orange films with excellent tensile properties, exceptional resistance to solvents and strong base, and high thermooxidative stability. In addition, this polyimide provided excellent adhesive strength for joining titanium (6Al-4V) to titanium.

Hergenrother, P. M.↗

NASA NTRS1989

LARC-CPI, a new semi-crystalline polyimide

As part of a program on high performance/high temperature structural resins for aerospace applications, work was performed with a new semi-crystalline polyimide (LARC-CPI) to improve the compression moldability while retaining high mechanical properties and thermooxidative stability. Various molecular weight versions of LARC-CPI polyamide acid were prepared, end-capped with different groups, converted to polyimide and evaluated for film properties, thermooxidative stability and melt flow. One controlled molecular weight, end-capped version of LARC-CPI was evaluated more comprehensively in adhesive and composite work and exhibited good compression moldability, reasonable crystallization rates and high mechanical properties.

Hergenrother, P. M.↗

NASA NTRS1989

Tough poly(arylene ether) thermoplastics as modifiers for bismaleimides

Several aspects of research on thermoplastics as toughness modifiers are discussed, including the contribution of the backbone chemistry and the concentration of the poly(arylene ether) thermoplastic to fracture toughness, influence of the molecular weight of the poly(arylene ether) thermoplastic on neat resin fracture toughness, and the morphology of the thermoplastic modified networks. The results show that fracture toughness of brittle bismaleimide resins can be improved significantly with poly(arylene ether) thermoplastic levels of 20 percent by weight, and that high molecular weight poly(arylene ether) based on bisphenol A provides the highest degree of toughening. Preliminary composite evaluation shows that improvements in neat resin toughness translate into carbon fabric composite.

Stenzenberger, H. D.↗

NASA NTRS1989

Interpenetrating polymer networks from acetylene terminated materials

As part of a program to develop high temperature/high performance structural resins for aerospace applications, the chemistry and properties of a novel class of interpenetrating polymer networks (IPNs) were investigated. These IPNs consist of a simple diacetylenic compound (aspartimide) blended with an acetylene terminated arylene ether oligomer. Various compositional blends were prepared and thermally cured to evaluate the effect of crosslink density on resin properties. The cured IPNs exhibited glass transition temperatures ranging from 197 to 254 C depending upon the composition and cure temperature. The solvent resistance, fracture toughness and coefficient of thermal expansion of the cured blends were related to the crosslink density. Isothermal aging of neat resin moldings, adhesive and composite specimens showed a postcure effect which resulted in improved elevated temperature properties. The chemistry, physical and mechanical properties of these materials will be discussed.

Connell, J. W.↗

NASA NTRS1988

Blends of an ethynyl terminated imidothioether with ethynyl terminated arylene ether oligomers

An evaluation has been undertaken of blends of a novel ethynyl-terminated imidothioether with Udel P1700 polysulfone and ethynyl-terminated arylene ether oligomers. Good to excellent processability was obtained with these blends using compression molding; the cured blends displayed poor-to-good resistance to chloroform and low-to-moderately high fracture toughness, depending on the blends' crosslink density. The flexural strength and modulus of unidirectional carbon graphite laminates prepared with the blended resins were good.

Connell, J. W.↗

NASA NTRS1988

Adhesive properties of LARC-CPI, a new semi-crystalline polyimide

As part of an effort on high temperature structural resins for aerospace applications, a new family of polyimides containing carbon and ether connecting groups between aromatic rings were prepared. Several of these polyimides were semicrystalline. One polyimide, designated LARC-CPI, with a glass transition temperature of 222 C and a crystalline melt temperature of 350 C, was evaluated in the form of an adhesive, film, and molding. Unoriented films exhibited excellent resistance to solvents and strong bases and high tensile properties. Compact tension specimens gave very high fracture toughness values. Titanium tensile shear specimens provided exceptional strength under a variety of test conditions. The chemistry and the physical and mechanical properties of LARC-CPI are discussed.

Hergenrother, P. M.↗

NASA NTRS1987

Adhesive properties of a semi-crystalline polyimide

Adhesive and film properties of a new semi-crystalline polyimide, designated LARC-CPI, having a glass transition temperature of 222 C and a crystalline melt temperature of 350 C are presented. The films exhibited excellent resistance to solvents and strong base. Compact tension specimens from LARC-CPI moldings displayed a fracture energy of 37.8 lb/sq in. Titanium tensile shear specimens gave strengths of 6250 psi initially at 25 C, 7120 psi at 25 C after 1000 hours at 232 C, 2800 psi at 232 C after annealing for 5 hours at 300 C, and 3670 psi at 232 C after 100 hours at 316 C in air.

Hergenrother, P. M.↗

NASA NTRS1987

A new readily processable polyimide

As part of an effort to develop tough solvent resistance thermoplastics for potential use as structural resins on aerospace vehicles, a new processable polyimide was evaluated. The synthesis involved the reaction of a new diamine, 1,3-bis 2-(3-aminophenoxy)ethyl ether, with 3,3',4,4'-benzophenonetetracarboxylic dianhydride to form the polyamic acid and subsequent conversion of it to the polyimide. Various physical properties such as thermal stability, solvent resistance, glass transition temperature, crystalline melt temperature, melt viscosity and mechanical properties such as fracture toughness, adhesive, film and composite properties are reported. Of particular interest is the extremely high titanium to titanium tensile shear strength obtained for this polyimide.

Harris, F. W.↗

NASA NTRS1986

The 5-(4-Ethynylophenoxy) isophthalic chloride

Sulfone-ester polymers containing pendent ethynyl groups and a direct and multistep process for preparing them are disclosed. The multistep process involves the conversion of a pendent bromo group to the ethynyl group while the direct route involves reating hydroxy-terminated sulfone oligomer or polymers with a stoichiometric amount of 5-(4-ethynylphenoxy) isophthaloyl chloride. The 5-(4-ethynylphenoxy) isophthaloyl chloride and the process for preparing it are also disclosed.

Hergenrother, P. M.↗

NASA NTRS1986

Sulfone/Ester Polymers Containing Pendent Ethynyl Groups

Two processes make high-performance polymers resistant to solvents, without compromising mechanical characteristics. Polymers show improved solvent resistance while retaining high toughness, thermoformability, and mechanical performance. Multistep process involves conversion of pendent bromo group to ethynyl group, while direct process involves reacting hydroxy-terminated sulfone oligomers or polymers with stoichiometric amount of 5-(4-ethynylphenoxy) isophthaloyl chloride. Applications for new polymers include adhesives, composite resin matrices, moldings, ultrafiltration membranes, protective coatings, and such electrical insulators as thin films for microelectronic circuitry.

Hergenrother, P. M.↗

NASA NTRS1986

Polyarylene Ethers with Improved Properties

This invention relates to novel polyarylene ethers which possess the combination of high strength, toughness, and high use temperature with ease of extrusion and formation into complex objects. These polyarylene ethers are suitable for use in adhesives, coatings, films, membranes, and composite matrices. The polyarylene ethers of this invention are the polycondensation products from the reaction of either 1,3-bis (4-chloro or fluorobenzoyl) benzene with any one of the following bisphenolic compounds: bis (3-hydroxyphenyl) methane; bis (4-hydroxyphenyl) methane; 1,1-dimethyl-bis (4-hydroxyphenyl)methane, or 9,9-bis (4-hydroxyphenyl) fluorene. Random and block copolymers are also comprehended.

Hergenrother, P. M.↗

NASA NTRS1986

Phenoxy Resins Containing Pendent Ethynyl Groups

Ethynyl-containing phenoxy resins have excellent shelf life in solution or in bulk. Cured ethynyl-containing phenoxy resins offer lower moisture absorption, higher use temperatures, and better thermal stability over stateof-the-art cross-linked phenoxy resins. Depending upon cross-link density, cured ethynyl-modified phenoxy resins are solvent resistant but still thermoformable and relatively tough. Modified resins show potential for use as adhesives, composite matrices, solvent-resistant coatings, membranes, insulators, and films.

Hergenrother, P. M.↗