Model Validation of a Modular Foam Encapsulated Electronics Assembly With Controlled Preloads Via Additively Manufactured Silicone Lattices
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Ballance, Tanner↗
Engineering topics
Lindsey, Bryce
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Model Validation of a Modular Foam Encapsulated Electronics Assembly with Controlled Preloads Via Additively Manufactured Silicone Lattices.
Abstract not provided.
Ballance, Tanner↗