DOE OSTI · 2005729
Model Validation of a Modular Foam Encapsulated Electronics Assembly with Controlled Preloads Via Additively Manufactured Silicone Lattices.
Abstract
Abstract not provided.
Keep this discovery
Explore connections, maps & timelines
Ballance, Tanner, Lindsey, Bryce, Saraphis, Daniel, Long, Kevin, Khan, Moheimin, Kramer, Sharlotte Lorraine Bolyard, Roberts, Christine. 2022-10-01. Model Validation of a Modular Foam Encapsulated Electronics Assembly with Controlled Preloads Via Additively Manufactured Silicone Lattices.. https://doi.org/10.1007/978-3-031-36999-5_21
Cite the original work for its findings. Save a collection to share your selection of sources.