NASA NTRS · 19760000129
Reliability of hybrid microcircuit bonding
Abstract
Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.
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Caruso, S. V., Kinser, D. L., Graff, S. M., Allen, R. V.. 1976-03-01. Reliability of hybrid microcircuit bonding. https://ntrs.nasa.gov/citations/19760000129
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