Engineering topics
Publications and source records attributed to Meyhofer, Edgar.
Substituents can strongly affect electric and thermoelectric properties of molecular junctions (MJs) by tuning quantum interference (QI) in MJs.
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Near-field radiative heat transfer (NFRHT) between planar metallic surfaces was computationally explored over five decades ago by Polder and van Hove [Phys. Rev. B 4, 3303 (1971)]. These studies predicted that, as the gap size (d) between the surfaces decreased, the radiative heat flux first increases by several orders of magnitude until d is ~100 nm after which the heat flux saturates. However, despite both the fundamental and practical importance of these predictions, the combined enhancement and saturation of NFRHT at small gaps in metallic surfaces remains experimentally unverified. Here, we probe NFRHT between planar metallic (Pt, Au) surfaces and show that RHT rates can exceed the far-field rate by over a thousand times when d is reduced to ~25 nm. More importantly, we show that for small values of d RHT saturates due to the dominant contributions from transverse electric evanescent modes. Finally, our results are in excellent agreement with the predictions of fluctuational electrodynamics and are expected to inform the development of technologies such as near-field thermophotovoltaics, radiative heat-assisted magnetic recording, and nanolithography.
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Quantifying the temperature of microdevices is critical for probing nanoscale energy transport. Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become structurally unstable and fail due to thermal stresses at elevated temperatures. Here, we show that custom-fabricated scanning thermal probes (STPs) with a sharp tip and an integrated heater/thermometer can accurately measure the temperature of microdevices held at elevated temperatures. This measurement is accomplished by introducing a modulated heat input to the STP after contacting the microdevice with the STP's tip and characterizing the DC and AC components of the STP's temperature. From these measured temperature components, the tip-to-sample thermal resistance and the microdevice surface temperature are deduced simultaneously via a simple lumped-capacitance model. The advances presented here can greatly facilitate temperature measurements of a variety of heated microdevices.