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Litant, I.

Publications and source records attributed to Litant, I..

Conductive plastics

Electrically conductive plastics fabrication and applications limitations, discussing plastic matrix materials loaded with various conductive fillers

Litant, I.

Improved method of dicing integrated circuit wafers into chips

Method employing a pressure chamber is used for dicing semiconductor single-crystal wafers, containing integrated circuits, into small chips along pre-scribed lines. Uniform bending of the scribed wafer over the convex surface of a perforated hemisphere, breaks it cleanly into individual chips without damaging the circuits.

Litant, I.