Engineering topics

Kinser, D. L.

Publications and source records attributed to Kinser, D. L..

16 records

NASA NTRS1992

Elastic modulus measurements of LDEF glasses and glass-ceramics using a speckle technique

Elastic moduli of five glass types and the glass-ceramic Zerodur, exposed to a near-earth orbit environment on the Long Duration Exposure Facility (LDEF), were compared to that of unexposed samples. A double exposure speckle photography technique utilizing 633 nm laser light was used in the production of the speckle pattern. Subsequent illumination of a double exposed negative using the same wavelength radiation produces Young's fringes from which the in-plane displacements are measured. Stresses imposed by compressive loading produced measurable strains in the glasses and glass-ceramic.

Wiedlocher, D. E.↗

NASA NTRS1985

Gamma radiation effects on the dynamic fatigue measurements of glass discs

Circular specimens of low iron soda lime silicate glass were blasted with grit after having a circular notch etched into their centers. After separation into two groups, one group was exposed to gamma radiation. The fracture strengths of all samples were then tested by the biaxial technique, i.e., specimens were balanced on three balls and loaded in the center by a piston. The irradiated samples had received a 140,000 Gy dose from a Co-60 source. An enhanced interaction between the ambient moisture and the grit-blasted central notch was observed in the irradiated samples, which displayed accelerated corrosion.

Ananaba, T. O. J.↗

NASA NTRS1984

Effects of solar radiation on glasses

The effects of solar radiation and space environment on glasses in space flight by exposing glass specimens to the space environment was determined. The occurrence of optical, mechanical, and chemical property changes was analyzed. The property changes of samples receiving differing cumulative solar radiation exposure are compared.

Nichols, R. L.↗

NASA NTRS1980

Coatings for hybrid microcircuits

Silicone or parylene coatings protect circuits from damage by battery of military standard tests. PIND (Partical Impact Noise Detection) test proved unreliable in predicting failure for either coated or uncoated circuits.

Kinser, D. L.↗

NASA NTRS1979

Contamination control in hybrid microcircuit modules

The influence of chemical and particulate contamination upon the reliability and service life of hybrid microelectronic systems is documented. Several coating systems used include the parylene and Dow Corning silicone (DC90-711). These passivating coatings have potential for decreasing the degradation caused by particulate contaminants in hybrid systems as well as the possible deleterious effect of trapping chemical contaminants which have long term degrading influences upon the performance of the system. The reliability of a representative hybrid microcircuit is enhanced by the coating process.

Kinser, D. L.↗

NASA NTRS1977

Study of diffusion coefficients of glasses under Zero-G

A diffusion experiment for glasses was formulated, such theoretical and earth bound results as were available were outlined, and the preliminary earth based experimental work in preparation for a weightless experiment was done. The fundamental premise of the work was that diffusion studies of the glass forming ion can be conducted in zero-g environments, and diffusion data obtained from these experiments are unique and valuable because of earth based experimental difficulties.

Kinser, D. L.↗

NASA NTRS1976

Discrete component bonding and thick film materials study

The bonding reliability of discrete capacitor chips bonded with solders and conductive epoxies was examined along with the thick film resistor materials consisting of iron oxide phosphate and vanadium oxide phosphates. It was concluded from the bonding reliability studies that none of the wide range of types of solders examined is capable of resisting failure during thermal cycling while the conductive epoxy gives substantially lower failure rates. The thick film resistor studies proved the feasibility of iron oxide phosphate resistor systems although some environmental sensitivity problems remain. One of these resistor compositions has inadvertently proven to be a candidate for thermistor applications because of the excellent control achieved upon the temperature coefficient of resistance. One new and potentially damaging phenomenon observed was the degradation of thick film conductors during the course of thermal cycling.

Kinser, D. L.↗

NASA NTRS1976

Reliability of hybrid microcircuit bonding

Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.

Caruso, S. V.↗

NASA NTRS1975

Discrete component bonding and thick film materials study

The results are summarized of an investigation of discrete component bonding reliability and a fundamental study of new thick film resistor materials. The component bonding study examined several types of solder bonded components with some processing variable studies to determine their influence upon bonding reliability. The bonding reliability was assessed using the thermal cycle: 15 minutes at room temperature, 15 minutes at +125 C 15 minutes at room temperature, and 15 minutes at -55 C. The thick film resistor materials examined were of the transition metal oxide-phosphate glass family with several elemental metal additions of the same transition metal. These studies were conducted by preparing a paste of the subject composition, printing, drying, and firing using both air and reducing atmospheres. The resulting resistors were examined for adherence, resistance, thermal coefficient of resistance, and voltage coefficient of resistance.

Kinser, D. L.↗

NASA NTRS1975

The relationship between reliability and bonding techniques in hybrid microcircuits

Differential thermal expansion was shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. It is shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis was conducted of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses. It was experimentally observed that the stresses in more compliant bonding systems such as soft lead tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate was proven to be a determining factor in the prediction of failure solder systems. It was found that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Strain gage techniques were used to determine thermally induced expansion stresses of the capacitors and the alumina substrates. The compliance of the different bonding mediums was determined. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Caruso, S. V.↗

NASA NTRS1975

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. It has been experimentally observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.↗

NASA NTRS1975

Electrical resistivity surface for FeO-Fe2O3-P2O5 glasses

The dc electrical properties and microstructure of x(FeO-Fe2O3)-(100-x)P2O5 glasses were investigated up to a maximum of x = 75 mol %. Results indicate that, in general, the minimum resistivity of the glass does not occur at equal Fe(2+) and Fe(3+) concentrations, although for the special case where x = 55 mol % the minimum does occur at Fe(2+)/Fe total = 0.5, as reported by other investigators. Evidence presented shows that the position of the minimum resistivity is a function of total iron content. The minimum shifts to glasses richer in Fe(2+) at higher total iron concentrations.

Vaughan, J. G.↗

NASA NTRS1975

Study of diffusion coefficients of glasses under zero-G

Diffusion studies of the glass forming ion are examined in zero-g environments and diffusion data obtained from these experiments are unique because of earth based experimental problems. The choice of system for diffusion studies is discussed along with the lab processing. The space processing is described consisting of a heating cycle designed to maximize time exposed to the diffusion temperature without exposing the low viscosity melt to gravitational forces.

Kinser, D. L.↗

NASA NTRS1975

The relationship between reliability and bonding techniques in hybrid systems

Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses has been conducted. It has been observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. The marked dependence upon heating and cooling rate has proven to be a determining factor in the prediction of failure in both the indium and tin/lead solder systems. This study has shown that the harder or higher melting solders are less susceptible to thermal cycling effects but that they are more likely to fail during initial processing operations. Recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.

Kinser, D. L.↗

NASA NTRS1974

Capacitor bonding techniques and reliability

The effect of thermal cycling on the mechanical failure of bonded ceramic chip capacitors mounted on alumina substrates is studied. It is shown that differential thermal expansion is responsible for the cumulative effects which lead to delayed failure of the capacitors. Harder or higher melting solders are found to be less susceptible to thermal cycling effects, although they are more likely to fail during initial processing operations.

Kinser, D. L.↗

NASA NTRS1972

Thermal expansion compatibility of ceramic chip capacitors mounted on alumina substrates.

The thermal expansion coefficients of a representative sample of BaTiO3 and TiO2 ceramic chip capacitors and alumina substrates have been examined. These data have revealed large potential mechanical stresses under thermal cycling. A mathematical analysis of a composite model of the capacitor to predict the thermal expansion and modulus of elasticity and an analysis of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. In all cases studied, thermally induced stresses great enough to cause capacitor body rupture or termination failure was predicted.

Allen, R. V.↗