Engineering topics
Publications and source records attributed to Leipold, M. H..
Flexure test eliminates failure-prone wafers before further processing. Probability of cracking of silicon solar cells substantially reduced by mechanical proof testing of silicon wafers before further processing, according to report. Report based on study demonstrating weak wafers eliminated by subjecting all wafers in manufacturing batch to biaxial-flexure test.
Report describes experiments on crack growth in single-crystal silicon at room temperature in air. Crack growth in (111) cleavage plane of wafers, 50 by 100 by 0.76 mm in dimension, cut from Czochralski singlecrystal silicon studied by double-torsion load-relaxation method and by acoustic-emission measurements. Scanning electron microscopy and X-ray topography also employed. Results aid in design and fabrication of silicon photovoltaic and microelectronic devices.
Crack growth in single-crystal silicon at room temperature in air was evaluated by double torsion (DT) load-relaxation method and monitored by acoustic emission (AE) technique. Both DT and AE methods indicated lack of subcritical crack growth in silicon. At the critical stress intensity factor, the crack front was found to be jumping several times in a 'mirror' region and then followed by fast crack growth in a 'hackle' region. Hackle marks were found to be associated with plastic deformation at the tip of the fast moving crack. No dislocation etch pits were found in the 'mirror' region, in which crack growth may result from interatomic bonds broken at the crack tip under stress without any plastic deformation. Acoustic emission appears to be spontaneously generated from both interatomic bonds broken and dislocation generation at the moving crack tip during the crack growth in single-crystal silicon.
The silicon material, advanced silicon sheet, device research, and process research activities are explained. There will be no new initiatives. Many activities are targeted for completion and the emphasis will then be on technology transfer. Industrial development of the fluidized-bed reactor (FBR) deposition technology is proceeding. Technology transfer and industry funding of sheet development are continuing.
Highlights of the Flat Plate Solar Array Project sponsored Silicon Ribbon Stress/Strain Workshop that was held 23 to 24 January 1985 are reported. The presentations and discussions were aimed at acquiring a generic understanding of the sources of stress, deformation, and structural characteristics occurring during the growth of silicon ribbon.
Fracture mechanics test methods were applied to evaluate the proof-test characteristics of single-crystal silicon wafers. The results indicate that the strength distribution of silicon wafers is truncated by proof-testing. No subcritical crack growth occurred during proof-loading, as inferred from the lack of a stress-rate effect on strength. Mechanical proof-testing appears to be an effective method for eliminating weak samples before cell processing.
Fracture of single crystal GaAs substrate during the solar cell processing is an important factor in solar cell yield and cost. Fracture mechanics technique was utilized to evaluate cell cracking characteristics and changes in fracture strength of GaAs solar cells in a present state-of-the-art of manufacturing process for GaAs solar cells from wafer to complete cell of a typical production line. Considerable change in the fracture strength of GaAs solar cells as a function of cell processing was found. The strength data were described by Weibull statistical analysis and can be interpreted with the change of flaw distribution of each of the manufacturing process steps.
Purity constraints for reasonable solar-cell efficiency require that silicon-ribbon growth for photovoltaics occur in a regime in which constitutional supercooling or other compositional effects on the crystallization front are not important. A major consideration in the fundamentals of crystallization is the removal of the latent heat of fusion. The direction of removal, compared with the growth direction, has a major influence on the crystallization rate and the development of localized stresses. The detailed shape of the crystallization front appears to have two forms: that required for dendritic-web growth, and that occurring in all others. After the removal of the latent heat of fusion, the thermal-mechanical behavior of all ribbons appears similar within the constraints of the exothermal gradient. The technological constraints in achieving the required thermal and mechanical conditions vary widely among the growth processes.
The efficient utilization of materials is critical to certain device applications such as silicon for photovoltaics or diodes and gallium-gadolinium-garnet for memories. A variety of slicing techniques has been investigated to minimize wafer thickness and wafer kerf. This paper presents the results of analyses of ID wafering of rotated ingots based on predicted fracture behavior of the wafer as a result of forces during wafering and the properties of the device material. The analytical model indicated that the minimum wafer thickness is controlled by the depth of surface damage and the applied cantilever force. Both of these factors should be minimized. For silicon, a minimum thickness was found to be approximately 200 x 10 - 6th m for conventional sizes of rotated ingot wafering. Fractures through the thickness of the wafer rather than through the center supporting column were found to limit the minimum wafer thickness. The model suggested that the use of a vacuum chuck on the wafer surface to enhance cleavage fracture of the center supporting core and, with silicon, by using 111-line-type ingots could have potential for reducing minimum wafer thickness.
The fracture mechanics of crystalline Si are reviewed, together with known techniques for minimizing the occurences of fracture and/or their effects. The fracture toughness (Kic) of Si varies only 10 percent from cell-to-cell and standard values have been established for different types of crystalline Si cells. A critical flaw size of 10-100 microns has been identified, and also pertains to polycrystalline materials. Chemical polishing is known to double the value of Kic, while edge rounding has no effect. Internal stresses, particularly those caused during ribbon growth, do not exceed 10 percent of Kic. External stresses are imposed by the module hardware and the ambient environment. Multiple contacts reduce the effects of cell fracture and series-parallel wiring in modules in arrays ameliorates the effects of single-cell failures. During manufacturing, maintenance of quality control and removal of sheets displaying aberrations can, depending on the costs and the implementation of the array reliability features, result in arrays delivering any desired level of reliability.
Fracture mechanics test methods are applied to evaluate the proof test characteristics of silicon Cz wafers. The results indicate that the strength distribution of silicon wafers is truncated by proof testing and no subcritical crack growth in silicon is observed during proof loading. Mechanical proof testing appears to be an effective method to eliminate weak samples before cell processing.
The distribution of slip dislocations in silicon dendritic web ribbons due to plastic deformation during the cooling phase of the growth was studied. The results show the existence of two distinguishable stress regions across the ribbon formed during the plastic deformation stage, namely, shear stress at the ribbon edges and tensile stress at the middle. In addition, slip dislocations caused by shear stress near the edges appear to originate at the twin plane.
A series of ceramic compositions based on variations in the crystal-glass ratio of a mullite body were developed. The thermal expansion of these compositions varies from 3.7 to 5.0 x 10 to the -6th/deg C to 800 C. The materials are particularly useful for applications involving silicon, in that an identical thermal expansion is available. The high-temperature creep data for the lower-expansion compositions are inferior as a result of their higher glass contents. Raw material sources and fabrication procedures for specific compositions are given.
The status of polysilicon activities is summarized highlighted by moving the silane portion of the experimental process system development unit (EPSDU) to Washougal, Washington. The completion and operation of the silane EPSDU, is discussed along with research on the silane-to-silicon deposition process. Progress on the dichlorosilane process is also reported.
Inner diameter (ID) wafering of ingot rotation reduce the ID saw blade diameter was investigated. The blade thickness can be reduced, resulting in minimal kerf loss. However, significant breakage of wafers occurs during the rotation wafering as the wafer thickness decreases. Fracture mechanics was used to develop an equation relating wafer thickness, diameter and fracture behavior at the point of fracture by using a model of a wafer, supported by a center column and subjected to a cantilever force. It is indicated that the minimum allowable wafer thickness does not increase appreciably with increasing wafer diameter and that fracture through the thickness rather than through the center supporting column limits the minimum allowable wafer thickness. It is suggested that the minimum allowable wafer thickness can be reduced by using a vacuum chuck on the wafer surface to enhance cleavage fracture of the center core and by using 111 ingots.
Earlier studies have indicated that expenditures related to the preparation of high-purity silicon and its conversion to silicon sheet represent from 40 to 52 percent of the cost of the entire panel. The present investigation is concerned with the elements which were selected for study in connection with the Flat-Plate Solar Array (FSA) Project. The first of two technologies which are being developed within the FSA Project involves the conversion of metallurgical-grade silicon through a silane purification process to silicon particles. The second is concerned with the conversion of trichlorosilane to dichlorosilane, and the subsequent production of silicon using modified rod reactors of the Siemens type. With respect to silicon sheet preparation, efforts have been focused both on the preparation of ingots, followed by wafering, and the direct crystallization of molten silicon into a ribbon or film.
One of the goals of the national photovoltaic program in the U.S. is the establishment of an industry producing photovoltaic material which can be sold at a price not exceeding $0.70/W by 1986. A key element concerning the achievement of this goal is the development and utilization of improved methods for producing silicon sheet. Specific technologies being investigated in this connection can be divided into two categories. Methods of one category are based on a utilization of sheet growth techniques including film-fed growth, dendritic web, and silicon-on-ceramic processes. The approaches used by methods of the second category involve ingot and wafering processes, including Czochralski growth, the heat exchanger method, multiblade procedures, and the use of a fixed abrasive multiwire. It is found that using $84/kg silicon, most sheet technologies would yield module prices in the $2.00/Wp to $3.00/Wp range.
Cracking of silicon solar cells and solar module transparent cover panels such as glass or polymethylmethacrylate (PMMA) is a major cause of photovoltaic solar module failure in field service. Silicon and cover materials are brittle, and cracking of these materials is expected to result from the extension of preexisting flaws under stress. Study of the cracking mechanisms is therefore an appropriate area for the application of fracture mechanics principles. In this study, fracture mechanics techniques were employed to identify the mode of crack propagation, to examine the fracture-initiating flaw, to estimate the nature and magnitude of fracture stress in the field, and to predict analytically the service lifetime. Recommendations for corrective actions are also made.