Quantifying the temperature of heated microdevices using scanning thermal probes

Abstract

Quantifying the temperature of microdevices is critical for probing nanoscale energy transport. Such quantification is often accomplished by integrating resistance thermometers into microdevices. However, such thermometers frequently become structurally unstable and fail due to thermal stresses at elevated temperatures. Here, we show that custom-fabricated scanning thermal probes (STPs) with a sharp tip and an integrated heater/thermometer can accurately measure the temperature of microdevices held at elevated temperatures. This measurement is accomplished by introducing a modulated heat input to the STP after contacting the microdevice with the STP's tip and characterizing the DC and AC components of the STP's temperature. From these measured temperature components, the tip-to-sample thermal resistance and the microdevice surface temperature are deduced simultaneously via a simple lumped-capacitance model. The advances presented here can greatly facilitate temperature measurements of a variety of heated microdevices.