Engineering topics
Publications and source records attributed to Hergenrother, P. M..
Ethynyl and substituted ethynyl-terminated polysulfones and their synthesis are disclosed. These polysulfones are thermally cured to induce cross-linking and chain extension, producing a polymer system with improved solvent resistance and use temperatures. Also disclosed are substituted 4-ethynylbenzoyl chlorides as precursors to the substituted ethynyl-terminated polysulfones and a process for preparing the same.
As part of an effort to develop tough solvent resistance thermoplastics for potential use as structural resins on aerospace vehicles, a new processable polyimide was evaluated. The synthesis involved the reaction of a new diamine, 1,3-bis 2-(3-aminophenoxy)ethyl ether, with 3,3',4,4'-benzophenonetetracarboxylic dianhydride to form the polyamic acid and subsequent conversion of it to the polyimide. Various physical properties such as thermal stability, solvent resistance, glass transition temperature, crystalline melt temperature, melt viscosity and mechanical properties such as fracture toughness, adhesive, film and composite properties are reported. Of particular interest is the extremely high titanium to titanium tensile shear strength obtained for this polyimide.
The development of new composite resins for various aerospace applications is attempted. Although it is highly desirable that these polymers be soluble in order to facilitate processing, they must display considerable solvent-resistance in use. A recent approach has involved the synthesis of a new series of polyimides containing flexible linkages. The polymers were prepared by the polymerization of aromatic dianhydrides with diamines containing oxyethylene linkages. For example, the polymerization of 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) with 1,2-bis(4-aminophenoxy)ethane (1a) and bis2-(4-aminophenoxy)ethylether (lb), afforded highly crystalline polyimides that were completely insoluble. However, a polyimide that was amorphous and soluble was obtained from the polymerization of BTDA and an isomer of lb, i.e., bis2-(3-aminophenoxy)ethyl ether (4b). In an attempt to obtain a soluble, amorphous polyimide that could be annealed into a crysalline state, block copolymers of 1b and 4b and BTDA were prepared. Copolymers containing less than 20 weight % 1b were soluble in organic solvents. However, these polymers did not crystallize when heated above their Tg's. Copolymers containing higher levels of 1b were semicrystalline and insoluble. The polymerization of the diamines containing oxyethylene linkages with 4,4'-oxydiphthalic anhydride (ODPA) and a new dianhydride, i.e., 4,4'-oxyethyleneoxyethyleneoxydiphthalic anhydride (OEDA) was investigated. It was postulated that the use of these more flexible dianhydrides would result in more processable polyimides.
A series of new polyarylene ethers (PAEs) were prepared from the reaction of activated dihalo compounds with various bisphenols. Measured number average molecular weights for the PAEs ranged from 13,500 to 39,400 g/mole, and glass transition temperatures varied from 152 to 280 C. Ethynyl-terminated polyarylene ethers (ETPAEs) were also prepared by endcapping hydroxy-terminated polyarylene ethers with 4-ethynylbenzoyl chloride. Structure/property relationships for the PAEs, and the advantages offered by the ETPAEs, are discussed.
Polyesters of various molecular weights terminated with ethynyl groups. As ethynyl-terminated polyesters are exposed to elevated temperatures, thermally induced reaction of ethynyl groups occurs to provide cross-linking and chain extension. Reaction raises use temperature of polymer and greatly improves resistance to solvents. New materials produced by this process potentially useful as adhesives, composite matrices, solvent-resistant coatings, membranes, and films.
Phenoxy resins containing pendent ethynyl groups, the process for preparing the same, and the cured resin products obtained therefrom are disclosed. Upon the application of heat, the ethynyl groups react to provide branching and crosslinking with the cure temperature being lowered by using a catalyst if desired but not required. The cured phenoxy resins containing pendent ethynyl groups have improved solvent resistance and higher use temperature than linear uncrosslinked phenoxy resins and are applicable for use as coatings, films, adhesives, composited matrices and molding compounds.
The following approaches improved the solvent resistance and raised the Tg of thermoplastics: end-capping aligomers with ethynyl groups; incorporating ethynyl groups pendent along the polymer chain; and correcting polymers containing pendent ethynyl groups with a low molecular weight diethynyl compound. The following conclusions were reached: (1) film and composite properties off an ethynyl-terminated sulfone were better than those of UDEL (trademark); (2) fracture energy of an ethynyl-terminated sulfone was lower than that of UDEL (trademark); (3) residual palladium in the cured ethynyl-terminated sulfone lower the thermooxidative stability of the cured resin; (4) the properties of a phenoxy resin were altered considerably by placing pendent ethynyl groups along the polymer chain; and (5) property trade-offs must be considered when thermoplastics are modified via reactant groups.
In order to improve solvent resistance of aromatic thermoplastic polymers, ethynyl-terminated aromatic sulfone polymers (ETS), sulfone/ester polymers (SEPE) containing pendent ethynyl groups, and phenoxy resin containing pendent ethynyl groups are synthesized. Cured polysulfones and phenoxy resins containing ethynyl groups on the ends or pendent on the molecules exhibited systematic behavior in solvent resistance, film flexibility, and toughness as a function of crosslink density. The film and composite properties of a cured solvent-resistant ETS were better than those of a commercially available solvent sensitive polysulfone. The study was part of a NASA program to better understand the trade-offs between solvent resistance, processability and mechanical properties which may be useful in designing composite structures for aerospace vehicles.
Ethynyl and substituted ethynyl-terminated polysulfones and a process for preparing the same are disclosed. These polysulfones are thermally cured to induce cross-linking and chain extension, producing a polymer system with improved solvent resistance and use temperature. Also disclosed are substituted 4-ethynylbenzoyl chlorides as precursors to the substituted ethynyl-terminated polysulfones and a process for preparing the same.
As part of an effort on tougher/solvent resistant matrix resins for composites, research was directed towards exploring methods to improve the solvent resistance of linear amorphous thermoplastics. Ethyl reactive groups were placed on the ends of oligomers and pendent along the polymer chain and subsequently thermally reacted to provide crosslinking and thus improvement in solvent resistance. This concept is extended to another thermoplastic, a phenoxy resin. A commercially available phenoxy resin (PKHH) was systematically modified by reaction of the pendent hydroxyl groups on the phenoxy resin with various amounts of 4-ethynylbenzoyl chloride. As the pendent ethynyl group content in the phenoxy resin increased, the cured resin exhibited a higher glass transition temperature, better solvent resistance and less flexibility. The solvent resistance was further improved by correcting a low molecular weight diethynyl compound, 2,2-bis(4-ethynylbenzoyloxy-4'-phenyl)propane, with a phenoxy resin containing pendent ethynyl groups.
Hydroxy-terminated polyarylates (HTPA) with number-average molecular weights of approximately 2500, 5000, 7500, and 10,000 were synthesized and converted to corresponding 4-ethynylbenzoyloxy-terminated polyarylates (ETPA) by reaction with 4-ethynylbenzoyl chloride. The terminal ethynyl groups were thermally reacted to provide chain extension and crosslinking. The cured ETPA exhibited higher glass transition temperatures (Tg) and better solvent resistance than a high molecular weight linear polyarylate. Solvent resistance was further improved by curing 2,2-bis(4-ethynylbenzoyloxy-4-prime-phenyl) propane, a coreactant, with ETPA at concentrations of approximately 10 percent (w/w).
The status of high temperature organic adhesives is reviewed. These materials are defined by having usable adhesive properties at temperatures ranging from 232 C (after hundreds of hours at 232 C) to 538 C (after a few minutes at 538 C). The search for high temperature adhesives began in the 1960s, primarily under government funding. Since then, many high temperature polymers have undergone evaluation as adhesives. In spite of this effort, only a few are commercially available because of an elusive market and an unfavorable combination of price, processability and performance. The principal adhesives to be discussed will be addition and condensation polyimides, polyquinoxalines, polybenzimidazoles, and addition, condensation, and cross-linked polyphenylquinoxalines. The synthesis, processability, adhesive performance, and availabiity of these materials are addressed.
Polysulfones terminated with trimethylsilylethynyl, ethynyl, and phenylethynyl groups increased solvent resistance. Upon application of heat, with or without catalyst, end groups react to provide cross linking and chain extension. Result: temperature of polymer increased, more importantly, solvent resistance greatly improved. Solutions used conveniently for preparation of films, coatings, membranes, prepreg, and adhesive tapes.
Poly(phenylquinoxaline) prepolymers containing pendant phenylethynyl and ethynyl groups are disclosed along with the process for forming these polymers. Monomers and the process for producing same that are employed to prepare the polymers are also disclosed.
Polyphenylquinoxalines (PPQ's) containing cross-linking groups have higher use temperature and solvent resistance. As polymers are exposed to elevated temperatures, thermally induced reaction of pendent groups occurs to provide cross-linking, which raises use temperature of polymer and improves solvent resistance.
A series of acetylene-terminated phenylquinoxaline (ATPQ) oligomers of various molecular weights were prepared and subsequently chain extended by the thermally induced reaction of the ethynyl groups. The processability and thermal properties of these oligomers and their cured resins were compared with that of a relatively high molecular weight linear polyphenylquinoxaline (PPQ) with the same chemical backbone. The ATPQ oligomers exhibited significantly better processability than the linear PPQ but the PPQ displayed substantially better thermooxidative stability. Adhesive (Ti/Ti) and composite (graphite filament reinforcement) work was performed to evaluate the potential of these materials for structural applications. The PPQ exhibited better retention of adhesive and laminate properties than the ATPQ resins at 260 C after aging for 500 hr at 260 C in circulating air.
The synthesis of high molecular weight linear poly(phenylquinoxalines) containing pendant ethynyl groups is reported, where thermally-induced reactions of the ethynyl groups provided insoluble, cross-linked polymers with high glass transition temperatures. The ethynyl-containing polymer exhibited fair to poor processability by compression molding due to the thermal reaction of the ethynyl groups, which inhibited polymer flow, depending on ethynyl density. This class of polymers is not expected to be useful as laminating resins or adhesives, due to the processing difficulties. Use for them may be found, however, as solvents and corrosion-resistant high-temperature coatings.
Three ethynyl substituted phenylphthalimides were prepared and characterized by high pressure liquid chromatography, differential scanning calorimetry, and mass spectroscopy. When the preparation of N-(4-ethynylphenyl)phthalimide was attempted by the thermal cyclodehydration of N-(4-ethynylphenyl)-2-carboxybenzamide, N-(4-acetylphenyl)phthalimide was obtained as the major component. This unusual hydration of an ethynyl group was investigated and a mechanism was proposed to explain it.